Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
07/2010
07/21/2010CN101783387A Giant magnetoresistance composite material
07/21/2010CN101781461A Electrostriction composite material and preparation method thereof
07/21/2010CN101781444A Method for preparing rare-earth-modified glass-fiber epoxy-resin composite materials
07/21/2010CN101781443A Thermosetting solder masking film composite
07/21/2010CN101781442A Halogen-free resin glue and film manufactured from same
07/21/2010CN101781427A Shape memory polymer stretchable displayer substrate and methods for preparing same
07/21/2010CN101293970B Preliminary dip material for wind-driven generator impeller vane
07/21/2010CN101270278B Netted sand prevention material
07/21/2010CN101168616B Method for preparing polysaccharide nano particle grafting polyester modified polylactic acid material
07/20/2010US7759436 Substrate adhesion, reduced cure temperatures, simple production; electrocoatings
07/20/2010US7759435 Adducts and curable compositions using same
07/20/2010US7758951 fibers are impregnated with a blends containing polyamideimide resin and thermosetting epoxy resin; excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages; excellent adhesion
07/15/2010WO2010080459A1 Nanocalcite composites
07/15/2010WO2010080400A1 Metal stabilizers for epoxy resins and advancement process
07/15/2010WO2010078689A1 Metallic compounds in non-brominated flame retardant epoxy resins
07/15/2010WO2010078688A1 Metal stabilizers for epoxy resins
07/15/2010US20100179276 Adhesive and sealant systems
07/15/2010US20100178495 Chopped fiber bundle, molding material, and fiber reinforced plastic, and process for producing them
07/15/2010US20100178358 Polysaccharide-based impregnated solid material with improved stability, processes for the preparation thereof and impregnating solutions used
07/15/2010US20100176344 Wavelength-converting casting composition and light-emitting semiconductor component
07/14/2010EP2207408A1 Magnetic sheet
07/14/2010EP2206745A1 Active energy ray-curable composition and method for producing the same
07/14/2010EP1689816B1 Curable silicone composition and cured product thereof
07/14/2010CN1768112B Epoxy resin molding material for sealing use and semiconductor device
07/14/2010CN101778901A Two part crash durable epoxy adhesives
07/14/2010CN101778882A 环氧树脂组合物 The epoxy resin composition
07/14/2010CN101775228A High-strength FRP material and production method and application thereof
07/14/2010CN101775209A Polymer film sound absorbing material and preparation method thereof
07/14/2010CN101775197A Viscosity reducible radiation curable resin composition
07/14/2010CN101775196A Preparation method of novel quinone amine curing agent and application to normal temperature epoxy curing system
07/14/2010CN101775195A Composition for manufacturing antenna base and method for preparing base
07/14/2010CN101775194A Carbon nano tube/epoxide resin composite material and preparation method thereof
07/14/2010CN101775193A Intermediate of damping pad for automobile and preparation method thereof
07/14/2010CN101775192A Injection moulding-based high-efficiency heavy-duty transmission nut material, method and device
07/14/2010CN101775191A Maneuverable taper cavity filling material of hydraulic rotary crusher
07/14/2010CN101775177A Polyurethane fiber-reinforced shape memory polymer composite material
07/14/2010CN101775150A Reflecting material and production method thereof
07/14/2010CN101774245A Method for manufacturing fiber resin reinforced composite pipe through centrifugal casting
07/14/2010CN101240109B Resin composition and semi-solidifying sheet for printed board prepared from the same
07/14/2010CN101210077B Halogen-free refractory composition
07/13/2010US7754824 Thermally curable mixture of a polyol, particularly Boltorn; a cycloaliphatic epoxide such as 3,4-epoxycyclohexyl methyl-3,4-epoxy-cyclohexanecarboxylate; and S-butylthiophene hexafluoroantimonate and ammonium hexafluoroantimonate as initiators; cured product is heat resistant and is transparent
07/13/2010US7754792 Flame-retardant polyester artificial hair
07/13/2010US7754790 Epoxy acrylate, a resin component having no unsaturated double bond; a bis(methacryloyloxyethyl) hydrogen phosphate; and a radical polymerization initiator; low-temperature curability, high adhesion, high reliability
07/13/2010US7754322 Composite materials with blend of thermoplastic particles
07/13/2010CA2601950C Latent hardener for epoxy resin and epoxy resin composition
07/13/2010CA2445721C Moulding composition for producing bipolar plates
07/08/2010WO2010077069A2 Plastic composition, and prepreg and printed circuit board using the same
07/08/2010WO2010054989A3 Anti-slip coating
07/08/2010US20100174016 Nanofiller-containing epoxy resins and stable aqueous dispersions thereof
07/08/2010US20100173164 Adhesive film and semiconductor device having the same
07/08/2010DE102009058318A1 Harzzusammensetzung und diese umfassender Formgegenstand Resin composition and molded article this comprehensive
07/08/2010DE102008063442A1 Preparation of polymeric materials based on renewable raw materials comprises mixing non-petrochemical based material with epoxidized triglyceride, polycarboxylic acid, and ascorbic acid
