Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
09/2011
09/07/2011CN102174245A Epoxy asphalt for gravel sealing layer, gravel sealing layer material and gravel sealing layer method
09/07/2011CN102174244A Insulating water-proof epoxy resin composition, adhesive tape and preparation methods thereof
09/07/2011CN102174243A Conductive silver adhesive composition for LED (Light Emitting Diode) die bonding and preparation method
09/07/2011CN102174242A Halogen-free resin composition and prepreg and laminated board made of same
09/07/2011CN102174241A Silver paste for photovoltaic assembly
09/07/2011CN102174231A Color oil-resistant chlorosulfonated polyethylene rubber
09/07/2011CN102174180A Preparation method of low-branched polyester liquid crystal containing biphenyl
09/07/2011CN102174179A Preparation method of heat-resistant polylactic acid biodegradable material
09/07/2011CN102174173A Flame-retardant latent epoxy curing agent and halogen-free flame-retardant one-component epoxy resin composition
09/07/2011CN102174162A Method for synthesizing thermotropic liquid crystal polyurethane containing biphenyl and imido group
09/07/2011CN102173131A Copper foil-coated plate with high electricity leakage tracking index and preparation method thereof
09/07/2011CN101831140B Nucleating agent for preparing polylactic acid and application thereof
09/07/2011CN101432359B Epoxy resin composition for fiber-reinforced composite material
09/07/2011CN101180361B Aqueous liquid containing vinyl-modified epoxy resin, process for producing the same, and water-based coating material
09/07/2011CN101089048B Epoxy-organic silicon mixed resin combination and luminous semiconductor device
09/06/2011US8013075 Curable composition
09/06/2011US8012580 Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
09/01/2011WO2011104997A1 Organic el element, organic el display device, organic el lighting device, and curable composition for sealing agent
09/01/2011WO2011103973A1 Heat-curable compositions including a reinforcement additive against shocks
09/01/2011US20110213096 Curing Agents for Epoxy Resins
09/01/2011US20110213070 Curing accelerator for epoxy resin composition, and one-pack type thermosetting epoxy resin composition
09/01/2011US20110213053 New-type papermaking wet-end defoamer
09/01/2011US20110213052 Method for Producing Dialkylphosphinic Acids and Esters and Salts Thereof by Means of Acrylic Acid Derivatives and Use Thereof
09/01/2011US20110210454 Phase Separated Curable Compositions
09/01/2011DE102011000945A1 Herstellungsverfahren für einen Gegenstand aus Verbundwerkstoff Manufacturing method for an article made of composite material
08/2011
08/31/2011EP2361898A2 Coating systems for cement composite articles
08/31/2011CN102171310A Polymer thermal interface materials
08/31/2011CN102171263A Polyamide resin, resin composition thereof, flame-retardant adhesive composition and adhesive sheet made of said composition, coverlay film, and printed wiring board
08/31/2011CN102168325A Porous carbon fiber and composite microwave-absorbing material based thereon and preparation method of composite microwave-absorbing material
08/31/2011CN102167887A Photovoltaic pump stator plastic package agent and plastic package method thereof
08/31/2011CN102167886A Epoxy resin composition and a method for preparing the same
08/31/2011CN102167799A Preparation method of novel phosphorus-containing biphenyl novolac epoxy resin and condensate of novel phosphorus-containing biphenyl novolac epoxy resin
08/31/2011CN102167707A Retardant plasticizer methyl silicate ester compound and preparation method thereof
08/31/2011CN102166854A Intermediate-Tg lead-free compatible copper foil-covered board and preparation method thereof
08/31/2011CN101787179B Air-drying epoxy vinylit resin and processing technic thereof
08/31/2011CN101629011B Thermosetting epoxy bitumen material for roads and bridges and preparation method thereof
08/31/2011CN101481465B High air temperature adaptive plastic stuffing for crusher
08/31/2011CN101338187B Photoluminescent transparent epoxy nanometer composite material, preparation method and application thereof
08/31/2011CN101220185B Expansion type flame-proof ethylene propylene terpolymer for fire resistant flame
08/31/2011CN101189311B Method for the establishment of a crack resistant epoxy paint coat and paint compositions suitable for said method
08/30/2011US8008410 Epoxy resin composition for encapsulating semiconductor and semiconductor device
08/25/2011WO2011102421A1 Composite particles, method for producing same, and resin composition
08/25/2011WO2011102286A1 Curable composition and cured material
08/25/2011WO2011101874A1 Non-bituminous substance capable of being cold -laid with a spatula and processes for laying such substance
08/25/2011US20110207873 Preparation of di(aminoacetonitrile)s
08/25/2011US20110206847 Apparatus and method of fabricating thin film pattern
