Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
06/2011
06/01/2011CN102084268A Composition for reflective film, reflective film, and X-ray detector
06/01/2011CN102083886A Primer resin for semiconductor device, and semiconductor device
06/01/2011CN102082225A Warm white LED and fluorescent powder thereof
06/01/2011CN102081992A Carbon fiber cable core
06/01/2011CN102079881A High intensity thermosetting molecule based composite material and application thereof
06/01/2011CN102079875A High-heat-resistance halogen-free phosphorus-free thermosetting resin composition, and bonding sheet and copper foil-coated laminated board made of same
06/01/2011CN102079874A Preparation method of cage-type silsesquioxane-containing low-dielectric cyanate hybrid resin
06/01/2011CN102079871A Warm-edge spacing bar material used for hollow glass and preparation method thereof
06/01/2011CN102079853A Polylactic acid nucleating agent prepared by using carbon dioxide and application thereof
06/01/2011CN102079847A Photosensitive silver slurry conductive adhesive and preparation method thereof
06/01/2011CN102079846A Inductive detection device resin-based composite material and production process thereof
06/01/2011CN102079845A Casting compound suitable for casting an electronic module, in particular a large-volume coil such as a gradient coil
06/01/2011CN102079844A Fibre-reinforced plastic material
06/01/2011CN102079843A Fibre-reinforced material
06/01/2011CN102079810A Synthesis and application of light-cured polyurethane-acrylic acid-epoxy resin adhesive
06/01/2011CN102077827A Electric heating mosquito-repellent incense fluid volatilizing mandrel general for oil and water systems
06/01/2011CN101709142B High-toughness halogen-free flame-retardanting reclaimed polycarbonate compound and preparation method thereof
06/01/2011CN101654543B Epoxy resin composition
06/01/2011CN101654496B Epoxy resin emulsifying agent and preparation method thereof
05/2011
05/31/2011US7951879 Hydroxy ester pre-extended epoxy-terminated viscosifiers and method for producing the same
05/31/2011US7951456 Two-component epoxy adhesive composition
05/26/2011WO2011063327A2 Toughened epoxy resin formulations
05/26/2011WO2011062370A2 Water-soluble, thick film epoxy resin floor finish composition
05/26/2011WO2011062248A1 Epoxy-containing ethylene copolymer and resin composition
05/26/2011WO2011062167A1 Resin composition
05/26/2011WO2011062137A1 Urethane modified polyimide based flame retardant resin composition
05/26/2011WO2011061906A1 Semiconductor device
05/26/2011WO2011061894A1 Prepreg, laminate, metal-foil-clad laminate, circuit board, and circuit board for led mounting
05/26/2011US20110124943 Encapsulating composition for the storage of waste that is toxic to health and/or the environment, which is devoid of an aromatic amine hardening agent
05/26/2011US20110124775 Resin composition for encapsulating semiconductor and semiconductor device using the same
05/26/2011US20110124256 Tackifier composition
05/26/2011US20110123723 Photosensitive resin composition and preparation method
05/26/2011US20110122590 Epoxy resin formulations for underfill applications
05/26/2011US20110122343 Pressure-sensitive adhesive composition, polarization plate, and liquid crystal display
05/26/2011US20110120761 Epoxy resin compositions
05/25/2011EP2325222A1 Fiber-reinforced polymers, epoxy-based polymeric compositions and use thereof
05/25/2011EP2324077A1 Epoxy-based composition containing copolymer
05/25/2011CN102076774A Radiation-sensitive resin composition, laminate and method for producing the same, and semiconductor device
05/25/2011CN102076756A Polymer material and method for production method thereof
05/25/2011CN102076736A Coating composition for the storage of waste that is toxic to health and/or the environment, which is free from an aromatic amine curing agent
05/25/2011CN102076735A Epoxy resin composition and prepreg using same
05/25/2011CN102070932A Wideband wave absorbing material and application thereof
05/25/2011CN102070913A Novel composite material and preparation method thereof
05/25/2011CN102070909A 阳离子改性沥青及其制备方法 Cation-modified asphalt and its preparation method
05/25/2011CN102070883A Inorganic-organic composite material and preparation method thereof
05/25/2011CN102070877A Low-intensity magnetic field-induced ordered carbon nanotube/epoxy resin composite material and preparation method thereof
05/25/2011CN102070876A Epoxy resin base polynary conductive composite material with ultra-low threshold value and preparation method thereof
05/25/2011CN102070875A Epoxy resin glue for photoelectron attenuation-resistant packaging