07/07/2010EP2203519A1 Sulfonate esters as latent acid catalysts
07/07/2010EP2203516A2 Compositions comprising cationic fluorinated ether, silanes, and related methods
07/07/2010EP2203511A1 Polymer material and method for the production thereof
07/07/2010EP1171925B1 Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds
07/07/2010CN101772546A Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers
07/07/2010CN101772526A Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device
07/07/2010CN101772521A Resin material for optical purposes, and optical element utilizing the same
07/07/2010CN101768330A Ingredient for preparing transparent flame-retardant epoxy resin
07/07/2010CN101768329A Carbon nano tube/epoxide resin nano composite material and preparation method
07/07/2010CN101768328A Bonding film and used resin thereof
07/07/2010CN101768327A Halogen-free bonding film and resin used for same
07/07/2010CN101768290A Modified phosphorous slag used as plastic filler and preparation method thereof
07/07/2010CN101768245A Naphthol resin, epoxy resin, epoxy resin composition, and solidified products thereof
07/07/2010CN101767558A Compound rear protective plate of truck
07/07/2010CN101767556A Composite automobile bumper
07/07/2010CN101186742B Shape memory composite material and preparation method thereof
07/06/2010US7750107 An optionally halogenated bisphenol A or bisphenol F epoxy resin, a resorcinol epoxy resin or a tetrakis(hydroxyphenyl)ethane epoxy resin; dicyandiamide as a latent hardener for the epoxy resin, and assymetrical N,N-dimethylurea as an accelerator; powder coatings, electrical laminates, and adhesives
07/06/2010US7749604 Storage-stable aqueous dispersion of a polyurethane; epoxy resin, which is a reaction product of a compound having an epoxide group and a diol or polyol, to a solvent solution of a polyurethane having hydrophilic groups; dispersing in water; and adding an amine crosslinking agent; paper coatings
07/01/2010WO2010074970A2 Polymer thermal interface materials
07/01/2010WO2010074085A1 Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board, and semiconductor device
07/01/2010WO2010074014A1 Polyimide resin, curable polyimide resin composition, and cured product
07/01/2010WO2010073981A1 Curable composition
07/01/2010WO2010073559A1 Liquid resin composition and semiconductor device
07/01/2010WO2010073422A1 Light-cured magnetic resin composition and magnetic three-dimensional structure using the same
07/01/2010US20100168280 Process for preparing a self-healing composite material
07/01/2010US20100168279 Thermally curable epoxy-amine barrier sealants
07/01/2010US20100166607 Printable hydrogels for biosensors
07/01/2010US20100164134 Method of making models
07/01/2010US20100164127 Epoxy resin composition for photosemiconductor element encapsulation and cured product thereof, and photosemiconductor device using the same
07/01/2010US20100163424 Coating compositions with branched phosphorous-containing resin
07/01/2010DE102009053115A1 Selbstheilendes und kratzresistentes Formgedächtnispolymersystem Self-healing and scratch-resistant, shape-memory polymer system
07/01/2010DE102008037468A1 Imprägnierharz Impregnating
07/01/2010CA2748175A1 Liquid resin composition and semiconductor device
06/2010
06/30/2010CN101760030A Modified asphalt used under severe cold condition and application thereof
06/30/2010CN101760016A Flame-retarded enhanced PA66 composite special for wire connector box
06/30/2010CN101759981A Scale-free low-volatility polycarbonate compound
06/30/2010CN101759978A Flame-retardant high-gloss PC/ABS (polycarbonate/acrylonitrile butadiene styrene) composite
06/30/2010CN101759973A Preparation method for thermoset resin/waste rubber powder/waste tire fiber composite material
06/30/2010CN101759962A Flame-retardant enhancement type PBT/ABS (polybutylene terephthalate/acrylonitrile butadiene styrene) alloy
06/30/2010CN101759960A Epoxy resin composition
06/30/2010CN101759940A Formulation of environment-friendly chlorosulfonated polyethylene rubber
06/30/2010CN101759859A Production method of epoxy resin emulsion film-forming agent for direct-roving treating compound
06/30/2010CN101759670A Perfluoroalkoxy epoxy compound, preparation method and purpose thereof
06/30/2010CN101758622A Preparation method of novel energy-saving environment-friendly building board
06/29/2010US7745549 Reacting an aromatic di- or triglycidyl ether with an aromatic diamine to form a composite having increased distortional deformation, and/or decreased dilatation load, in order to increase von Mises strain within the composition
06/29/2010US7745515 obtained by reacting: phenolic products from reaction of di- or multifunctional epoxy resin and di-functional phenolic compounds; mono- or di-functional primary amines; di-functional phenols; and formaldehyde or paraformaldehyde; with one or more epoxy resins, novolac resin curing agents, curing promoter
06/29/2010US7745006 Epoxy resin and ethylenediamine hardener; enhanced adhesion to sheet molding compound; catechol synergistic accelerator; rapid reaction with reduced brittleness
06/24/2010WO2010071165A1 Epoxy resin composition, prepreg, laminate board and multilayer board
1 ... 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 ... 246