Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
04/2011
04/27/2011CN101445643B Epoxy resin composite
04/27/2011CN101423659B Flame retardant polyphenylene oxide composition and preparation method thereof
04/27/2011CN101362819B Triazines cross-linking compounds, preparation method and application thereof
04/27/2011CN101358020B Nonporous moisture permeable and water-repellent modified polyether ester functional film material and preparation method thereof
04/27/2011CN101302304B Preparation of epoxide resin based foam material
04/27/2011CN101195700B Light emitting diode frame body component and manufacturing method thereof
04/26/2011US7932322 Amide or thioester pre-extended epoxy-terminated viscosifiers and method for producing the same
04/26/2011CA2487894C Actinic radiation curable compositions and their use
04/21/2011WO2011011167A3 Curable composition, method of coating a phototool, and coated phototool
04/21/2011US20110091653 Coating composition comprising autoxidisable component
04/21/2011DE102006043357B4 Photoempfindliche, hitzehärtbare Harzzusammensetzung und Verwendung derselben zur Herstellung einer Schaltungsplatine A photosensitive thermosetting resin composition and use thereof for the manufacture of a circuit board
04/20/2011EP2311892A1 Epoxy resin composition and prepreg using same
04/20/2011EP2310452A2 Curable resin composition
04/20/2011EP2310436A2 Two-part epoxy-based structural adhesives
04/20/2011EP1728826B1 Composition curable by both free-radical photocuring and cationic photocuring
04/20/2011CN1984960B Epoxy resin molding material for encapsulation and electronic accessory device
04/20/2011CN102027231A Windmill propeller blade and method of making same
04/20/2011CN102027041A Non-stick coating composition
04/20/2011CN102020853A Composition for encapsulating optical semiconductor element
04/20/2011CN102020831A Composite material for wind power generation blades
04/20/2011CN102020830A Halogen-free fire resistance resin composite and application thereof
04/20/2011CN102020829A Method for accelerating impregnation of composite material
04/20/2011CN102020828A Phosphorus-nitrogen compound intumescence active flame retardant modified epoxy resin and preparation method and application thereof
04/20/2011CN102020827A Phenolic moulding plastic for low-voltage apparatus
04/20/2011CN102020783A Selection method of fillers for advanced encapsulating material
04/20/2011CN102020758A Low temperature curable epoxy compositions containing phenolic-blocked urea curatives
04/20/2011CN101597418B Electric insulation heat-conducting resin composite material and preparation method thereof
04/20/2011CN101597396B Polymer-based positive temperature coefficient thermistor material
04/20/2011CN101475698B Preparation of X-ray optical filter
04/20/2011CN101423650B High interlaminar shear strength epoxy resin base composite material and preparation method thereof
04/20/2011CN101343402B Resin composition with high-heat, high-glass transition temperature for printed circuit board, prepreg and coating substance
04/20/2011CN101323673B Chemical resistance table slab rubber, preparation and use thereof
04/20/2011CN101275036B Preparation for polymer conductive nanometer compound material
04/20/2011CN101168618B Light aging resisting and high-strength anti-flaming enhancement polybutylene terephthalate composition and preparation method thereof
04/20/2011CN101137716B Epoxy resin composition and semiconductor device
04/20/2011CN101048464B Coating compositions containing a carbinol functional silicone resin or an anhydride functional silicone resin
04/20/2011CN101048460B Moldable compositions containing carbinol functional silicone reisins or anhydride functional silicone resins
04/19/2011US7928170 Cyanate ester, epoxy resin and curing agent of phenol resin and epoxy compound-modified polyamine
04/19/2011US7928152 Electrodeposition paint
04/19/2011US7927691 Film adhesive of thermoset resin, curing agent and fibrous micropulp
04/14/2011WO2011043676A1 Reactive polymeric mixture
04/14/2011WO2011043119A1 Thermosetting adhesive composition, thermosetting adhesive sheet, method for producing same, and reinforced flexible printed wiring board
04/14/2011WO2011042554A1 Increase in the toughness of a material achieved by means of a curable composition including at least one vinyl ester monomer
04/14/2011WO2011042062A1 A latent curing agent and epoxy compositions containing the same
04/14/2011US20110084421 Ultraphobic Compositions and Methods of Use
04/14/2011US20110084408 Thermosetting die-bonding film
04/14/2011US20110083890 Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device
04/14/2011DE102008009298B4 Härtbare Epoxidharzformulierungen mit Polyester-Flammschutzmittel A curable epoxy resin formulations with polyester flame retardants
04/13/2011CN1764692B Epoxy resin compositions containing mannich bases, suitable for high-temperature applications
04/13/2011CN102015884A Conductive resin composition
04/13/2011CN102015869A Flame-retardant additives
04/13/2011CN102015816A Coating composition
