| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 12/15/2010 | CN101914296A Metal fiber reinforced polymeric matrix composite material and preparation method thereof |
| 12/15/2010 | CN101914270A Special Anti-yellowing PBT (Polybutylene Terephthalate) plastic shell material of energy-saving lamp with lampshade and production method thereof |
| 12/15/2010 | CN101914268A Calcium carbonate and epoxy resin mixed particle for coating and manufacture process thereof |
| 12/15/2010 | CN101914267A High-performance epoxy resin composition for pulling and extrusion and preparation method thereof |
| 12/15/2010 | CN101914266A Insulating material for motor collecting ring |
| 12/15/2010 | CN101914265A Non-halogen phosphorus-containing flame retardant high-frequency epoxy resin composition and application thereof to bonding sheet and copper-clad plate |
| 12/15/2010 | CN101914264A Electric-insulation heat-conduction epoxy resin composite material and preparation method thereof |
| 12/15/2010 | CN101914263A Polyimide siloxane/epoxy resin blend and preparation method thereof |
| 12/15/2010 | CN101914260A Flame-retardant ACS resin and manufacturing method thereof |
| 12/15/2010 | CN101914242A Ultrahigh molecular weight polypropylene/ultrahigh molecular weight polythene/epoxy resin composite membrane |
| 12/15/2010 | CN101914230A Preparation method of weldable damping adhesive for vehicle vibration-damping plate |
| 12/15/2010 | CN101914196A Curing composition and preparation method and application thereof |
| 12/15/2010 | CN101914195A Heat-resistant epoxy resin compound for forming RTM, epoxy base resin and preparation method thereof |
| 12/15/2010 | CN101914194A Self-emulsified nonionic terpenyl epoxy resin polyalcohol emulsion and preparation method and application |
| 12/15/2010 | CN101440177B Preparation of polymer solid electrolyte |
| 12/15/2010 | CN101423651B Process for preparing low temperature, high heat conducting and electrical insulation epoxy resin nano composite material |
| 12/15/2010 | CN101376736B Carbon fibre bar containing super fine and preparation thereof |
| 12/15/2010 | CN101357996B Multi-microporous epoxy thermosetting resin, preparation method and application thereof |
| 12/15/2010 | CN101353441B Method and apparatus for modifying waste printed circuit board composite non-metal powder |
| 12/15/2010 | CN101280093B Halogen-free flame-retardant epoxy resin composition, flexible copper clad laminate made therefrom and preparation of the flexible copper clad laminate |
| 12/14/2010 | US7851520 Thermosetting epoxy resin composition |
| 12/09/2010 | WO2010141069A2 Pure peg-lipid conjugates |
| 12/09/2010 | WO2010140674A1 Epoxy resin composition, prepreg and cured products thereof |
| 12/09/2010 | WO2010140351A1 Epoxy resin composition, prepreg and fiber-reinforced composite material |
| 12/09/2010 | WO2010140331A1 Resin composition for semiconductor encapsulation, and semiconductor device |
| 12/09/2010 | US20100311891 Thermosetting compositions comprising silicone polyethers, their manufacture, and uses |
| 12/09/2010 | US20100311872 Aqueous Dispersions And Methods Of Making Same |
| 12/09/2010 | US20100311871 Colloidal silica particles, process for producing the same, and organic solvent-dispersed silica sol, polymerizable compound-dispersed silica sol, and dicarboxylic anhydride-dispersed silica sol each obtained from the same |
| 12/09/2010 | US20100311870 Water-borne epoxy resin systems |
| 12/09/2010 | US20100311867 Resin Composition for Manufacturing Marble Chips, Method for Manufacturing Marble Chips, and Artificial Marble Made From Marble Chips |
| 12/09/2010 | US20100310878 Wash-out resistant heat-curing epoxy resin adhesives |
| 12/09/2010 | US20100310849 Solid powder formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards |
| 12/09/2010 | US20100310835 Coating Agent for Plastic Label, and Plastic Label |
| 12/09/2010 | US20100308477 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 12/09/2010 | US20100308008 Nanoimprint resist, nanoimprint mold and nanoimprint lithography |
| 12/09/2010 | CA2763819A1 Pure peg-lipid conjugates |
| 12/08/2010 | EP2258773A1 Epoxy resin |
| 12/08/2010 | EP2258772A1 Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device Using the Same |
| 12/08/2010 | EP2258741A1 Resin composition for optical components and optical component using the same |
| 12/08/2010 | CN1958664B 液状环氧树脂组合物 A liquid epoxy resin composition |
| 12/08/2010 | CN1938377B Composition curable by both free-radical photocuring and cationic photocuring |
| 12/08/2010 | CN1927443B Ureaformaldehyde resin coating epoxy microcapsule for material self-repair and preparing method thereof |
| 12/08/2010 | CN1923484B Polymer concrete for airfield runway quick renovation and preparation method thereof |
| 12/08/2010 | CN1908065B Epoxy resin composition and semiconductor device |
| 12/08/2010 | CN101910301A Reinforced resin composition for plating base, molded article, and electroplated component |
| 12/08/2010 | CN101910297A Reinforced thermoplastic resin composition and molded article |
| 12/08/2010 | CN101910241A Thermosetting resin composition and prepreg and laminate both made with the same |