08/25/2011US20110205721 Resin composition, resin sheet, prepreg, laminate, multilayer printed wiring board, and semiconductor device
08/25/2011DE102010046930A1 Activated resin composition, useful for surface mounting, comprises an epoxy resin, a carboxylic acid compound, a curing agent and a solvent
08/24/2011EP2358813A2 Curing agents for epoxy resins
08/24/2011CN102165017A Sealant, sealing member and organic EL device
08/24/2011CN102165011A Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device
08/24/2011CN102165010A Epoxy resin composition, prepreg, and fiber-reinforced composite material
08/24/2011CN102164995A Semi-cured body, cured body, multilayer body, method for producing semi-cured body, and method for producing cured body
08/24/2011CN102164981A Photocurable composition
08/24/2011CN102163563A Epoxy resin formulations for underfill applications
08/24/2011CN102161831A Prepreg, laminate, printed wiring board, and semiconductor device
08/24/2011CN102161829A Bismaleimide resin system and preparation method thereof
08/24/2011CN102161815A Epoxy resin composition and semiconductor device using thereof
08/24/2011CN102161814A Preparation method of oriented carbon nano tube/ polymer composite membrane
08/24/2011CN102161747A Method for preparing nitrogen-containing epoxy resin cured material
08/24/2011CN101817970B Hydroxychloroethylene-vinyl acetate modified epoxy resin compound and preparation method thereof
08/24/2011CN101265353B Composition for rare earth-like bonded permanent magnet, magnet prepared by the same and preparation method for the magnet
08/23/2011US8003737 Coating system
08/23/2011US8003216 Heat-conductive dielectric polymer material and heat dissipation substrate containing the same
08/23/2011US8003207 Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device
08/23/2011US8003013 Waterborne corrosion-resistant coating
08/18/2011WO2011100049A2 Phosphorus-containing epoxy resin
08/18/2011WO2011099939A1 Methods for dispersing carbon nanotubes and compositions used for the methods
08/18/2011WO2011099501A1 Curable composition, cured article, and use of curable composition
08/18/2011WO2011098566A1 Resin composition comprising a stable oxyl radical
08/18/2011WO2011098564A1 Multicomponent resin system
08/18/2011WO2011098562A1 Multicomponent resin system
08/18/2011WO2011098561A1 Two component resin system
08/18/2011WO2011063327A3 Toughened epoxy resin formulations
08/18/2011US20110201763 Thermosetting resin composition for optical-semiconductor element encapsulation and cured material thereof, and optical-semiconductor device obtained using the same
08/18/2011US20110201725 Low- melting glass, resin composition comprising same, and resin molded article
08/18/2011US20110200950 Photocurable composition
08/18/2011US20110200824 Method for producing glitter
08/18/2011DE102005043928B4 Optisches Halbleiterbauteil und Verfahren zu dessen Herstellung An optical semiconductor device and process for its preparation
08/17/2011EP1809704B1 Coating compositions containing a carbinol functional silicone resin or an anhydride functional silicone resin
08/17/2011CN102159642A Two-part epoxy-based structural adhesives
08/17/2011CN102159616A Resin composition, cured body and multilayer body
08/17/2011CN102159615A Two-part epoxy-based structural adhesives
08/17/2011CN102159584A Phosphorus-containing phenol compounds, manufacturing method therefor, curable resin compositions and cured products using same
08/17/2011CN102159534A Reactive liquid modifiers
08/17/2011CN102157695A Light producing device
08/17/2011CN102155719A Method for manufacturing insulation lamp socket
08/17/2011CN102154969A Carbon nano-fibre paper heat-conduction concrete self-warming snow-melting deiceing road surface
08/17/2011CN102153963A Hot-melt pressure-sensitive structural adhesive film and preparation technique thereof
08/17/2011CN102153877A Graphene composite material and preparation method thereof
08/17/2011CN102153843A Method for preparing biodegradable polylactic acid composite material
08/17/2011CN102153837A High-performance high-temperature-resistant modified epoxy resin
08/17/2011CN102153836A Ionic liquid layered silicate/epoxide resin nano composite material and preparation method of ionic liquid layered silicate/epoxide resin nano composite material
08/17/2011CN102153835A Modified graphene/epoxy resin composite material and preparation method thereof
08/17/2011CN102153834A Composition for preventing machine-tool type castings from seepage and application thereof
08/17/2011CN102153833A Carbon fiber (powder)/epoxy resin composite material used for rapid prototyping die
08/17/2011CN102153780A Chlorine-containing methyl silicate flame retardant and preparation method thereof
08/17/2011CN102153735A Method for preparing biphenyl thermotropic polyester liquid crystals
08/17/2011CN102153725A Preparation and application of high-performance epoxy bitumen material compatibilizer
08/17/2011CN102152438A Sleeve seat injection molding process
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