Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
11/2011
11/16/2011CN102241871A Formula of resin system on surface of antibacterial glass reinforced plastic
11/16/2011CN102241870A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
11/16/2011CN102241869A Composition, formed body prepared therefrom and preparation method of formed body
11/16/2011CN102241868A Epoxy resin composition for high-voltage power insulation
11/16/2011CN102241844A Composite dielectric material and preparation method thereof
11/16/2011CN102241807A Epoxy resin composition for optical-semiconductor element encapsulation and optical-semiconductor device using the same
11/16/2011CN101864127B Long-afterglow fluorescent powder sizing agent
11/16/2011CN101851394B Hollow carbon fiber felt epoxy resin composite material and preparation method thereof
11/16/2011CN101735611B Thermosetting resin composition with high heat conductivity, prepreg manufactured by adopting same and copper-clad laminate
11/16/2011CN101735560B Casting mixture for epoxy casting transformer and preparation method thereof
11/16/2011CN101696316B Method for preparing radiation protection materials
11/16/2011CN101633772B Process for epoxy resin composition for casting transformer
11/16/2011CN101506302B Resin compositions for coatings and coating compositions wherein these are used
11/16/2011CN101445587B Resin binding agent for a diamond wire saw and preparation method thereof
11/16/2011CN101418204B Halogen-free flameproof adhesive and application thereof in bonding sheet and copper clad laminate
11/16/2011CN101343425B Functionalized carbon nano-tube used as solidifying agent of epoxy resin and preparation method
11/16/2011CN101289568B Method for preparing cobalt-plating carbon nano-tube/epoxide resin wave- absorbing and camouflage composite material
11/16/2011CN101033293B Polyfunctional phenylene ether oligomer, derivative thereof, resin composition containing the same, and use thereof
11/15/2011US8058364 Method for functionalization of nanoscale fibers and nanoscale fiber films
11/15/2011US8058363 Varnish and prepreg, and substrates thereof
11/15/2011US8058362 Manufacture of novel epoxy resins semi-thermosets and their high TG thermosets for electronic applications
11/15/2011US8057902 Epoxy phosphorous-containing resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition
11/10/2011WO2011138865A1 Epoxy resin composition for circuit boards, prepreg, laminate, resin sheet, laminate for printed wiring boards, printed wiring boards, and semiconductor devices
11/10/2011WO2011138254A1 1c epoxy resin composition with reduced toxicity
11/10/2011WO2011094004A3 Compositions having phosphorus-containing compounds
11/10/2011WO2011078553A3 Polyamic acid resin composition, method for preparing the same and polyimide metal clad laminate using the same
11/10/2011WO2011071726A3 Curable resin compositions useful as underfill sealants for low-k dielectric-containing semiconductor devices
11/10/2011US20110275740 Nanocomposite Materials and Method of Making Same by Nano-Precipitation
11/10/2011US20110275739 Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin
11/10/2011US20110275730 Polymer foam with low bromine content
11/10/2011US20110274907 Curative fibre components
11/10/2011US20110274888 Composite Material, Method for Producing a Composite Material and Adhesive or Binding Material
11/10/2011US20110272841 Plasticity plastic film and method for applying plasticity plastic film to in-mold decoration
11/10/2011US20110272829 Epoxy resin composition for optical-semiconductor element encapsulation and optical-semiconductor device using the same
11/10/2011US20110272643 Organic anti-reflective layer composition containing ring-opened phthalic anhydride and method for preparation thereof
11/10/2011US20110272191 Potting for electronic components
11/10/2011DE102010028586A1 1K-Epoxidharzzusammensetzung mit verringerter Toxizität 1K epoxy resin with reduced toxicity
11/09/2011EP1914266B1 Prepreg
11/09/2011CN102235056A Natural plant fiber reinforced plastic (FRP) rib and preparation method thereof
11/09/2011CN102234426A Resin composition for optical lens and optical package
11/09/2011CN102234422A Flame-retardant nylon resin composition and preparation method thereof
11/09/2011CN102234410A Heat-conducting thermosetting molding composite material and application thereof
11/09/2011CN102234409A Epoxy resin composition and prepreg and printed circuit board (PCB) manufactured therefrom
11/09/2011CN102234408A Epoxy resin composition and prepreg material and printed circuit board prepared from same
11/09/2011CN102234407A Flame-retardant acrylonitrile-butadiene-styrene resin composition and preparation method thereof
11/09/2011CN102234363A Halogen-free flame-retardant resin composition
11/09/2011CN101704989B Fluorine-containing imine matrix resin used for advanced composite material and preparation method thereof
11/09/2011CN101492527B Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same
11/08/2011US8053533 Phenolic OH-containing polyimide silicone, epoxy resin and curing agent
