Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
11/2010
11/24/2010CN101893727A High-efficiency light diffusing polymeric film and manufacturing method thereof
11/24/2010CN101891942A Method for preparing nanocomposite hybrid multi-dimension material
11/24/2010CN101891936A Preparation method of composite material based on epoxy resin and phosphazene nanotubes
11/24/2010CN101891935A Epoxy resin composition capable of foaming at room temperature and preparation method thereof
11/24/2010CN101891902A Method for recycling waste epoxy resin
11/24/2010CN101177519B Upgrading epoxy resin composition
11/23/2010US7838114 Thermosetting resin composition and use thereof
11/18/2010WO2010132876A1 Polymers for delivering a substance into a cell
11/18/2010WO2010132519A2 A film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles
11/18/2010WO2010132510A2 Composite of a polymer and surface modified hexagonal boron nitride particles
11/18/2010US20100291314 Self-hardening material and process for layerwise formation of models
11/18/2010DE102009003132A1 Kunststoffformmasse sowie Verfahren zu deren Herstellung Plastics molding composition as well as processes for their preparation
11/17/2010EP2251369A1 One-pack type epoxy resin composition and use thereof
11/17/2010CN1938356B Hardenable composition
11/17/2010CN101889051A Vibration-damping reinforcing composition, vibration-damping reinforcing member, and vibration-damping reinforcing method for thin plate
11/17/2010CN101888995A Peroxide composition
11/17/2010CN101886814A Anticorrosion method of chimney used for discharging wet-method desulfurized fume
11/17/2010CN101885922A Polymer material with two-photon amplitude limiting characteristic and preparation method and usage thereof
11/17/2010CN101885901A Biphenyl-structure-contained epoxy resin/montmorillonite nano composite material
11/17/2010CN101885900A Resin composition, bonding sheet and copper-clad plate made using same, manufacturing method thereof
11/17/2010CN101885899A Resin composition for optical components and optical component using the same
11/17/2010CN101885898A Composite material for repairing defective pipeline
11/17/2010CN101885860A Expansible composite flame retardant and flame retardant material containing same
11/17/2010CN101885832A Preparation and application of latent nonionic self-emulsifying epoxy curing agent
11/17/2010CN101367997B Process for producing epoxy resin MC nylon composite material
11/17/2010CN101343403B Halogen-free flame retardant epoxy resin composition and preparation thereof
11/17/2010CN101328305B Halogen-free flame-retardant PBT/PC alloy composition and method of preparing the same
11/17/2010CN101096442B Method of resin composition for producing environmental friendly highly-durable dip welding flame-resistant paper-based copper-coated board
11/16/2010US7834105 Thiol-, hydroxyl-, amine- or vinyl-terminated polythioethers
11/16/2010US7834101 epoxidized linseed oil and an epoxy tallate, octyl epoxytallate; improvement of the surface smoothness of molded composites such as SMC (sheet molding compound)
11/16/2010US7834091 Bonding surfaces with two-component adhesive of epoxy resins and amine compound
11/11/2010WO2010128895A1 Method for roducing a fire-resistant binder for composite materials produced in the pultrusion process, fire-resistant binder and article
11/11/2010WO2010128568A1 Curable resin and composite material
11/11/2010WO2010127907A1 Curable system
11/11/2010WO2010104603A3 Radiation curable resin composition and rapid three-dimensional imaging process using the same
11/11/2010US20100286345 Phenalkamine and Salted Amine Blends as Curing Agents for Epoxy Resins
11/11/2010US20100286302 Curing composition and cured product prepared by using the same
11/11/2010US20100283171 Self-Repairing Concrete Having Carbamide Resin Polymer Micro-Capsules and Method for Fabricating Same
11/10/2010EP2248856A2 Resin composition for manufacturing marble chips, method for manufacturing marble chips using the same, and artificial marble made from marble chips
11/10/2010EP2248855A1 Process for producing resin composition with partial-discharge resistance, resin composition with partial-discharge resistance, and insulating material with partial-discharge resistance
11/10/2010EP2118165B1 Aqueous epoxy resin compositions
11/10/2010CN1423678B Flame retardant phosphorus element-containing epoxy resin compositions
11/10/2010CN101882584A Heat-conducting insulating composite substrate and preparation method thereof
11/10/2010CN101880444A Heterocycle structure contained chain elongation type bismaleimide toughened and strengthened epoxy resin and preparation method thereof
11/10/2010CN101880443A Low-viscosity epoxy resin system for resin transfer molding and preparation and using method thereof
11/10/2010CN101880442A Epoxy resin and nano inorganic particle compounded foam material and preparation method thereof
11/10/2010CN101880441A Epoxy resin composition as well as bonding sheet and copper-clad plate made from same
11/10/2010CN101880440A Novel nano-composite double network hydrogel and preparation method thereof
11/10/2010CN101880439A Elastic epoxy resin
11/10/2010CN101880407A Method for preparing modified epoxy soybean oil for electronic grade product copper clad laminate
