Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
12/2011
12/07/2011CN101668815B 聚硫醚胺树脂和包含其的组合物 Polythioether amine resin and composition comprising the same
12/07/2011CN101497737B 一种水性环氧树脂的制备方法 Method for preparing aqueous epoxy resin
12/07/2011CN101392090B 一种压电导电环氧树脂复合阻尼材料及其制备方法 A piezoelectric damping conductive epoxy composite material and its preparation method
12/07/2011CN101233190B 绝缘材料、布线板和半导体器件 Insulation materials, wiring boards and semiconductor devices
12/07/2011CN101041744B 一种沥青改性剂 A bitumen modifier
12/07/2011CN101024715B 树脂组合物、预浸料坯和覆金属箔层的压板 Platen resin composition, prepreg and metal-clad layer
12/06/2011US8071996 Wavelength-converting casting composition and light-emitting semiconductor component
12/06/2011US8071698 Surface-promoted cure of cationically curable compositions comprising vinyl ethers
12/06/2011US8071666 Stabilized fumed silica suspensions for reinforcement of reactive resins
12/06/2011US8071217 Heat-curable epoxy resin composition containing one blocked and one epoxide-terminated polyurethane prepolymer
12/06/2011US8070927 Stabilizing aqueous anionic resinous dispersions with chelating agents
12/01/2011WO2011149018A1 Transparent film
12/01/2011WO2011148992A1 Polyethylene terephthalate film, process for production thereof, and resin composition to be used therein
12/01/2011WO2011148628A1 Semiconductor-sealing epoxy resin composition and semiconductor device using same
12/01/2011WO2011148627A1 Method for producing an esterified substance
12/01/2011WO2011148620A1 Sheet-like resin composition, circuit component using the sheet-like resin composition, method for sealing electronic component, method for connecting electronic component, method for affixing electronic component, composite sheet, electronic component using the composite sheet, electronic device, and method for producing composite sheet
12/01/2011WO2011090322A3 Hybrid resin for coating the back surface of a pcm, method for preparing same, and hybrid-type paint composition for the back surface of a pcm
12/01/2011US20110294963 Method of toughening epoxy resin and toughened epoxy resin composite
12/01/2011US20110294954 Vinyl polymer powder, curable resin composition and cured substance
12/01/2011US20110294920 Dopo-flame retardant in epoxy resins
12/01/2011US20110294919 Coating Composition and Cured Film Formed Therefrom
12/01/2011US20110294650 Porous ceramic processing using aco-prilled wax and non-ionic surfactant mixture
12/01/2011US20110294013 Exfoliated carbon nanotubes, methods for production thereof and products obtained therefrom
12/01/2011US20110293958 Self-Healing Coatings
11/2011
11/30/2011EP1606347B1 Acetoacetylated polyvinyl polymers and curable coating compositions made therefrom
11/30/2011CN102264838A 固化性组合物 The curable composition
11/30/2011CN102264820A 基于在聚合物基体内分散的表面官能化的纳米沸石的用于H<sub>2</sub>O敏感性器件保护的复合材料 Dispersed in a polymer matrix based on surface functionalized nano-zeolites for H <sub> 2 </ sub> O devices to protect sensitive composite materials
11/30/2011CN102264793A 树脂组合物、半固化片、树脂片、覆金属层叠板、印刷布线板、多层印刷布线板及半导体装置 The resin composition, a prepreg, a resin sheet, a metal-clad laminated plate, a printed wiring board, a multilayer printed wiring board and a semiconductor device
11/30/2011CN102260413A 一种高阻燃高导热复合材料组份及其制造方法 A high-retardant composite components with high thermal conductivity and its manufacturing method
11/30/2011CN102260403A Inflaming-retarding epoxy resin for electronic packaging material and copper-clad plate and synthesis method thereof
11/30/2011CN102260402A 环氧树脂组合物及由其制成的预浸材和印刷电路板 Epoxy resin composition and the prepreg made therefrom, and a printed circuit board material
11/30/2011CN101880374B Silicon framework hyperbranched epoxy resin and preparation method thereof
11/30/2011CN101870798B 一种环氧树脂团状模塑料及其制备方法 Like an epoxy molding compound group and its preparation method
11/30/2011CN101851393B Floating body material and manufacturing technique thereof
11/30/2011CN101643572B 热固性树脂组合物及用其制成的半固化片与印制电路用层压板 The thermosetting resin composition and a prepreg and printed circuits made from laminates thereof
11/30/2011CN101376735B 无卤阻燃树脂组合物以及用其制作的粘结片与覆铜箔层压板 Halogen-free flame retardant resin composition as well as with its production of an adhesive sheet and copper clad laminates
11/30/2011CN101358018B 环氧树脂抗紫外复合材料及其制备方法 UV epoxy composite material and its preparation method
11/29/2011US8067497 Flame-retardant for engineering thermoplastic applications
11/29/2011US8067486 Low VOC water-based epoxy coatings
11/29/2011US8067484 Latent hardener with improved barrier properties and compatibility
11/29/2011US8067093 Curing agents for epoxy-functional compounds
11/24/2011WO2011146580A2 Curable compositions
11/24/2011WO2011146106A1 Hardeners for thermosettable resin compositions
11/24/2011WO2011145551A1 Photoelectric conversion element using thermosetting sealing agent for photoelectric conversion element
11/24/2011WO2011144716A1 Thermoplastic moulding compounds with increased melt stability
11/24/2011WO2011090668A3 Epoxy compositions and surfacing films therefrom