11/08/2011US8053156 Toner, and toner production process
11/08/2011US8053041 Overcoat film composition, color filter substrate, and liquid crystal display element
11/08/2011CA2565335C Crystalline resin sandwich films
11/03/2011WO2011136568A2 Environmentally friendly water-based epoxy resin composition and a use therefor
11/03/2011US20110269874 Resin particle and resin dispersion
11/03/2011US20110266507 Melamine phenylphosphonate flame retardant compositions
11/02/2011EP2383310A1 Curable composition
11/02/2011EP2382337A1 Sulfo or sulfamyl group-containing cathodic electrocoat resin
11/02/2011EP1745104B1 Comb-like polyetheralkanolamines in inks
11/02/2011CN102232096A Connecting film, joined body, and manufacturing method therefor
11/02/2011CN102229737A Packaging material for high-blockage organic electronic device
11/02/2011CN102229727A Processing method of waste polystyrene-acrylonitrile foamed plastics, and method for preparing recycled sheet material
11/02/2011CN102229700A Epoxy resin nanometer montmorillonite composite material and preparation method thereof
11/02/2011CN102229622A Organic phosphinic acid metal salt containing triazine ring and preparation method thereof
11/02/2011CN101486826B Epoxy solvent-free impregnating resin and preparation thereof
11/01/2011US8048970 Low viscosity oligomer polyol; reacting melamine-formaldehyde resin with diol in presenvc eof acid catalyst; reduced volatile organic compounds; wea rresistance
11/01/2011US8048817 Amorphous silica powder, process for its production, and sealing material for semiconductors
11/01/2011CA2541648C Method and system for making high performance epoxies, and high performance epoxies obtained therewith
10/2011
10/27/2011WO2011133353A1 Composite material for structural applications
10/27/2011WO2011132674A1 Thermosetting composition
10/27/2011WO2011132655A1 Polybutylene terephthalate resin composition and method for producing polybutylene terephthalate resin composition
10/27/2011WO2011132408A1 Epoxy resin composition, prepreg, metal-clad laminate, and printed wiring board
10/27/2011WO2011062370A3 Water-soluble, thick film epoxy resin floor finish composition
10/27/2011US20110263754 Metallic compounds in non-brominated flame retardant epoxy resins
10/27/2011US20110262630 Composite Materials With Improved Performance
10/27/2011CA2794293A1 Composite material for structural applications
10/26/2011CN102227681A Curable resin composition and reflective sheet
10/26/2011CN102227475A Photo-curable resin composition exhibiting light-blocking properties and tackiness, and cured product thereof
10/26/2011CN102227471A Epoxide resins containing siloxane mixtures and method for preparation thereof and use thereof
10/26/2011CN102226034A Preparation method of glass-fiber-reinforced epoxy resin composite material modified by circuit board recovered powder and nanoparticles
10/26/2011CN102226033A Epoxy resin composition as well as prepreg and metal-foil-clad laminated board manufactured by using same
10/26/2011CN102226032A Low-modulus epoxy resin system and preparation method thereof
10/26/2011CN102226023A Composite board based on mixed waste polymers and preparation method thereof
10/26/2011CN102225999A Nitrogen-containing organic metal phosphinate and preparation method thereof
10/26/2011CN101819953B Transparent epoxy resin packaging adhesive
10/26/2011CN101735557B Insulation material for cable joint
10/26/2011CN101701058B Epoxy resin containing melamine-organic silicon hybrid structure and preparation method and application thereof
10/25/2011US8044154 Latent hardener for epoxy compositions
10/25/2011US8044119 Insulating material of epoxy compound, acrylic resin, ceramic particles and curing agent
10/20/2011WO2011030143A3 Curable formulation
10/20/2011US20110257300 Ceramic powder and applications thereof
10/20/2011US20110257299 Metal stabilizers for epoxy resins
10/20/2011US20110256387 Resin Composition for Surface Treatment of Steel Sheet and Surface-Treated Steel Sheet Using the Same
10/20/2011US20110255258 Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board and semiconductor device
10/20/2011US20110253434 Epoxy resin composition, and prepreg and printed circuit board using the same
10/20/2011DE102010015575A1 Mineralwollfasermatten, Verfahren zu deren Herstellung und Verwendung Mineral wool fiber mats, to processes for their preparation and use
10/20/2011DE102010015398A1 Isolationsverbundmaterial zur elektrischen Isolation, Verfahren zur Herstellung und Verwendung desselben Insulation of the same composite material for electrical insulation, method of making and using
10/19/2011EP2376574A2 Composition for producing a part by machining, method for implementing same and product thus obtained
10/19/2011EP1957552B1 Thermosetting resin composition, thermosetting resin composition solution, film forming material and their cured product
10/19/2011EP1904577B1 Composition, treated backing, and abrasive articles containing the same
10/19/2011CN202012756U Novel LED lamp bulb
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