| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 07/20/2011 | CN102127324A Preparation method of modified graphene oxide and preparation method of composite material containing modified graphene oxide |
| 07/20/2011 | CN102127305A Stabilized redispersible polymer powder compositions |
| 07/20/2011 | CN102127304A Redispersible polymer powders stabilized with protective colloid compositions |
| 07/20/2011 | CN102127296A Cyanate resin composition and copper-clad plate manufactured by using same |
| 07/20/2011 | CN102127291A Halogen-free epoxy resin composition and covering film prepared from same |
| 07/20/2011 | CN102127290A Epoxy resin composition and flexible copper-clad plate prepared from same |
| 07/20/2011 | CN102127289A Halogen-free flame-retardant epoxy resin composition, and adhesive film and copper-clad plate prepared from same |
| 07/20/2011 | CN102127288A Flexible epoxy plastic package material |
| 07/20/2011 | CN102127287A Conductive composite material and PTC (Positive Temperature Coefficient) thermal sensitive element prepared from same |
| 07/20/2011 | CN102127286A New water-soluble epoxy emulsion and preparation method thereof |
| 07/20/2011 | CN102127271A Water-based epoxy modified phosphorus-containing styrene-acrylic antirust emulsion and synthesis method thereof |
| 07/20/2011 | CN102127269A Flame-retarding polymer foam material and preparation method thereof |
| 07/20/2011 | CN101717557B Hot curing conductive silver slurry for manufacturing radio frequency identification (RFID) tag antenna |
| 07/20/2011 | CN101671474B Room-temperature self-repairing polymeric material containing single component liquid reactive repairing agent |
| 07/20/2011 | CN101633770B Halogen-free flame retardant epoxy resin composite and flexible copper clad laminate prepared with same |
| 07/20/2011 | CN101429323B Encapsulating epoxy resin composition, and electronic parts device using the same |
| 07/20/2011 | CN101274998B Heat-resistant flame-proof phosphorus- and silicon-containing hybrid curing agent for epoxy type electronic polymer material and preparation thereof |
| 07/20/2011 | CN101260222B Method for preparing anti-flaming banana fiber epoxy resin composite material |
| 07/20/2011 | CN101250318B Epoxy radical material for printing circuit copper clad laminate and preparation method thereof |
| 07/20/2011 | CN101166792B Curable silicone composition and electronic components |
| 07/20/2011 | CN101030476B An electronic component |
| 07/19/2011 | US7981980 Development of a cross-linked epoxy resin with flame-retardant properties |
| 07/19/2011 | US7981977 Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler |
| 07/19/2011 | US7981963 Insulation material of reactive elastomer, epoxy resin, curing agent and crosslinked rubber |
| 07/19/2011 | US7981960 Blend of glycidyl methacarylate modified or copolymerized acrylonitrile-styrene copolymer, acrylonitrile-butadiene-styrene terpolymer, polyethylene terephthalate, a flame retardant selected from tetrabromobisphenol a, decabromodiphenyl ether, decabromodiphenyl ethane, tris/tribromophenyl/triazine |
| 07/19/2011 | US7981951 Process for producing epoxides from olefinic compounds |
| 07/19/2011 | US7981515 Bis epoxy polyesters and food cans coated with a composition comprising same |
| 07/19/2011 | CA2444335C Power transmission belt |
| 07/14/2011 | WO2011084879A1 Primers comprising cerium molybdate |
| 07/14/2011 | WO2011084583A1 Multifunctional additives in engineering thermoplastics |
| 07/14/2011 | WO2011084556A1 Coating compositions with alkoxy-containing aminofunctional silicone resins |
| 07/14/2011 | WO2011084380A1 Nanocalcite and vinyl ester composites |
| 07/14/2011 | WO2011083818A1 Resin composition, prepreg, and metal-clad laminate |
| 07/14/2011 | US20110172357 Composition for forming substrate, and prepreg and substrate using the same |
| 07/14/2011 | US20110172356 Benzoxazine-based compositions containing isocyanate-based tougheners |
| 07/14/2011 | US20110172331 Reactive monomer-dispersed silica sol and production method thereof, and curable composition and cured article thereof |
| 07/14/2011 | US20110171474 Toughened Resin Fiber Laminates with Titanium Particles |
| 07/14/2011 | US20110170196 Light-shielding coating and optical element |
| 07/14/2011 | CA2784792A1 Primers comprising cerium molybdate |
| 07/14/2011 | CA2784756A1 Multifunctional additives in engineering thermoplastics |
| 07/13/2011 | CN102124054A Unsaturated ester resin composition, unsaturated ester-cured product, and manufacturing method therefor |
| 07/13/2011 | CN102120866A Method for preparing graphite and functional carbon fiber modified epoxy resin composite material |
| 07/13/2011 | CN102120865A Epoxy-phenolic aldehyde amine composition and preparation method and application thereof |
| 07/13/2011 | CN102120864A Composition for forming substrate, and prepreg and substrate using the same |
| 07/13/2011 | CN102120847A Solar nano liner composition with anions and silver ions for sterilization and processing technology thereof |
| 07/13/2011 | CN102120828A Swelling solution for removing through-hole residues of epoxy resin circuit board |
| 07/13/2011 | CN101200537B Thermoplastic composite material and preparation method thereof |
