| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 10/19/2011 | CN102224199A Curing agents for epoxy resins |
| 10/19/2011 | CN102224198A Phase separated curable compositions |
| 10/19/2011 | CN102219983A Stiffener film substrate combination, preparation method of stiffener film substrate combination, stiffener film and steel plate composite material |
| 10/19/2011 | CN102219970A Conductive composition, electrophotographic belt, image forming apparatus, and method of manufacturing conductive composition |
| 10/19/2011 | CN102219910A Novel technology of novel cellulose dissolving |
| 10/18/2011 | US8039560 Low dielectric brominated resin with a symmetric or saturated heterocyclic alphatic molecular structure and the preparation thereof |
| 10/18/2011 | US8039551 Modified epoxy resins comprising the reaction product of rosin and a linking molecule and aqueous dispersions and coatings comprising such resins |
| 10/18/2011 | US8039530 High thermal conductivity materials with grafted surface functional groups |
| 10/18/2011 | US8039109 Epoxy resins with improved burn properties |
| 10/13/2011 | WO2011126070A1 Resin composition, prepreg and laminate |
| 10/13/2011 | WO2011125962A1 Epoxy resin composition and cured product thereof |
| 10/13/2011 | WO2011125939A1 Optical waveguide structure and electronic apparatus |
| 10/13/2011 | WO2011125821A1 Thermosetting resin composition and printed wiring board |
| 10/13/2011 | WO2011125665A1 Benzoxazine-ring-containing theremosetting resin composition, process for production thereof, and molded products and cured products thereof |
| 10/13/2011 | WO2011125624A1 Epoxy resin based molding material for use in sealing, and electronic components and devices |
| 10/13/2011 | US20110251305 Epoxy composition for encapsulating an optical semiconductor element |
| 10/13/2011 | US20110250502 Chemically gelled curable composition based on epoxy-amine resins and on ionic liquids |
| 10/13/2011 | US20110250458 Low coefficient of thermal expansion (cte) thermosetting resins for integrated circuit applications |
| 10/13/2011 | US20110247756 Homogeneous bismaleimide - triazine - epoxy compositions useful for the manufacture of electrical laminates |
| 10/12/2011 | EP2373729A1 Composite material for the protection of h2o sensitive devices based on surface functionalized nanozeolites dispersed in a polymeric matrix |
| 10/12/2011 | EP2373727A1 Nanocalcite composites |
| 10/12/2011 | EP2373613A1 Linear amine functionalized poly(trimethylene ether) compositions |
| 10/12/2011 | CN102216394A Thermosetting resin composition and prepreg utilizing same |
| 10/12/2011 | CN102216393A Composite compositions and composites |
| 10/12/2011 | CN102216387A Method for producing composition of polymerizable organic compound containing silica particles |
| 10/12/2011 | CN102216070A Colored laminate metal sheet for containers |
| 10/12/2011 | CN102214804A Method for encapsulating photo-electronic device |
| 10/12/2011 | CN102214803A Packaging method of photoelectronic device |
| 10/12/2011 | CN102212273A Heat-conducting material used for solar photoelectricity-heat conversion equipment and preparation method thereof |
| 10/12/2011 | CN102212250A Filler compound and copper clad laminate made of same |
| 10/12/2011 | CN102212249A Epoxy resin composition and semiconductor device |
| 10/12/2011 | CN102212248A Preparation method for functional fiberglass-reinforced epoxy resin composite material |
| 10/12/2011 | CN102212247A Aqueous epoxy resin composition and preparation method thereof |
| 10/12/2011 | CN102212246A Epoxy composition for encapsulating an optical semiconductor element, manufacturing method thereof and cured product |
| 10/12/2011 | CN102211984A Epoxy molding compound, epoxy resin and preparation methods thereof |
| 10/12/2011 | CN101792575B High light guiding and uniformizing resin |
| 10/12/2011 | CN101343399B Immingled filling material filled polyurethane modified epoxy resin embedding material and preparation method |
| 10/11/2011 | US8034872 Oligomers and polymers containing hydrolysates and/or condensates of epoxide groups and silane groups, method for their production and use thereof |
| 10/11/2011 | US8034453 Composite materials with improved burn properties |
| 10/06/2011 | WO2011122631A1 Prepreg, fiber-reinforced composite material, and method for producing prepreg |
| 10/06/2011 | WO2011122211A1 Method for fabricating resin composition for sealing semiconductors, and pulverizer |
| 10/06/2011 | WO2011122161A1 Thermosetting resin composition, cured material thereof, and printed wiring board using cured material |
| 10/06/2011 | WO2011056499A3 Thermal interface material with epoxidized nutshell oil |
| 10/06/2011 | US20110245431 Low dielectric brominated resin with a symmetric or saturated heterocyclic alphatic molecular structure and the preparation thereof |
| 10/06/2011 | US20110245393 Branched low profile additives and methods of production |
| 10/06/2011 | US20110245391 Dispersions comprising functionalized oxidic nanoparticles |
| 10/06/2011 | US20110245378 Nanomaterial-reinforced resins and related materials |
| 10/06/2011 | US20110245376 Nanocalcite composites |
| 10/06/2011 | US20110245375 Curable composition comprising a thermolatent base |
