Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
09/2010
09/29/2010EP2233518A1 Method for preparing a thermosetting composite material with high nanotube content
09/29/2010EP2233507A1 Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
09/29/2010EP2231781A2 Curing composition and cured product prepared by using the same
09/29/2010CN1958663B 液状环氧树脂组成物 A liquid epoxy resin composition
09/29/2010CN1798820B Activatable material for sealing,baffling or reinforcing and method of forming same
09/29/2010CN101846229A Method for reinforcing and preventing pipeline welding line from erosion and male mold ablating agent and reinforcing injection slurry in same
09/29/2010CN101845219A Curable resin composition, dry membrane and printed circuit board using same
09/29/2010CN101845200A Halogen-free thermosetting resin composite, prepreg and laminate made of same
09/29/2010CN101845199A Modified maleic anhydride-epoxy resin composite
09/29/2010CN101845167A Conductive pre-impregnated material and preparation method thereof
09/29/2010CN101845166A Thermoset hybrid fabric composite material and preparation method and application thereof
09/29/2010CN101845134A Thermally cured resin composition
09/29/2010CN101843201A Composite vegetable greenhouse framework and preparation method thereof
09/29/2010CN101295739B Conductive slurry for solar battery front side electrode and production method thereof
09/29/2010CN101143933B Solid epoxy plastic plate and producing method thereof
09/29/2010CN101130622B Epoxy resin composition and epoxy asphalt mixture for paving asphalt
09/29/2010CN101083233B Semiconductor device encapsulated with resin composition and resin composition for encapsulating semiconductor device
09/29/2010CN101056934B Amphiphilic block copolymer-modified epoxy resins and adhesives made therefrom
09/23/2010WO2010107539A1 Curable compositions containing cyclic diamine and cured products therefrom
09/23/2010WO2010107045A1 Polyimide resin, curable resin composition, and cured object obtained therefrom
09/23/2010WO2010106084A1 Curable epoxy resin composition
09/23/2010WO2010105913A1 Impregnating resin for insulating tubes
09/23/2010US20100240811 Thermosetting Resin Composition and Application Thereof
09/23/2010US20100239858 Film-like adhesive, adhesive sheet, and semiconductor device using same
09/23/2010US20100239851 host epoxy resin network; inorganic high thermal conductivity fillers (carbides, nitrides or oxides)evenly dispersed in host resin network, essentially completely co-reacted with resin network through surface functional group e.g OH, NH2, COOH, SO3H, vinyl etc.; improved mechanical, thermal properties
09/23/2010US20100239755 Composite materials with blend of thermoplastic particles
09/23/2010US20100237292 Isocyanate modified epoxy resin and epoxy powder coating composition thereof
09/23/2010DE102009013870A1 Tränkharz für Isolierrohre Impregnating resin for insulating
09/23/2010CA2755854A1 Curable compositions containing cyclic diamine and cured products therefrom
09/22/2010EP2230267A1 Curable Epoxy Resin Composition
09/22/2010EP2137226B1 Epoxy group-terminated polymers, their compositions and their utilisation as impact resistance modifiers
09/22/2010CN201587921U Composite material impregnation breathing device
09/22/2010CN201587156U Epoxy resin laminated board
09/22/2010CN1812881B A metal-polyamide/polyethylene-metal laminate
09/22/2010CN101842417A Water-based dispersions of highly-branched polymers
09/22/2010CN101838443A PBT/ASA alloy with good interface compatibility and preparation method thereof
09/22/2010CN101838442A Preparation method of rare earth modified glass fiber epoxy resin composite material
09/22/2010CN101838441A Manufacturing method of acoustic mold
09/22/2010CN101838439A Nanometer carboxylic acrylonitrile butadiene rubber modified epoxy resin and production method thereof
09/22/2010CN101838438A Nanometer butadiene-styrene-vinyl pyridine rubber modified epoxy resin and production method thereof
09/22/2010CN101323697B Epoxide resin based piezoelectric composite damping material and method for preparing the same
09/22/2010CN101081389B Process for the production of entry sheet for drilling and use method thereof
09/22/2010CN101024720B PC/ABB alloy modified from PC (polycarbonate) substandard material
09/21/2010US7799852 semiconductor encapsulating resin; polyepoxide of biphenyl-4,4'-diglycidyl ether and 3,3',5,5'-tetramethylbiphenyl-4,4'-diglycidyl ether, phenolic resin, low amount of filler, curing accelerator; inherently fire resistant without added flame retardant; forms foamed layer at ignition for fire retardancy
09/21/2010US7799191 Epoxy enhanced polymer membrane to increase durability of biosensors
09/21/2010CA2464339C Curable cyanate compositions
09/21/2010CA2433054C Solid polymethylmethacrylate surface material
09/16/2010WO2010104603A2 Radiation curable resin composition and rapid three-dimensional imaging process using the same
