| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 06/23/2011 | WO2011075216A1 Epoxy resin curing compositions and epoxy resin systems including same |
| 06/23/2011 | WO2011075126A1 High magnesium surface concentration nanocalcite composites |
| 06/23/2011 | WO2011073906A1 Polyethylene glycol containing composition for shaving |
| 06/23/2011 | US20110152469 Multifunctional additives in engineering thermoplastics |
| 06/23/2011 | US20110152448 Epoxy resin curing compositions and epoxy resin systems including same |
| 06/23/2011 | US20110152435 Resin composition |
| 06/23/2011 | US20110152407 Novel diamino-alcohol compounds, their manufacture and use in epoxy resins |
| 06/23/2011 | US20110151640 Compound for filling small gaps in a semiconductor device, composition including the compound, and method of fabricating a semiconductor capacitor |
| 06/23/2011 | US20110151248 Ceramic Matrix Composite Precursor Slurry Compositions And Sheet Molding Compound |
| 06/23/2011 | US20110151232 Modified Resin Systems for Liquid Resin Infusion Applications & Process Methods Related Thereto |
| 06/23/2011 | US20110147954 Semiconductor device, and resin composition used for semiconductor device |
| 06/23/2011 | CA2784735A1 Epoxy resin curing compositions and epoxy resin systems including same |
| 06/23/2011 | CA2784734A1 Epoxy resin curing compositions and epoxy resin systems including same |
| 06/22/2011 | EP2334711A1 Epoxy resins and composite materials with improved burn properties |
| 06/22/2011 | EP2176311B1 Thermoplastic material post-crosslinkable after transformation and moulded articles stable at a very high temperature and obtained after transformation |
| 06/22/2011 | DE102004006312B4 Mehrschichtige Leiterplatte, ein Verfahren zu deren Herstellung und einen isolierenden Film Multilayer printed wiring board, a process for their preparation and an insulating film |
| 06/22/2011 | CN1944528B Epoxy resin for prepreg, prepreg, fiber-reinforced composite material, and processes for producing same |
| 06/22/2011 | CN102101935A Halogen-free epoxy resin composition and flexible copper clad plate prepared from same |
| 06/22/2011 | CN102101934A Reinforcing rubber sheet base composition, reinforcing rubber sheet base and steel plate composite material |
| 06/22/2011 | CN101671465B Preparation method of ethoxyline resin/polytetrafluoroethylene composite material |
| 06/22/2011 | CN101591465B Composition for improving tellite material |
| 06/22/2011 | CN101525468B Preparation method of low-resistance conductive plastic |
| 06/22/2011 | CN101463181B Self-lubricating composite material and manufacturing method of self-lubricating composite material mould |
| 06/22/2011 | CA2723359A1 Diamino-alcohol compounds, their manufacture and use in epoxy resins |
| 06/21/2011 | US7964286 Coating composition of oil and organofunctional silane, and tire cord coated therewith |
| 06/16/2011 | WO2011071745A1 Epoxy resin compositions |
| 06/16/2011 | WO2011071726A2 Curable resin compositions useful as underfill sealants for low-k dielectric-containing semiconductor devices |
| 06/16/2011 | WO2011070739A1 Epoxy resin composition for semiconductor encapsulation, cured product thereof, and semiconductor device using epoxy resin composition |
| 06/16/2011 | US20110144272 Compositions useful for preparing composites and composites produced therewith |
| 06/16/2011 | US20110144225 De-polluting and self-cleaning epoxy siloxane coating |
| 06/16/2011 | US20110143856 Epoxy resin composition and prepreg using the same, fiber-reinforced composite resin tubular body manufactured from the prepreg and manufacturing method therefor, and fiber-reinforced composite resin molded body |
| 06/16/2011 | US20110143618 Epoxy resin compound, preparation method thereof, prepreg made therefrom, and copper cladded laminate made therefrom |
| 06/16/2011 | US20110139496 Resin composition |
| 06/16/2011 | DE19757762B4 Verfahren zur Herstellung von Bindemittelsystemen und Verwendung Process for the preparation of binder systems and using |
| 06/16/2011 | DE102010046821A1 Kautschukzusammensetzung für Laufflächendeckschicht und spikeloser Reifen Rubber composition for tread layer and studless tires |
| 06/15/2011 | EP2333015A2 Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition |
| 06/15/2011 | EP2333010A1 Epoxy resin composition, prepreg, and fiber-reinforced composite material |
| 06/15/2011 | EP2332590A2 Non-degradable low swelling, water soluble radiopaque hydrogels |
| 06/15/2011 | EP2331599A1 Photocurable composition |
| 06/15/2011 | EP2147035B1 Pre-impregnated composite materials with improved performance |
| 06/15/2011 | CN1922252B Fire retardant compositions using siloxanes |
| 06/15/2011 | CN102099417A Reaction products based on amphiphilic block copolymers and their use as impact modifier |
| 06/15/2011 | CN102099402A Structural composites with improved toughness |
| 06/15/2011 | CN102097341A Manufacturing method for semiconductor device |
| 06/15/2011 | CN102093806A Coating or encapsulating material mixed with radiating graphite powder |
| 06/15/2011 | CN102093737A Composition for copper foil-clad laminated sheet and copper foil-clad laminated sheet prepared from composition |
| 06/15/2011 | CN102093672A Halogen-phosphorus-free flame retardant epoxy resin composition and application thereof in bonding sheet and copper-clad plate |
| 06/15/2011 | CN102093671A Epoxy resin composite and pouring method thereof |
| 06/15/2011 | CN102093670A Halogen-free flame retardant epoxy resin composition and copper clad plate prepared from same |