| 10/06/2011 | US20110245363 Photo-sensitive resin composition and a protective film for printed circuit board having superior heat resistant and mechanical property |
| 10/06/2011 | US20110243873 Rheology modifier polymer |
| 10/06/2011 | US20110241228 Epoxy resin composition for sealing packing of semiconductor, semiconductor device, and manufacturing method thereof |
| 10/06/2011 | US20110241227 Liquid resin composition and semiconductor device |
| 10/06/2011 | US20110241188 Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device |
| 10/06/2011 | US20110241048 Resin composition, reflector for light-emitting semiconductor device, and light-emitting semiconductor unit |
| 10/06/2011 | US20110240906 Stabilizers for polymers containing aliphatically-bound bromine |
| 10/05/2011 | EP2371903A2 Gear for an electric power steering device the gear comprising a polyamide composition |
| 10/05/2011 | EP1888680B1 Unsaturated polyester resin or vinyl ester resin composition |
| 10/05/2011 | EP1568723B1 Photo- and thermo-setting resin composition and printed wiring boards made by using the same |
| 10/05/2011 | EP1509560B1 Actinic radiation curable compositions and their use |
| 10/05/2011 | CN102209754A Resin composition for printed wiring board |
| 10/05/2011 | CN102206415A Resin composition, and prepreg, laminate and circuit board containing the composition |
| 10/05/2011 | CN102206401A Halogen-free flame-retardant epoxy resin composition and preparation method thereof |
| 10/05/2011 | CN102206400A Enhancement paster matrix, enhancement paster and steel plate composite material |
| 10/05/2011 | CN102206399A Composition for copper-clad laminate with low dielectric constant and copper-clad laminate manufactured by using same |
| 10/05/2011 | CN102206398A Liquid epoxy underfill, preparation method and application thereof |
| 10/05/2011 | CN102206397A Resin composition as well as semi-solidified rubber sheet, laminating board and circuit board containing same |
| 10/05/2011 | CN102206326A Multielement hydroxyl resin, epoxy resin, methods of manufacturing multielement hydroxyl resin and epoxy resin, epoxy resin composition and cured resin comprising multielement hydroxyl resin and epoxy resin |
| 10/05/2011 | CN102205225A Method for preparing enhanced epoxy resin/curing agent double-wall microcapsule |
| 10/05/2011 | CN101851397B Synthetic resin and ultraviolet photo-curing adhesive prepared by using the same |
| 10/05/2011 | CN101798465B Composite material capable of releasing volatile substances persistently and preparation method thereof |
| 10/05/2011 | CN101735568B Epoxy resin component used for blades of wind driven generator |
| 10/05/2011 | CN101585821B Preparing methods of liquid crystal epoxy resin oligomer and epoxy resin composition |
| 10/05/2011 | CN101460404B Spherical sintered ferrite particle, semiconductor sealing resin composition making use of the same and semiconductor device obtained therewith |
| 10/05/2011 | CN101313007B Cured composition |
| 10/04/2011 | US8030431 curable bi- or polyfunctional aromatic cyanate or a prepolymer formed from at least one bi- or polyfunctional aromatic cyanate |
| 10/04/2011 | US8030401 Photoinitiated cationic epoxy compositions |
| 09/29/2011 | WO2011118584A1 Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board |
| 09/29/2011 | WO2011118157A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device using same |
| 09/29/2011 | WO2011117229A2 Epoxy resin composition with reduced toxicity |
| 09/29/2011 | WO2011054945A3 Use of guanidine derivatives as curing accelerators for epoxy resins |
| 09/29/2011 | US20110237761 Siloxane Mixtures Containing Epoxide Resins and Method for the Preparation Thereof and Use Thereof |
| 09/29/2011 | US20110237712 Ceramic powder and use thereof |
| 09/29/2011 | US20110236673 Coated articles and multi-layer coatings |
| 09/29/2011 | US20110236667 Polyurethane-modified alkyd resin dispersions |
| 09/29/2011 | CA2794482A1 Nanomaterial-reinforced resins and related materials |
| 09/29/2011 | CA2788739A1 Epoxy resin composition with reduced toxicity |
| 09/28/2011 | EP2368939A1 Resin composition for optical material, and resin film for optical material |
| 09/28/2011 | EP2368930A1 Novel low dielectric resin varnish composition for laminates and the preparation thereof |
| 09/28/2011 | EP2368929A1 Epoxy resin composition, prepreg, laminate board and multilayer board |
| 09/28/2011 | EP1760133B1 Adhesive agent composition and adhesive film for electronic component |
| 09/28/2011 | CN102199362A Recycling method for scrapped thermosetting plastic parts |
| 09/28/2011 | CN102199351A Thermosetting resin composition, prepreg and laminated board |
| 09/28/2011 | CN102199334A Method for preparing polybenzimidazole functionalized carbon tube-enhanced acidification polyether amine compound |
| 09/28/2011 | CN101432358B Epoxy resin composition for fiber-reinforced composite material |
| 09/28/2011 | CN101428705B Phase-change fire resistant conveyer belt |
| 09/28/2011 | CN101230157B Rubber composition for tire tread and pneumatic tire using the same |
| 09/27/2011 | US8026321 Adhesive of epoxy compound, epoxy-reactive monomer and tri- and tetra-functional acrylate accelerators |
| 09/27/2011 | US8026320 Cationic electrodeposition coating composition |
| 09/27/2011 | US8026310 Coating powder of epoxy resin, styrene-maleimide curing agent and a second curing agent |