11/24/2011US20110288210 Mesoporous Silicate Fire Retardant Compositions
11/24/2011US20110288206 Melamine phenylphosphinate flame retardant compositions
11/24/2011US20110288204 Functionalized polyurethane polyurea dispersions
11/24/2011US20110288203 Fire resistant material and formulation thereof
11/24/2011US20110287221 Multilayer film and a production method for same
11/24/2011US20110287190 Ultraviolet light curing compositions for composite repair
11/24/2011US20110286693 Optical waveguide device and resin composition for use in formation of over cladding layer thereof
11/24/2011US20110284176 Thermosetting Creping Adhesive With Reactive Modifiers
11/24/2011US20110284160 2-Component Adhesives
11/24/2011DE102010020882A1 Semicarbazone zur Härtung von Epoxidharzen Semicarbazones for curing of epoxy resins
11/23/2011EP2387596A2 Epoxy resin composition
11/23/2011EP2084205B1 Composite materials with improved performance
11/23/2011EP1920005B1 Epoxy compositions having improved impact resistance
11/23/2011CN202046239U Refrigerated vehicle
11/23/2011CN102257064A 液体树脂组合物和半导体器件 Liquid resin composition and a semiconductor device
11/23/2011CN102257028A Epoxy resin composition, prepreg, laminate board and multilayer board
11/23/2011CN102251904A Cavitation-resistant and energy-saving modification method of water turbine
11/23/2011CN102250470A Dynamic sealant and preparation method thereof
11/23/2011CN102250448A Epoxy resin/carbon nanotube high-strength lightweight composite material, and preparation method thereof
11/23/2011CN102250447A Halogen-free fire resistance epoxy resin composite as well as prepreg material and printed circuit board therefrom
11/23/2011CN102250428A Preparation method for epoxy-resin-modified waste polystyrene-acrylonitrile plastic and recycled board
11/23/2011CN102250427A High-strength high-flexibility flame-retardant cable sheath rubber and preparation method thereof
11/23/2011CN102250357A polyphenyl thiophosphonic gylcol ester compound and preparation method thereof
11/23/2011CN102250355A Fluorine- and epoxide group-containing polysiloxane, and preparation method and application thereof
11/23/2011CN102250318A Full-rosinyl epoxy resin composite and condensate thereof
11/23/2011CN102250317A Rapid curable epoxy resin for electronic packaging, and application thereof
11/23/2011CN101906238B Epoxy resin composition and semiconductor device
11/23/2011CN101870800B Hollow carbon cloth epoxy resin composite material and preparation method thereof
11/23/2011CN101619136B Organic film for converting spectra and LED chip packaging module
11/23/2011CN101341213B Damage-resistant epoxy compound
11/22/2011US8063157 Curing agents for epoxy resins
11/22/2011US8063156 Composition containing cycloaliphatic epoxide, polyol oligomer, and curing catalyst
11/22/2011US8062750 Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board
11/22/2011US8062468 Low-temperature impact resistant thermosetting epoxide resin compositions with solid epoxide resins
11/17/2011WO2011142855A2 Room temperature ionic liquids and ionic liquid epoxy adducts as initiators for epoxy systems
11/17/2011WO2011097009A3 Curable epoxy resin compositions
11/17/2011US20110282010 Epoxy resin composition
11/17/2011US20110281974 Process for producing composition of polymerizable organic compound containing silica particles
11/17/2011US20110281973 Novel particles and composite particles, their uses and a novel process for producing them from alkoxysilyl-group-carrying alkoxylation products
11/17/2011US20110281399 Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device
11/17/2011US20110281118 Surface treatment agent for galvanized steel sheets, galvanized steel sheets and production methods thereof
11/17/2011US20110281117 Curable composition based on epoxy resins and hetero-poly-cyclic polyamines
11/17/2011US20110278630 Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device
11/17/2011US20110278053 Dry film and multilayer printed wiring board
11/17/2011US20110278052 Halogen-free flame-retardant epoxy resin composition, and prepreg and printed circuit board using the same
11/16/2011EP2385970A1 Metal stabilizers for epoxy resins
11/16/2011EP2385969A1 Metallic compounds in non-brominated flame retardant epoxy resins
11/16/2011EP2385962A1 Metal stabilizers for epoxy resins and advancement process
11/16/2011CN1834167B Reinforced boron nitride composition and polymer-based composition prepared thereby
11/16/2011CN102246285A Resin paste for die bonding, method for producing semiconductor device, and semiconductor device
11/16/2011CN102241895A Environment-friendly flame-retardant nylon 6 nano composite material and preparation method thereof
11/16/2011CN102241886A Material having ice covering proof function, and preparation method and application thereof
11/16/2011CN102241874A Flame-retardant masterbatch modified polybutylene terephthalate material and preparation method thereof
11/16/2011CN102241872A Aluminum methylcyclohexyl phosphinate/epoxy resin flame-retardant composite material
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