| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 05/12/2011 | WO2011054770A1 Process for manufacturing an epoxy resin |
| 05/12/2011 | WO2011054168A1 Pole tower made of composite material and manufacturing method thereof |
| 05/12/2011 | US20110112222 Fiber reinforced polymers, epoxy-based polymeric compositions and use thereof |
| 05/12/2011 | US20110112221 Epoxy silane oligomer and coating composition containing same |
| 05/12/2011 | US20110111662 Thermosetting Resin Composition for High Performance Laminates |
| 05/12/2011 | US20110111218 Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device |
| 05/12/2011 | US20110108309 Dielectric material with non-halogenated curing agent |
| 05/12/2011 | DE102009053253A1 Tränkharz für Verbundisolatoren Impregnating resin for composite insulators |
| 05/12/2011 | DE102009052061A1 Verwendung von Guanidin-Derivaten als Härtungsbeschleuniger für Epoxidharze Use of guanidine derivatives as curing accelerators for epoxy resins |
| 05/11/2011 | EP1874370B1 Non-degradable low swelling, water soluble radiopaque hydrogels |
| 05/11/2011 | CN102056970A Prepreg for printed wiring board and printed wiring board |
| 05/11/2011 | CN102051027A Method for preparing chemical tank leak patching agent |
| 05/11/2011 | CN102051026A Halogen-free flame-retardant epoxy resin composition and application thereof |
| 05/11/2011 | CN102051025A Halogen-free flame-retardant epoxy resin composition and application thereof |
| 05/11/2011 | CN102051024A Halogen-free flame-retardant epoxy resin composition and application thereof |
| 05/11/2011 | CN102051023A Halogen-free resin composition and resin-coated copper foil and copper-clad plate prepared from same |
| 05/11/2011 | CN102051022A Epoxy resin composition as well as prepreg and laminated board made of same |
| 05/11/2011 | CN102051021A Prepreg applied to printed circuit board in filling nanometer molecular sieve and preparation method thereof |
| 05/11/2011 | CN102050988A Fire resistant long glass fiber reinforced polypropylene composite |
| 05/11/2011 | CN102050797A 2-(4- biphenyl)-4,6-bi-(2-hydroxyl-4-alkoxylphenyl)-1,3,5-triazine ultraviolet absorbent |
| 05/11/2011 | CN101565545B Method for preparing ethylene rhodanate-epoxy-POSS hybrid resin |
| 05/11/2011 | CN101538399B Damping type epoxy resin material and preparation method thereof |
| 05/11/2011 | CN101456963B Method for preparing microsphere composite foam material |
| 05/11/2011 | CN101423618B Method for preparing rigid three-dimensional crystal whisker interlayer modified continuous fiber composite material |
| 05/11/2011 | CN101348562B Preparation of aliphatic alcohol polyether type aqueous amine epoxy hardener |
| 05/11/2011 | CN101270221B Method for preparing composite emulsion of epoxy resin-polyurethane |
| 05/11/2011 | CN101265352B Cardanol modifying phenolic resin composition and method for producing environmental protection type flame-proof paper-base copper-coating board |
| 05/11/2011 | CN101215408B High temperature self-restoring epoxy resin material and preparation method thereof |
| 05/11/2011 | CN101205349B Manufacturing method of high-conductivity epoxy moulding material having heat conducting path |
| 05/05/2011 | WO2011052175A1 Fibers consisting of thermosetting polyamide resin composition, nonwoven fabric, and process for production of same |
| 05/05/2011 | WO2011052157A1 Resin composition for semiconductor encapsulation and semiconductor device using the resin composition |
| 05/05/2011 | US20110105700 Liquid crystal aligning agent, liquid crystal alignment film and liquid crystal display device |
| 05/05/2011 | US20110105646 Epoxy resin composition for encapsulating electronic part |
| 05/05/2011 | US20110104504 Aromatic secondary adhesive compositions containing aminosilane |
| 05/05/2011 | US20110104415 Process to manufacture a reinforcing element provided with a cured adhesive composition, reinforcing element and rubber article comprising said reinforcing element |
| 05/05/2011 | DE102009046157A1 Vormischung und Verfahren zur Herstellung einer thermisch expandierbaren und härtbaren Epoxid-basierten Masse Premix and process for producing a thermally expandable and curable epoxy-based composition |
| 05/04/2011 | EP2316883A1 Unsaturated ester resin composition, unsaturated ester-cured product, and manufacturing method therefor |
| 05/04/2011 | EP2315741A2 Reactive liquid modifiers |
| 05/04/2011 | EP2315730A2 Curable polymer mixtures |
| 05/04/2011 | CN102047774A Resin composition for forming the adhesive layers of a multi-layer flexible printed circuit board |
| 05/04/2011 | CN102046726A Epoxy resin composition for printed wiring board, solder resist composition, resin film, resin sheet, prepreg, metal foil with resin, cover lay, and flexible printed wiring board |
| 05/04/2011 | CN102046693A Method for producing aliphatic polyester resin, and an aliphatic polyester resin composition |
| 05/04/2011 | CN102041919A Manufacturing method of high-voltage composite material double-loop single-pole transmission tower |
| 05/04/2011 | CN102040844A Hot melt type separable plastic |
| 05/04/2011 | CN102040842A Autocatalytic crosslinking type organic silicon-epoxy composite material and preparation method thereof |
| 05/04/2011 | CN102040805A Epoxy resin system for manufacturing blade mould of wind-driven generator and preparation method thereof |
