Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08L - Compositions of macromolecular compounds › C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
09/2010
09/08/2010CN101823897A Composite mesoporous material
09/08/2010CN101338066B Transparent epoxy nanometer composite material, preparation method and application thereof
09/08/2010CN101302326B Flame retardant resin composition
09/08/2010CN101191007B Method for preparing resin-base composite material containing metal particle
09/08/2010CN101104660B One solution-type thermosetting compositions for color filter protective films and color filters using the same
09/08/2010CN101070421B High-heat-resisting glass-fiber reinforced polyester composite material and preparing method
09/07/2010US7790812 crack resistance, transparency, minimal discoloration; optical semiconductor device; reacting polyester of cyclohexanedicarboxylic acid and neopentyl glycol; methylhexahydrophthalic anhydride; polyepoxide; 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate
09/07/2010US7790665 Soil release polyester formulations containing 50 to 90 percent by weight of soil release polyester and 0.1 to 40 percent by weight of a polycarboxylic acid; stable while being provided with low viscosity; free flowing and storage stable
09/07/2010US7790288 Interpenetrating polymer network as coating for metal substrate and method therefor
09/07/2010US7790011 Solid resin-crosslinker mixture for use in aqueous coatings
09/02/2010WO2010099281A1 Epoxy adhesive compositions with high mechanical strength over a wide temperature range
09/02/2010WO2010098966A1 Curable epoxy resin compositions and cured products therefrom
09/02/2010WO2010098296A1 Polyimide resin, process for production of polyimide resin, polyimide resin compositions, and cured products of same
09/02/2010WO2010098285A1 Sealing agent for optical semiconductor devices and optical semiconductor device using same
09/02/2010WO2010098066A1 Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition
09/02/2010WO2010097051A1 Room-temperature curable epoxy structural adhesive composition and preparation method thereof
09/02/2010WO2010059933A3 Phase separated curable compositions
09/02/2010US20100222490 High solids epoxy coating composition
09/02/2010US20100222480 Compositions useful for non-cellulose fiber sizing, coating or binding compositions, and composites incorporating same
09/02/2010US20100222461 Epoxy compositions with improved mechanical performance
09/02/2010US20100221555 Phenol resin composition, cured article thereof, resin composition for copper-clad-laminate, copper-clad laminate, and novel phenol resin
09/02/2010US20100221521 Shear thickening fluid containment in polymer composites
09/02/2010US20100218982 Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board
09/02/2010CA2753569A1 Epoxy adhesive compositions with high mechanical strength over a wide temperature range
09/02/2010CA2750703A1 Curable epoxy resin compositions and cured products therefrom
09/01/2010EP2223966A1 Epoxy adhesive compositions with high mechanical strength over a wide temperature range
09/01/2010EP2223964A1 Membranes comprising amino acid mobile carriers
09/01/2010EP2223963A1 Membranes comprising amino acid mobile carriers
09/01/2010EP2222785A1 Thermoplast-containing epoxy resins and the processing thereof by extrusion or injection molding
09/01/2010EP1471112B1 Transparent composite composition
09/01/2010CN1802406B Pasty heat-expandable filler composition and method of sound insulation by filling closed section of car body member
09/01/2010CN101821817A Polymer concrete electrical insulation system
09/01/2010CN101821333A Curable epoxy resin-based adhesive compositions
09/01/2010CN101819953A Transparent epoxy resin packaging adhesive
09/01/2010CN101818068A Phosphoro-silicate hybrid-containing composite fire retardant and preparation method thereof
09/01/2010CN101817971A Carbon micro-tube epoxy resin wave-absorbing composite material and preparation method thereof
09/01/2010CN101817970A Hydroxychloroethylene-vinyl acetate modified epoxy resin compound and preparation method thereof
09/01/2010CN101817969A Dipping material for capacitor of energy-saving lamp
09/01/2010CN101817962A Polyvinyl chloride/epoxy resin blend and preparation method thereof
09/01/2010CN101817841A Tetra-(chloroethyl) silicate compound and preparation method thereof
09/01/2010CN101817248A Waves-absorbing material for Ku waveband radar with film structure
09/01/2010CN101195701B Epoxy resin shape memory polymer material and method for producing the same
09/01/2010CN101124275B Fire-retardant low-density epoxy composition
09/01/2010CN101121812B Epoxy resin base fast repairing material and preparation method thereof
08/2010
08/31/2010US7786224 Liquid composition of alicyclic diepoxide, curing agent and/or curing accelerator
08/31/2010US7786223 Epoxy resin and curing agent of di- and/or mono-glycidyether/monoamine-polyamine reaction product
08/31/2010US7786219 Initiated by a carboxycycle, such as cyclohexylidene-, cyclopentylidene- or p-phenylene-, diphenol and reacted with cyanogen chloride; prepregs and printed circuits made from the polyether, a different cyanate resin and an epoxy resin; low dielectric constant, high toughness
08/31/2010US7786214 Composition of epoxy resin, epoxy adduct, urea derivative thixotropic agent and curing agent
08/26/2010WO2010095692A1 Sealing agent for dye-sensitized solar cell and dye-sensitized solar cell