| 06/15/2011 | CN102093669A Environment-friendly epoxy molding compound and preparation method thereof |
| 06/15/2011 | CN102093668A Preparation method of solid simulation body for optical breast imaging |
| 06/15/2011 | CN102093667A Epoxy resin composite and covering film prepared from same |
| 06/15/2011 | CN102093666A Halogen-free resin composite and preparation method of halogen-free copper clad laminate using same |
| 06/15/2011 | CN102093665A Heat conduction insulating casting glue and preparation method thereof |
| 06/15/2011 | CN102093664A Thermosetting glue solution for copper-clad substrate, preparation method thereof and forming process of halogen-free flame-retardant copper-clad substrate |
| 06/15/2011 | CN102093593A Resin-based composite material additive type flame retardant, flame-retarding composite material and preparation methods thereof |
| 06/15/2011 | CN101681067B Liquid crystal panel mounting substrate, and method for producing the same |
| 06/15/2011 | CN101457013B Light scattering type epoxy resin composition and preparation method thereof |
| 06/15/2011 | CN101457012B Resin composition and copper clad laminate prepared by metal foil coated with resin composition |
| 06/15/2011 | CN101321799B Liquid resin composition for electronic element and electronic element device |
| 06/14/2011 | US7960483 Adamantane derivative, composition comprising the derivative, and optical and electronic member using the composition |
| 06/09/2011 | WO2011068858A1 Adducts based on divinylarene oxides |
| 06/09/2011 | WO2011068645A1 Coating compositions |
| 06/09/2011 | WO2011068643A2 Composite compositions |
| 06/09/2011 | US20110136965 Pigment dispersions, block polymers and manufacturing method therefor |
| 06/09/2011 | US20110136941 Underfill formulation and method of increasing an adhesion property of same |
| 06/09/2011 | US20110133344 Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices |
| 06/09/2011 | US20110132646 Flame retardant epoxy resin composition, prepreg and laminate thereof |
| 06/08/2011 | EP2328958A1 Use of polymerisable resins with low vacuum degassing for making space-grade composite materials |
| 06/08/2011 | EP2328948A1 Novel core-shell impact modifiers for transparent polymer matrices |
| 06/08/2011 | EP1504051B1 Organo-functional polysiloxanes |
| 06/08/2011 | CN1984959B Comb-like polyetheralkanolamines in inks |
| 06/08/2011 | CN1950419B Cationically photopolymerizable composition |
| 06/08/2011 | CN1769364B Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 06/08/2011 | CN1626578B Steel-plate-reinforcement resin composition, steel plate reinforcing sheet, and reinforcing method of steel plate |
| 06/08/2011 | CN102089347A Novel fast curing ultra high solids low VOC coating system for aggressive corrosive environments |
| 06/08/2011 | CN102088820A Copper clad laminate and impregnation liquid for making same |
| 06/08/2011 | CN102086301A Flame-retardant PA (Polyamide)/PE (Poly Ethylene) alloy material for electric switch |
| 06/08/2011 | CN102086297A Fibre-reinforced plastic material |
| 06/08/2011 | CN102086296A Novel carbon-fiber composite sucker rod |
| 06/08/2011 | CN102086262A Epoxy resin flexibilizer as well as preparation method and application thereof |
| 06/08/2011 | CN101717558B Inorganic crystal whisker modified synergic polyimide/epoxy blend and preparation method thereof |
| 06/08/2011 | CN101608050B Epoxy resin modified material with three-layer structure and preparation method thereof |
| 06/08/2011 | CN101519505B Method for decomposing thermosetting epoxy resin or composite material thereof by high-temperature water phase |
| 06/08/2011 | CN101475731B Epoxy resin composite material added with modified polysiloxane and preparation thereof |
| 06/08/2011 | CN101186802B Epoxy resin composition for multi-chip package and multi-chip package using same |
| 06/08/2011 | CN101137717B Non-halogen flame retardant and highly heat resistant phosphorous-modified epoxy resin compositions |
| 06/07/2011 | US7956136 Resin composition for semiconductor encapsulation and semiconductor device |
| 06/07/2011 | US7955701 Prepreg and resin for preparing the same |
| 06/07/2011 | US7955655 applying a thermosetting coating composition that contains a resin having thermosetting functional groups, such as a hydroxyl-containing acrylic resin, and a crosslinking agent, such as a melamine resin, to the vehicle body to be coated, and thereafter curing the applied coating composition by heating |
| 06/03/2011 | WO2011065813A1 Water curable resin formulations |
| 06/03/2011 | WO2011065174A1 Single-component epoxy resin composition and use thereof |
| 06/03/2011 | WO2011065044A1 Curable resin composition and cured product thereof |
| 06/03/2011 | WO2011064859A1 Thermosetting protective solution for glass mask, and glass mask |
| 06/02/2011 | US20110130525 Novel curing agents and process for their manufacture |
| 06/02/2011 | US20110129689 Curable composition for transfer materials and method for forming micropattern using the curable composition |
| 06/02/2011 | US20110129677 Organic-inorganic composite and manufacturing method therefor |
| 06/02/2011 | US20110129349 Fibre-Reinforced Plastic Material |
| 06/01/2011 | DE19581622B4 Wäßrige Harzzusammensetzung, Verfahren zu deren Herstellung und deren Verwendung The aqueous resin composition, process for their preparation and their use |
| 06/01/2011 | DE102009053965A1 Vergussmasse geeignet zum Vergießen eines Elektronikbauteils, insbesondere einer großvolumigen Spule wie einer Gradientenspule Grout suitable for casting an electronic component, especially a large volume coil as a gradient coil |