| 12/08/2010 | CN101910239A Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
| 12/08/2010 | CN101910237A Epoxy resin composition, prepreg, metal clad laminate and multilayer printed wiring board |
| 12/08/2010 | CN101906239A Halogen-free flame-retardant resin composition and application thereof in manufacturing copper-clad plate |
| 12/08/2010 | CN101906238A Epoxy resin composition and semiconductor device |
| 12/08/2010 | CN101906237A Formula of magnetic slot wedge |
| 12/08/2010 | CN101906236A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 12/08/2010 | CN101906206A Fast curable epoxy compositions containing imidazole- and 1-(aminoalkyl) imidazole-isocyanate adducts |
| 12/08/2010 | CN101634130B Preparation method of epoxy asphalt road surface materials |
| 12/08/2010 | CN101580620B Conductive polymer nanometer composite material and preparation method thereof |
| 12/08/2010 | CN101358019B Anti-ultraviolet multiple nano particle epoxy resin composite material and preparation method thereof |
| 12/08/2010 | CN101328276B Preparation of single wall carbon nanotube-polymer conductive composite film |
| 12/08/2010 | CN101173159B Epoxy resin encapsulating material composition |
| 12/08/2010 | CN101142280B Curable silicone composition and electronic device produced therefrom |
| 12/07/2010 | US7847034 Adducts and curable compositions using same |
| 12/07/2010 | US7847007 Light-diffusing resin composition |
| 12/07/2010 | US7846998 Sealant epoxy-resin molding material, and electronic component device |
| 12/07/2010 | CA2562956C Emulsion containing epoxy resin |
| 12/02/2010 | WO2010138346A1 Polymeric glycidyl ethers reactive diluents |
| 12/02/2010 | WO2010136772A1 Engineered crosslinked thermoplastic particles for interlaminar toughening |
| 12/02/2010 | WO2010136725A1 Novel method for producing thermosetting epoxy resins |
| 12/02/2010 | US20100305274 Particle-toughened polymer compositions |
| 12/02/2010 | US20100305273 Reaction resin comprising core-shell particles and method for the production thereof and the use thereof |
| 12/02/2010 | US20100305237 Silica-containing epoxy curing agent and cured epoxy resin product |
| 12/02/2010 | US20100305236 Adhesives |
| 12/02/2010 | US20100300885 Cationic electrodeposition coating composition |
| 12/02/2010 | CA2778920A1 Engineered cross-linked thermoplastic particles for interlaminar toughening |
| 12/02/2010 | CA2759184A1 Engineered crosslinked thermoplastic particles for interlaminar toughening |
| 12/01/2010 | EP2256163A1 Epoxy resin composition, fiber-reinforced composite material and method for producing the same |
| 12/01/2010 | EP2254875A2 Halogen-free benzoxazine based curable compositions for high tg applications |
| 12/01/2010 | CN101903999A Method of coating fine wires and curable composition therefor |
| 12/01/2010 | CN101903465A Thermoplast-containing epoxy resins and the processing thereof by extrusion or injection molding |
| 12/01/2010 | CN101903437A Film-like resin composition for encapsulation filling, method for manufacturing semiconductor package or semiconductor device using the same, and semiconductor device |
| 12/01/2010 | CN101899196A Water-borne phenolic epoxy resin emulsion and preparation method thereof |
| 12/01/2010 | CN101899195A Dam composition and method for fabrication of multilayer semiconductor device |
| 12/01/2010 | CN101899194A Single-component epoxy resin composition |
| 12/01/2010 | CN101899155A Benzoxazine resin based on furfuryl amine, composition and preparation method thereof |
| 12/01/2010 | CN101497244B Method for producing assorted fiber composite mast |
| 12/01/2010 | CN101445646B Preparation method of polymeric based carbon nano tube composite material in the technical field of nano-materials |
| 12/01/2010 | CN101128502B Latent hardener for epoxy resin and epoxy resin composition |
| 11/30/2010 | US7842288 Marine anti-bio-fouling coating and a method of applying the coating |
| 11/30/2010 | US7842177 Melting addition polymer or epoxy resin with curing agents; blending; cooling ; uniformity |
| 11/25/2010 | WO2010135393A1 Dopo-derived flame retardant and epoxy resin composition |
| 11/25/2010 | US20100298505 Liquid resin composition for abrasive articles |
| 11/25/2010 | US20100298491 Adamantane derivative, resin composition containing same, and optoelectronic member and sealing agent for electronic circuit using those |
| 11/25/2010 | US20100298469 Effect pigments based on substrates formed from inorganic-organic mixed phases, production and use thereof |
| 11/25/2010 | US20100298468 Epoxy resins with improved flexural properties |
| 11/25/2010 | US20100297356 Process for the preparation of a crosslinker composition |
| 11/25/2010 | CA2761753A1 Dopo-derived flame retardant and epoxy resin composition |
| 11/24/2010 | EP2253666A1 Curable resin composition and cured resin |
| 11/24/2010 | CN1934190B Epoxy resin composition for the encapsulation of semiconductors and semiconductor devices |
| 11/24/2010 | CN101896549A Photosemiconductor package sealing resin material |
| 11/24/2010 | CN101896548A Epoxy-phenolic resins co-dispersions |
| 11/24/2010 | CN101896529A Solid power formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards |