Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08L - Compositions of macromolecular compounds › C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
10/2010
10/27/2010CN101870801A High-elasticity epoxy resin
10/27/2010CN101870800A Hollow carbon cloth epoxy resin composite material and preparation method thereof
10/27/2010CN101870799A Modified epoxy resin composite for strengthening concrete pole
10/27/2010CN101870798A Epoxy resin dough moulding compound and preparation method thereof
10/27/2010CN101107314B Thermoset materials with improved impact resistance
10/26/2010US7820772 comprises an amine adduct and a low-molecular amine compound 2-methylimidazole; bisphenol A type epoxy resin reacted with 2-methylimidazole as the amine adduct; excellent hardening property at low temperature, and storage stability at low and high temperature; adhesives; sealant
10/26/2010US7820760 Amphiphilic block copolymer-modified epoxy resins and adhesives made therefrom
10/26/2010US7820742 Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at 40 to 80 degrees C
10/26/2010US7820735 Ink composition for a color filter, a color filter substrate manufactured using the ink composition and method of manufacturing a color filter substrate using the ink composition
10/21/2010WO2010119960A1 Olefin resin, epoxy resin, curable resin composition, and material resulting from curing same
10/21/2010WO2010119868A1 Photosensitive polyester composition for use in forming thermally cured film
10/21/2010WO2010118527A1 Compositions comprising solvated aromatic amines and methods for the preparation thereof
10/21/2010WO2010083192A3 Epoxy resin composition
10/21/2010US20100267887 Epoxy-phenolic resins co-dispersions
10/21/2010US20100267299 Vinyl Chloride, Acrylate, And Urethane Polymers With Increased Moisture Vapor Permeability And Static Dissipative Properties
10/21/2010US20100265019 Superconducting coil cast in nanoparticle-containing sealing compound
10/21/2010US20100264034 Organic solvent free pigment dispersant for waterborne electrocoating
10/21/2010DE102010008886A1 Triple-shape memory polymer system useful in automotive applications e.g. self-repairing autobodies, comprises a first polymeric material layer, and a second polymeric material layer coupled to first polymeric material layer
10/21/2010CA2758431A1 Compositions comprising solvated aromatic amines and methods for the preparation thereof
10/20/2010CN101864151A Flame retardant resin composition for highly peel-strenghthened printed circuit board, printed circuit board using the same and manufacturing method thereof
10/20/2010CN101864150A Preparation process of putty for dry-type air-core reactor
10/20/2010CN101864149A Flame-retardant transparent high-toughness epoxy sealing resin and preparation method thereof
10/20/2010CN101864148A Method for modifying epoxy resins and method for preparing carbon fiber composite by applying modified epoxy resins
10/20/2010CN101864147A Underfill with low viscosity and low linear expansion coefficient
10/20/2010CN101864146A Epoxy resin composition for printed circuit copper-clad plate
10/20/2010CN101864145A High heat conductive insulating impregnated resin used for air reactor and preparation method thereof
10/20/2010CN101864144A Cationically and hybrid curable uv gels
10/20/2010CN101864127A Long-afterglow fluorescent powder sizing agent
10/20/2010CN101864059A Heat-resistant epoxy anhydride resin suitable for vacuum pressure impregnation (VPI) and preparing method and application thereof
10/20/2010CN101864058A Normal temperature dipping-type epoxy anhydride heat-resistant resin as well as preparation method and application thereof
10/20/2010CN101864005A Method for preparing polymer/graphene composite material
10/19/2010US7816481 Polyether polyamine agents and mixtures thereof
10/19/2010US7816430 a polycyanurate comprising a cyanatophenyl group and a phenol group, and an epoxy resin having a biphenyl structure in the molecule; printed-wiring boards for wireless communications, electronics
10/19/2010US7816420 Radiation curable low gloss powder coating compositions
10/14/2010WO2010118336A1 Diblock copolymer modified nanoparticle-polymer nanocomposites for electrical insulation
10/14/2010WO2010117081A1 Epoxy resin composite
10/14/2010WO2010116582A1 Liquid sealing resin composition, semiconductor device using liquid sealing resin composition, and method for producing same
10/14/2010US20100261846 Method for producing resin composition and molded article
10/14/2010US20100261837 Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins
10/14/2010US20100261104 Pigment-containing heat-curable composition, color filter, image-recording material, and method of producing color filter
10/14/2010US20100258983 Epoxy group-containing organosiloxane compound, curable composition for transfer materials and method for forming micropattern using the composition
10/14/2010CA2757760A1 Liquid encapsulating resin composition, semiconductor device using liquid encapsulating resin composition, and method of manufacturing the same
10/13/2010CN1803916B Resin composite and prepreg and laminate materials used thereof
10/13/2010CN1606597B Transparent composite composition
10/13/2010CN101861052A Circuit board
10/13/2010CN101418130B Weathering resistant asphalt modifier and application technology thereof