09/16/2010WO2010102732A1 Improved mechanical properties of epoxy filled with functionalized carbon nanotubes
09/16/2010WO2010102421A1 A thermosettable composition containing a combination of an amphiphilic block copolymer and a polyol and a thermoset product therefrom
09/16/2010WO2010074970A3 Polymer thermal interface materials
09/16/2010US20100234520 Curable Epoxy Resin Composition and Cured Body Thereof
09/16/2010US20100234519 Composition for polyester fabric treatment
09/16/2010US20100234500 Thermoplastic elastomer composition
09/16/2010US20100233478 Powder coating composition for pc strand coating, coating method, and coating film
09/16/2010US20100233387 Ink for making color filter and color filter made thereof
09/16/2010US20100233380 Method of making high temperature resistant models or tools
09/15/2010EP2228407A1 Epoxy resin composition for optical semiconductor light-receiving element encapsulation and process for producing the same, and optical semiconductor device
09/15/2010EP2228406A1 Improved mechanical properties of epoxy filled with functionalized carbon nanotubes
09/15/2010CN101836522A 磁性片 Magnetic sheet
09/15/2010CN101831179A Strippable liquid protective film and use device thereof
09/15/2010CN101831147A Macromolecule composite metal healant and preparation and use method
09/15/2010CN101831146A Glass-reinforced plastic repairing agent
09/15/2010CN101831145A Aqueous epoxy resin and preparation method thereof
09/15/2010CN101831144A Halogen-free epoxy resin composition and high-flexibility flexible copper clad laminate prepared from same
09/15/2010CN101831143A High-performance liquid epoxy resin composition for packaging LEDs
09/15/2010CN101831142A Resin composition, method of its composition, and cured formulation
09/15/2010CN101831141A Double-curing resin matrix for pultrusion process and composite material
09/15/2010CN101831140A Nucleating agent for preparing polylactic acid and application thereof
09/15/2010CN101831139A Epoxy resin compound and film and substrate made from same
09/15/2010CN101831138A Quick drying hand inkpad for hand model
09/15/2010CN101831137A Epoxy resin composition for packaging semiconductors
09/15/2010CN101831044A Method for preparing biphenyl thermotropic liquid crystal polyurethane
09/15/2010CN101831012A Preparation method of polyamide-amine dendrimer modified waste rubber micropowder
09/15/2010CN101830929A Phosphorus-containing hydroquinone derivative, phosphorus-containing flame-retardant epoxy resin, preparation method and application thereof
09/15/2010CN101830102A Synthetic resin rubber hard pressing roll and preparation method thereof
09/14/2010US7795744 Cationically curable epoxy resin composition
09/14/2010CA2294711C Novel polymeric compositions
09/10/2010WO2010101745A1 Thermosettable composition containing a glycidylether based on trimethyolpropane octadecaethoxilate
09/10/2010WO2010100058A1 Cast resin system for isolators
09/10/2010CA2754346A1 Casting resin system for insulators with increased heat distortion resistance
09/09/2010US20100227951 Polymer concrete electrical insulation
09/09/2010US20100227950 Comb-like polyetheralkanolamines in inks and coatings
09/09/2010US20100227949 Curable composition
09/09/2010US20100227170 Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board
09/09/2010US20100227114 Composite Material, Especially Multilayer Material, and Adhesive or Bonding Material
09/09/2010US20100224949 Epoxy resin composition for optical semiconductor light-receiving element encapsulation and process for producing the same, and optical semiconductor device
09/09/2010DE102009012195A1 Gießharzsystem für Isolatoren mit erhöhter Wärmeformbeständigkeit For casting resin insulators with increased heat resistance
09/08/2010EP2226349A1 Thermosetting resin composition and prepreg and laminate both made with the same
09/08/2010EP2226348A1 Epoxide-based composition
09/08/2010EP2226346A1 Epoxy resin composition, prepreg, metal clad laminate and multilayer printed wiring board
09/08/2010EP2225285A1 Method for preparing a hard film or coating from a cationically crosslinkable/polymerizable composition comprising an iodonium borate and giving off an acceptable odour
09/08/2010EP1866371B1 Ultraviolet curing resin composition
09/08/2010EP1546211B1 Preparation of acrylic polymer sol for coating
09/08/2010CN1783543B Porous film and its producing method, battery producing method and electrode/porous film assembly
09/08/2010CN101826283A High-light-guide black transparent resin lamphouse
09/08/2010CN101824217A Polyurethane rubber composition and preparation process thereof
09/08/2010CN101824206A Ultra-high-strength buoyancy material and preparation method thereof
09/08/2010CN101824205A Integrated molding, fiber-reinforced composite material board and housing for electric/electronic device
09/08/2010CN101824204A Novel halogen-free electronic paste, and preparation method and use thereof
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