04/13/2011CN102015531A Amorphous siliceous powder, process for production of the same, and use thereof
04/13/2011CN102010609A Thermosetting epoxy resin modified emulsified asphalts
04/13/2011CN102010608A Thermosetting emulsified flexible epoxy resin modified emulsified asphalt
04/13/2011CN102010607A Thermosetting emulsified epoxy resin modified emulsified asphalt
04/13/2011CN102010576A Repairable type epoxy resin encapsulating glue and preparation method thereof
04/13/2011CN102010575A Environmental-friendly human pipeline casting filler and preparation method thereof
04/13/2011CN102010574A Flame-retardant molding compositions
04/13/2011CN102010573A Novel carbon fiber sucker rod and manufacturing method thereof
04/13/2011CN102010572A Environment-friendly epoxy resin composition as well as preparation method and application thereof
04/13/2011CN102010571A Resin composition for optical semiconductor device, optical-semiconductor-device lead frame obtained using the same, and optical semiconductor device
04/13/2011CN102010570A Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same
04/13/2011CN102010569A Halogen-free flame retardant epoxy resin composition and high-flexibility coating film prepared by same
04/13/2011CN102010568A High-flexibility halogen-free phosphorus-free epoxy resin composition and flexible copper-clad plate prepared by using same
04/13/2011CN102010567A Non-halogen and non- phosphate epoxy resin composition and coverage membrane prepared by same
04/13/2011CN102010566A Method for preparing epoxy moulding compound for packaging integrated circuit
04/13/2011CN102010521A Silicate ester flame-retardant plasticizer and preparation method thereof
04/13/2011CN102010520A Triazine light stabilizer containing hindered amine groups
04/13/2011CN102010343A Polyhydroxy compound, method for manufacturing the same and epoxy resin composition, cured product thereof
04/13/2011CN102009509A Manufacturing technology of embedded co-curing high-damping composite and laminate material structure
04/13/2011CN102009478A Production process of epoxy molding plastic by adopting multiplex high-accuracy mixing
04/13/2011CN101644035B Warning mark using unsaturated composite epoxy resin materials
04/13/2011CN101597417B High-temperature resistant and high-toughness epoxy matrix resin as well as preparation method and application thereof
04/13/2011CN101570621B Halogen-free encapsulating material
04/13/2011CN101547558B Copper clad base plate and preparation method thereof
04/13/2011CN101323769B Resin paste for die bonding
04/12/2011US7923516 One liquid type cyanate-epoxy composite resin composition, its hardened material, manufacturing method thereof, and materials for sealing and adhesive agents using the same
04/12/2011US7923510 Adhesive sheet based on nitrile rubber blends for attaching metal parts to plastics
04/12/2011US7923488 Leuco dyes with a N,N-dialkylamino, N,N-diarylamino, N-alkyl-N-arylamino, N-alkylamino, or N-arylamino group on one of the aromatic rings and a latent curing agent or catalyst activate-able by heat, pressure, or radiation
04/12/2011US7923481 Radiation curable composition and method for producing the same
04/12/2011US7923102 Method for making composite material with blend of thermoplastic particles
04/12/2011US7922932 Reactive fine particles
04/07/2011WO2011041340A1 Epoxy resin compositions
04/07/2011WO2011040567A1 Matrix resin composition for fiber-reinforced plastic and fiber-reinforced plastic structure
04/07/2011WO2011040560A1 Modified urethane resin curable composition and cured product thereof
04/07/2011WO2011040416A1 Resin composition, resin sheet, and resin cured product and method for producing same
04/07/2011WO2011040415A1 Multilayer resin sheet and method for producing same, method for producing multilayer resin sheet cured product, and highly thermally conductive resin sheet laminate and method for producing same
04/07/2011WO2011040211A1 Organic el element, organic el display device, organic el lighting device, and curable composition for sealing agent
04/07/2011WO2011039879A1 Matrix resin composition for fiber-reinforced plastics, and fiber-reinforced plastic structures
04/07/2011US20110082248 Polyamine having a reduced blushing effect, and use thereof as a curing agent for epoxy resins
04/07/2011US20110082219 Thickeners
04/06/2011EP2306570A1 Resin composition for fuel cell separator, process for producing same, and fuel cell separator
04/06/2011EP2306220A1 Composition for reflective film, reflective film, and x-ray detector
04/06/2011EP2305728A1 Thickening agent
04/06/2011EP2303953A1 Structural composites with improved toughness
04/06/2011EP1854845B1 Resin composition for electronic and electric components for high-frequency applications and its molded product
04/06/2011CN102007073A Alumina powder, process for production of the same, and resin compositions containing the same
04/06/2011CN102002252A Micro-deformable piezoresistive material and manufacturing method thereof
04/06/2011CN102002237A White heat-curable silicone/epoxy hybrid resin composition
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