05/25/2011CN102070874A High-permeability and high-strength epoxy grouting material, preparation method thereof and application thereof
05/25/2011CN102070873A Environmentally-friendly flexible epoxy resin grouting material
05/25/2011CN102070842A High heat resistance low density high performance auto polypropylene composite and preparation method thereof
05/25/2011CN102070833A Filler masterbatch used for increasing polarity of polypropylene and preparation method thereof
05/25/2011CN102070770A Phosphorous epoxy resin curing agent and preparation method thereof
05/25/2011CN102070760A Method for preparing aqueous epoxy resin curing agents
05/25/2011CN101585959B Conductive polymer wave-absorbing material
05/25/2011CN101407620B High performance epoxy resins composite material and preparation thereof
05/25/2011CN101348585B Oil-water two-phase flow drag reducer
05/25/2011CN101215386B Preparation method for nylon fibre enhanced epoxy resin composite resin
05/25/2011CN101208385B Composition, treated backing, and abrasive articles containing the same
05/25/2011CN101189274B Latent curing agent
05/25/2011CN101184787B Toughened epoxy adhesive composition
05/25/2011CN101037529B Photosensitive thermosetting resin composition, flattened and resist film coated printed wiring board and method of preparing the same
05/24/2011US7947785 Polyoxazolidones derived from bisanhydrohexitols
05/24/2011US7947779 Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer
05/19/2011WO2011058756A1 Polyamide compound and epoxy resin composition containing same
05/19/2011WO2011021780A3 Composition for anisotropic conductive film
05/19/2011US20110118407 Coating composition comprising autoxidisable component
05/19/2011US20110118386 Prepreg Containing Epoxy Resin With Improved Flexural Properties
05/19/2011US20110114972 Optical semiconductor sealing resin composition and optical semiconductor device using same
05/19/2011US20110114275 Resin precursor
05/18/2011EP2321370A1 Two-part epoxy-based structural adhesives
05/18/2011EP2080773B1 Paste composition for light guide and light guide utilizing the same
05/18/2011CN1930226B Modifier for resin and resin composition using the same and formed article
05/18/2011CN1930206B Epoxy adhesive composition
05/18/2011CN102066488A Thermal interconnect and interface materials, methods of production and uses thereof
05/18/2011CN102066453A Thermosetting resin containing irradiated thermoplastic toughening agent
05/18/2011CN102066451A Hyperbranched polymers and oligomers comprising terminal amino groups as curing agents for epoxy resins
05/18/2011CN102066437A Multifunctional vinyl ether and resin composition containing same
05/18/2011CN102066254A Amorphous siliceous powder, process for production thereof, resin composition, and semiconductor encapsulation material
05/18/2011CN102061101A Carbon nano tube composite material
05/18/2011CN102061065A Photosensitive cured super resin composition for sealing liquid crystal display (LCD) and preparation method thereof
05/18/2011CN102061064A Fast curing epoxy resin system for blades of wind driven generator and preparation method thereof
05/18/2011CN102061063A Epoxy resin injecting paste material for maintenance of road engineering and preparation method thereof
05/18/2011CN102061062A Synthetic resin composition for cast-in-situ medium-voltage bus
05/18/2011CN102061061A Preparation method of exfoliated montmorillonite-epoxy resin composite
05/18/2011CN102061060A High-reliability intelligent-card encapsulating glue and preparation method thereof
05/18/2011CN102061011A Intercalator and preparation method thereof
05/18/2011CN101831138B Quick drying hand inkpad for hand model
05/18/2011CN101781427B Shape memory polymer stretchable displayer substrate and methods for preparing same
05/18/2011CN101709130B Ultra-low density solid buoyant material and manufacture method
05/18/2011CN101682999B Insulating resin composition
05/18/2011CN101614182B Wind power generation unit blade reinforced with needle fiber and fabrication process thereof
05/18/2011CN101353442B Waste printed circuit board composite non-metal powder modifying agent and preparation thereof
05/18/2011CN101351501B Epoxy resin composition
05/18/2011CN101108902B Humidity conditioning material
05/17/2011CA2502961C Aqueous non-ionically stabilised epoxy resins
05/12/2011WO2011056620A1 Difunctional, amine-based surfactants, and their precursors, preparation, compositions and use
05/12/2011WO2011056499A2 Thermal interface material with epoxidized nutshell oil
05/12/2011WO2011055141A2 Syntactic foam
05/12/2011WO2011054945A2 Use of guanidine derivatives as curing accelerators for epoxy resins
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