| 07/12/2011 | US7977429 Polymers and uses thereof |
| 07/12/2011 | US7977412 Epoxy resin composition and semiconductor device |
| 07/07/2011 | US20110166260 Phosphorus-containing phenol compound, production method therefor, and curable resin compositons and cured products using the compound |
| 07/07/2011 | US20110166258 Resin composition for no-flow underfill, no-flow underfill flim using the same and manufacturing method thereof |
| 07/07/2011 | US20110166246 Encapsulant composition and method for fabricating encapsulant material |
| 07/07/2011 | US20110165416 4-methyl-1-pentene polymer, resin composition containing 4-methyl-1-pentene polymer, masterbatch thereof, and formed product thereof |
| 07/07/2011 | US20110163474 Divinylarene dioxide formulations for vacuum resin infusion molding |
| 07/07/2011 | US20110163461 Electronic packaging |
| 07/06/2011 | EP2341582A1 Anisotropic electroconductive film |
| 07/06/2011 | EP2341093A1 Novel diamino-alcohol compounds, their manufacture and use in epoxy resins |
| 07/06/2011 | EP2340275A1 Epoxide-based structural foam comprising thermoplastic polyurethanes |
| 07/06/2011 | CN102119201A One-part structural epoxy resin adhesives containing elastomeric tougheners capped with phenols and hydroxy-terminated acrylates or hydroxy-terminated methacrylates |
| 07/06/2011 | CN102119184A Thermosetting composition |
| 07/06/2011 | CN102115600A Thermosetting resin composition, prepreg and laminated board |
| 07/06/2011 | CN102115575A Preparation method of recyclable resin mold material |
| 07/06/2011 | CN102115569A Dielectric material composition and circuit substrate |
| 07/06/2011 | CN102115547A Molten bath and method for recycling thermosetting epoxy resin or composite material by using same |
| 07/06/2011 | CN101718203B Coal mine support post of composite material |
| 07/06/2011 | CN101698741B Synthetic resin composite for pouring low-voltage bus bar |
| 07/06/2011 | CN101698740B Synthetic resin composite for pouring middle-voltage bus bar |
| 07/06/2011 | CN101215405B Thermosetting resin composition |
| 07/05/2011 | US7973403 Adhesive sheet for light-emitting diode device and light-emitting diode device |
| 07/05/2011 | US7972686 Composite materials with improved performance |
| 07/05/2011 | CA2359054C Autodepositable adhesive |
| 06/30/2011 | WO2011078553A2 Polyamic acid resin composition, method for preparing the same and polyimide metal clad laminate using the same |
| 06/30/2011 | WO2011078339A1 Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate |
| 06/30/2011 | WO2011078322A1 Epoxy resin composition, curable resin composition, and cured object obtained therefrom |
| 06/30/2011 | WO2011078114A1 Epoxy resin composition, process for production of assembly using same, and assembly |
| 06/30/2011 | WO2011078099A1 Diepoxy compound, process for preparation thereof, and compositions containing the diepoxy compound |
| 06/30/2011 | WO2011077094A1 Modified resin systems for liquid resin infusion applications & process methods related thereto |
| 06/30/2011 | WO2011056620A8 Difunctional, amine-based surfactants, and their precursors, preparation, compositions and use |
| 06/30/2011 | WO2011022221A3 Near-infrared absorbing film compositions |
| 06/30/2011 | US20110160345 Polymeric composite including nanoparticle filler |
| 06/30/2011 | US20110160343 Flame-Retardant Thermoplastic Resin Composition with Excellent Color Tone |
| 06/30/2011 | US20110160341 Composition for fixing wound items |
| 06/30/2011 | US20110160339 Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film |
| 06/30/2011 | US20110159294 Attach film composition for semiconductor assembly and attach film using the same |
| 06/30/2011 | US20110159266 Epoxy compositions and surfacing films therefrom |
| 06/30/2011 | US20110159228 Flip chip package containing novel underfill materials |
| 06/30/2011 | CA2785279A1 Modified resin systems for liquid resin infusion applications & process methods related thereto |
| 06/29/2011 | CN102112558A Organic-inorganic composite and manufacturing method therefor |
| 06/29/2011 | CN102112544A Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate |
| 06/29/2011 | CN102112536A Toughened curable compositions |
| 06/29/2011 | CN102108185A Epoxy matrix resin and prepreg and preparation method thereof and device for preparation thereof |
| 06/29/2011 | CN102108184A Epoxy resin composition and application thereof |
| 06/29/2011 | CN101307183B Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method |
| 06/28/2011 | US7969027 Semiconductor device encapsulated with resin composition |
| 06/28/2011 | US7968622 Inkjet ink composition for color filter, production method for color filter, and color filter |
| 06/28/2011 | US7968195 Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler |
| 06/28/2011 | US7968194 Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler |
| 06/28/2011 | US7968179 Pre-impregnated composite materials with improved performance |
| 06/28/2011 | US7967796 Adhesive for injection needle, a method for bonding injection needle, a syringe front-assembly and a syringe |
| 06/23/2011 | WO2011075217A1 Epoxy resin curing compositions and epoxy resin systems including same |