| 05/04/2011 | CN102040804A 环氧树脂组成物 An epoxy resin composition |
| 05/04/2011 | CN102040803A Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device |
| 05/04/2011 | CN102040802A Epoxy resin system and application thereof |
| 05/04/2011 | CN102040801A Epoxy resin composition as well as film and substrate |
| 05/04/2011 | CN102040800A Nucleating agent applied for preparing high heatproof polylactic acid |
| 05/04/2011 | CN102040784A Solvent strippable plastic |
| 05/04/2011 | CN102040744A Mixed salt flame retardant of phosphoric acid, gluconic acid and melamine and preparation method thereof |
| 05/04/2011 | CN102039701A Prepreg and metal foil substrate |
| 05/04/2011 | CN101585958B Composition and method for preparing artificial gem |
| 05/04/2011 | CN101585954B Silicon dioxide hollow sphere/polymer composite heat insulating material and method for preparing same |
| 05/04/2011 | CN101525469B Force sensing epoxy resin-based composite material |
| 05/04/2011 | CN101508824B Oxatyl-containing lateral group polyarylether cured modified epoxy resin composition and method for producing the same |
| 05/04/2011 | CN101508823B Quick self-repair type polymer composite material at room temperature |
| 05/04/2011 | CN101429324B Encapsulating epoxy resin composition, and electronic parts device using the same |
| 05/04/2011 | CN101302327B Halogen-free fire-resistant epoxy resin composition, film and copper clad laminate |
| 05/04/2011 | CN101240104B Alkylated polyalkyleneamines and uses thereof |
| 05/04/2011 | CN101103311B Cationic photopolymerizable epoxy resin composition, minute structural member using the same and method for manufacturing minute structural member |
| 05/03/2011 | US7935764 Composition of carboxyl acryl resin and epoxy acryl resin |
| 05/03/2011 | US7935739 Cationic curable composition and cured product thereof |
| 05/03/2011 | US7934811 Inkjet printhead having conductive epoxy resin |
| 04/28/2011 | WO2011048885A1 Insulating sheet, circuit board, and process for production of insulating sheet |
| 04/28/2011 | WO2011048765A1 Epoxy resin composition for semiconductor encapsulation, semiconductor device, and release agent |
| 04/28/2011 | US20110098395 Organic Vegetable Oil Based Resin and Preparation Method Thereof |
| 04/28/2011 | US20110098383 Composite comprising nanosize powder and use of the composite |
| 04/28/2011 | US20110098380 Polyphenolic compounds and epoxy resins comprising cycloaliphatic moieties and process for the production thereof |
| 04/28/2011 | US20110097587 Varnish, prepreg, and substrate thereof |
| 04/28/2011 | US20110097568 Epoxy resin composition, fiber-reinforced composite material, and method for producing the same |
| 04/28/2011 | US20110097542 Compensation element |
| 04/28/2011 | US20110097212 Toughened curable compositions |
| 04/28/2011 | US20110095453 One liquid type cyanate-epoxy composite resin composition |
| 04/28/2011 | DE102009045903A1 Schlagzähe, bei Raumtemperatur härtende zweikomponentige Masse auf Epoxidbasis Impact-resistant, room temperature curing two-component epoxy mass |
| 04/28/2011 | CA2771793A1 Insulating sheet, circuit board and production method for insulating sheet |
| 04/27/2011 | EP2313464A2 Reaction products based on amphiphilic block copolymers and their use as impact modifier |
| 04/27/2011 | EP2313452A1 Thermosetting composition |
| 04/27/2011 | CN1958721B Ionic bond jointed phosphor - nitrogen type flame retardant, and preparation method |
| 04/27/2011 | CN102037798A Heat radiation sheet and heat radiation device |
| 04/27/2011 | CN102037086A Epoxy resin reactive diluent compositions |
| 04/27/2011 | CN102037076A One-liquid type cyanate epoxy composite resin composition |
| 04/27/2011 | CN102037050A Heat-curing epoxy resin composition comprising an accelerator having heteroatoms |
| 04/27/2011 | CN102037049A Adducts of epoxy resins and process for preparing the same |
| 04/27/2011 | CN102037047A Adducts of epoxy resins derived from alkanolamides and a process for preparing the same |
| 04/27/2011 | CN102037046A Epoxy resins derived from seed oil based alkanolamides and a process for preparing the same |
| 04/27/2011 | CN102037045A Epoxy resins derived from non-seed oil based alkanolamides and a process for preparing the same |
| 04/27/2011 | CN102031008A Production method of thin prepreg with high-content filler adhesive system |
| 04/27/2011 | CN102030987A Corrosion-resistant film and product containing same |
| 04/27/2011 | CN102030985A Method for preparing carbon fiber reinforced cyanate resin-based composite material |
| 04/27/2011 | CN102030970A Epoxy resin composition for packaging electronic element and preparation method thereof |
| 04/27/2011 | CN102030969A Synthetic resin composition for pouring low-voltage bus on site |
| 04/27/2011 | CN102030968A Epoxy resin composition for encapsulating semiconductor device and preparation method thereof |
| 04/27/2011 | CN102030938A Foamed neutron absorber material |
| 04/27/2011 | CN102030913A Method for preparing novel epoxy resin film |
| 04/27/2011 | CN102030888A Thickening agent |
| 04/27/2011 | CN102030848A Macromolecular flame retardant and preparation method thereof |
| 04/27/2011 | CN101508825B Epoxy resin embedding glue and method for producing the same |