10/13/2010CN101210168B Packaging material composition
10/13/2010CN101151322B Polymeric material
10/12/2010US7812101 cationic electrodepositable coating; rosin and cardanol renewable raw material; nonhydrolyzing ester group formed with rosin; further reaction of hydroxy groups in biomass-modified epoxy resin with a diisocyante for increased molecular weight; solvent resistance, corrosion resistance, hardness; clear
10/12/2010US7811668 Epoxy resin with increased flexural impact strength and breaking extension
10/07/2010WO2010114279A2 Phosphorus-containing phenol novolac resin, hardener comprising the same and epoxy resin composition
10/07/2010WO2010112272A1 Direct overmolding
10/07/2010WO2010111921A1 Epoxy resin composition
10/07/2010WO2010077069A3 Plastic composition, and prepreg and printed circuit board using the same
10/07/2010US20100256313 Curable resin composition for molded bodies, molded body, and production method thereof
10/07/2010US20100256302 Vibration-damping reinforcement composition, vibration-damping reinforcement material, and method for vibration damping and reinforcement of thin sheet
10/07/2010US20100256261 Biaxially oriented hydrolysis-stable polyester film comprising epoxidized fatty acid derivatives and a chain extender, and process for production thereof and use thereof
10/07/2010US20100255740 Epoxy resin blend
10/07/2010US20100255315 Epoxy resin composition
10/07/2010US20100255313 One-pack type epoxy resin composition and use thereof
10/07/2010US20100253213 Latent curing agents, epoxy resin compositions containing the same, sealing materials, and organic el displays
10/06/2010EP2236549A1 Cured composite composition
10/06/2010EP2235749A1 Method of coating fine wires and curable composition therefor
10/06/2010CN1837284B Epoxy-organosilicon mixed resin composition and method for preparing same, and light-emitting semiconductor device
10/06/2010CN101851432A Resin composition and sheet containing phosphor, and light emitting element using such composition and sheet
10/06/2010CN101851411A Curable resin composition
10/06/2010CN101851397A Synthetic resin and ultraviolet photo-curing adhesive prepared by using the same
10/06/2010CN101851396A Waterborne epoxy ester resin composition and preparation method thereof and water-based paint prepared from same
10/06/2010CN101851395A Epoxy resin and production method thereof
10/06/2010CN101851394A 中空碳纤维毡环氧树脂复合材料及其制备方法 The hollow carbon fiber felt epoxy composite material and preparation method
10/06/2010CN101851393A Floating body material and manufacturing technique thereof
10/06/2010CN101851392A Epoxy resin blend
10/06/2010CN101851391A Halogen-free phosphate-free silicon-free epoxy resin composition and cover layer prepared by using same
10/06/2010CN101851390A Black halogen-free epoxy resin composition and covering film prepared from same
10/06/2010CN101851389A Thermosetting resin composition with high heat resistance and copper-clad laminate made of same
10/06/2010CN101851388A Liquid resin composition for electronic component and electronic component device
10/06/2010CN101851387A Thermosetting resin composition and cured product thereof
10/06/2010CN101851386A Epoxy resin compound
10/06/2010CN101851350A Laser mark auxiliary agent for plastic and preparation method thereof
10/06/2010CN101113229B Curing agent intermediate composition and curing agent employing the same
10/05/2010US7806979 Coating composition for protecting dazzling effect
09/2010
09/30/2010WO2010110495A1 Optical waveguide-forming epoxy resin composition, optical waveguide-forming curable film, optical-transmitting flexible printed circuit, and electronic information device
09/30/2010WO2010110407A1 Transparent composite material
09/30/2010WO2010109957A1 Epoxy resin composition, prepreg, carbon fiber reinforced composite material, and housing for electronic or electrical component
09/30/2010WO2010109861A1 Method of storing resin solution and processes for producing prepreg and laminate
09/30/2010WO2010109119A1 Method for preparing a thermosetting composite material with a high nanotube content
09/30/2010WO2010108941A1 Resin composition
09/30/2010WO2010108791A1 Use of protective colloid-stabilized polymerizates as low-profile additive (lpa)
09/30/2010US20100249323 Retardation film, method of producing the same and image display device
09/30/2010US20100249314 Chemical and Impact Resistant Thermoplastic Resin Composition Having Improved Extrudability
09/30/2010US20100249301 Ink and manufacturing method thereof
09/30/2010US20100249277 Cured composite composition
09/30/2010US20100249276 Curatives for epoxy compositions
09/30/2010US20100248137 Antireflective Coating Compositons
09/30/2010US20100247873 Ink composition, ink composition for inkjet recording, inkjet recording method, and printed article obtained by inkjet recording method
09/30/2010US20100244279 Liquid resin composition for underfill, flip-chip mounted body and method for manufacturing the same
09/30/2010US20100243962 Microencapsulated silane coupling agent
09/30/2010US20100243221 Hydrophilic coating composition and hydrophilic member using the same
09/30/2010DE102009001855A1 Verfahren zur Herstellung eines faserhaltigen Verbundwerkstoffs A process for producing a fibrous composite material
09/30/2010CA2697120A1 Cured composite composition
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