11/10/2010CN101880395A Polymer type phosphorous flame retardant containing DOPO and preparation method thereof
11/10/2010CN101880375A Special curing agent for high-thermal-conductivity epoxy resin potting material, and potting material prepared from the same
11/10/2010CN101880374A Silicon framework hyperbranched epoxy resin and preparation method thereof
11/10/2010CN101348600B Self-lubricating type epoxide resin material and preparation thereof
11/10/2010CN101348563B Tough mannich base curing agent and preparation thereof
11/10/2010CN101343383B Cellulose based degradable liquid mulch film
11/10/2010CN101298509B Nanometer grade paligorskite-flame retardant epoxide resin composite material
11/10/2010CN101243117B Thermosetting composition for sealing organic el element
11/10/2010CN101225229B Wet-heat cyanate ester/ composite material and preparation method thereof
11/09/2010US7829639 Composition for conductive layers in electronic devices
11/09/2010US7829188 a crosslinking agent; bimodal particle size distribution of nano-scale particles; smaller particles consist of fumed silica; larger particles consist of spherical silica; low viscosity in the uncured state and low coefficient of thermal expansion in the cured state; multilayer printed circuit boards
11/09/2010CA2616357C Pre-sealed steel sheet with improved anti-corrosion and weldability and preparing method thereof
11/04/2010WO2010127118A1 Thermosettable resin compositions
11/04/2010WO2010126214A1 Pressure-sensitive ink composition, and resistive film and pressure sensing device using the same
11/04/2010WO2010125105A1 Powder coating composition comprising a polyester and a crosslinker with oxirane groups providing improved corrosion resistance to a substrate coated therewith
11/04/2010WO2010011714A3 Reactive liquid modifiers
11/04/2010US20100280167 Impact strength improving agent for epoxy resin compositions
11/04/2010US20100280151 Toughened fiber reinforced polymer composite with core-shell particles
11/04/2010US20100279469 Low-Voiding Die Attach Film, Semiconductor Package, and Processes for Making and Using Same
11/04/2010US20100277788 Electrochromic display module and composition with improved performance
11/04/2010US20100276626 Coating Compound for Automobile Construction
11/04/2010US20100276293 Anti-corrosion system for metals and pigment therefor
11/04/2010DE102009027826A1 Katalyse von Epoxidharzformulierungen Catalysis of epoxy resin formulations
11/03/2010EP2246381A2 Process and apparatus for the cleaning of a resorbable polyester
11/03/2010CN101878240A Silica-containing epoxy curing agent and epoxy resin cured body
11/03/2010CN101280056B Method for preparing C21dicarboxylic acid polyamide epoxy hardener from methyl eleostearate
11/03/2010CN101255277B Flexible epoxy modified asphalt material for bridge surface pavement and preparation thereof
11/03/2010CN101153109B Matched assembly of epoxy additive and method of producing the same
11/02/2010US7825528 epoxidized novolak having a biphenyl diphenol in the molecule and a 4,4'-dihydroxy biphenyl; curing agent is methylenediphenol or a phenol-formaldehyde oligomer; silica filler
11/02/2010US7825198 Thermosetting resin composition and multilayer printed wiring board using the same
11/02/2010US7825197 Composition containing cycloaliphatic epoxide, polyol oligomer, curing agent and curing accelerator
11/02/2010US7825188 thermoplastic elastomer comprising addition (homo/co)polymers and curing agents comprising epoxy resins or compounds
11/02/2010US7824754 and Isopropyltris(dioctylpyrophosphate)titanate coupler; acrylated bisphenol-glycerol epoxy resin; nonunsaturated is a bisphenol-epichlorohydrin resin; insulating adhesive; anisotropically electroconductive adhesive film; curable at low temperature; circuit boards
10/2010
10/28/2010WO2010123314A2 Novel epoxy resin and epoxy resin composition comprising the same
10/28/2010WO2010122995A1 Imidazole compound-containing microcapsulated composition, curable composition using same, and masterbatch type curing agent
10/28/2010WO2010121393A1 Anisotropic composite
10/28/2010WO2010121392A1 Thermosettable composition containing a half ester of a cycloaliphatic diol and a thermoset product therefrom
10/28/2010US20100273940 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition
10/28/2010US20100273905 Thermoplast-containing epoxy resins and the processing thereof by extrusion or injection molding
10/28/2010US20100273005 Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator
10/28/2010US20100273003 Resin composition, prepreg, and laminate
10/28/2010US20100272908 Epoxy-paste adhesives resistant to wash-off
10/28/2010US20100271831 Light-emitting diode device for voltage switchable dielectric material having high aspect ratio particles
10/28/2010US20100270664 Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same
10/28/2010US20100270581 Optical semiconductor package sealing resin material
10/28/2010US20100270362 Composition
10/28/2010US20100270065 Resin Composition For Printed Circuit Board and Printed Circuit Board Using The Same
10/28/2010DE102007063698B4 Optisches Bauelement mit Oberflächenbeschichtung An optical device with surface coating
10/27/2010EP1451011B1 Autodeposition compositions
10/27/2010CN101872139A Conductive roller
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