08/26/2010US20100216913 Curable Epoxy Resin Composition and Cured Product Thereof
08/26/2010US20100213490 Sealing composition for light emitting device and light emitting device including the same
08/26/2010US20100213413 Seeding resins for enhancing the crystallinity of polymeric substructures
08/25/2010EP2220162A1 Vibration dampening compositions
08/25/2010EP2220161A2 Nozzle sealing composition and method
08/25/2010EP2220156A1 Hydrophobic modification of mineral fillers and mixed polymer systems
08/25/2010CN201560607U Novel insulated crossarm
08/25/2010CN101816049A Electrical insulation system with improved electrical breakdown strength
08/25/2010CN101815755A compositions comprising cationic fluorinated ether, silanes, and related methods
08/25/2010CN101812231A Halogen free flame retardant nylon 6 composite with high CTI value and preparation method thereof
08/25/2010CN101812218A Reactive water-dispersed epoxy resin emulsion and preparation method thereof
08/25/2010CN101812217A Partial discharge resistant epoxy casting resin
08/25/2010CN101812216A Electronic packaging material containing transition metal oxide nanometer particles
08/25/2010CN101812215A Resin solution for producing copper-clad plate
08/25/2010CN101812186A Microencapsulation expansion type flame retardant and application in epoxy resin composite material thereof
08/25/2010CN101376734B Epoxide-resin glue liquid, laminated board for printed circuit board manufactured by using the same and manufacturing method thereof
08/25/2010CN101348584B Method for preparing damping material from waste polystyrene plastic foam and waste rubber powder
08/25/2010CN101343401B Halogen-free glue solution, halogen-free flame-proof cover copper foil substrate using the glue solution and preparation method thereof
08/25/2010CN101343398B Halogen-free flame-proof glass fiber reinforcement epoxy molding compound
08/25/2010CN101334121B Automobile fuel oil conduit and method for making same
08/25/2010CN101215358B Prepolymer and thermosetting resin composition prepared by the same
08/25/2010CN101107315B Use of aramid fiber conjunction with thermoplastic to improve wash-off resistance and physical properties such as impact and expansion
08/25/2010CN101039984B Epoxy resin composition and semiconductor device
08/25/2010CN101037530B Light-curved aqueous crylic acid epoxy resin latex and coating prepared thereby
08/25/2010CN101003664B Latex of epoxy resin of aqueous phenolic aldehyde, and preparation method
08/24/2010US7781543 Containing a bicyclohexyl-3,3'-diepoxide, a thermal cationic or photocationic polymerization initiator or an acid anhydride; and, optionally, an additional epoxy resin; high bending strength, high Tg, and low permittivity; casting composition for electrical insulation
08/24/2010US7781522 Aromatic-free polysiloxane containing at least 2 epoxy groups, 1,3-bis((3-m-hydroxyphenyl)propyl)-1,3-dimethyldisiloxane, and a curing accelerator; cured product has high flexibility and improved adhesive characteristics
08/24/2010US7781499 Process for obtaining aqueous compositions comprising curing epoxy agents
08/24/2010US7781495 Addition polymer having two or more (meth)acryloyl groups per molecule at the molecular ends, and an addition polymer having one (meth)acryloyl group per molecule at the molecular end, e.g., halogen-terminated butyl acrylate-ethyl acrylate-methoxyethyl acrylate terpolymer reacted with acryloyl chloride
08/24/2010US7781063 High thermal conductivity materials with grafted surface functional groups
08/19/2010WO2010093064A1 Fire-resistant phosphorus-containing epoxy resin composition and hardened substance obtained thereby
08/19/2010WO2010092723A1 Benzoxazine resin composition
08/19/2010WO2010092630A1 Fast cure resin composition
08/19/2010WO2010059683A3 Curing agents for epoxy resins
08/19/2010US20100210793 One liquid type cyanate-epoxy composite resin composition, its hardened material, manufacturing method thereof, and materials for sealing and adhesive agents using the same
08/19/2010US20100210758 Coating System
08/19/2010US20100209701 Method for manufacturing transparent plastic film and transparent plastic film manufactured by the method
08/19/2010US20100207282 Primer resin for semiconductor device and semiconductor device
08/19/2010US20100207261 Chip attach adhesive to facilitate embedded chip build up and related systems and methods
08/19/2010US20100206623 Nonconductive adhesive composition and film and methods of making
08/19/2010US20100205764 Rubber material of a wiper blade for windshield wipers and process for production thereof
08/18/2010EP2219188A1 Ultraviolet-curable composition for optical disk and optical disk
08/18/2010EP2217651A2 Curable compositions containing isocyanate-based tougheners
08/18/2010EP2217567A1 Peroxide composition
08/18/2010CN101809089A Curable liquid epoxy resin composition and cured product thereof
08/18/2010CN101809088A Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device
08/18/2010CN101809057A Polyester composition for production of thermally cured film
08/18/2010CN101805514A Castor oil type polyurethane/acrylic resin double-component damping material and preparation method thereof
08/18/2010CN101805505A PC/PMMA alloy and preparation method thereof
08/18/2010CN101805494A Natural fiber resin composite and preparation method thereof
08/18/2010CN101805493A High-temperature resistance carbon fiber/epoxy resin composite material, preparation method and use
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