| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 01/27/2000 | WO2000004073A1 Thermoplastic copolyester compositions modified with epoxide compounds |
| 01/27/2000 | WO1998047968A9 Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device |
| 01/27/2000 | DE19832669A1 Härtbare Epoxidmasse und deren Verwendung A curable epoxy compound and use thereof |
| 01/27/2000 | CA2337236A1 Thermoplastic copolyester compositions modified with epoxide compounds |
| 01/26/2000 | EP0974610A2 Curable epoxy compound and its use |
| 01/26/2000 | CN1242404A Epoxy resin composition for bonding semiconductor chips |
| 01/25/2000 | US6017999 Method for producing impact-resistant polyester resin compositions |
| 01/25/2000 | US6017588 Forming a primer layer on the surface of a structure to be reinforced, forming if necessary a putty layer on the primer layer, applying an impregnating resin on the formed primer layer, cladding, curing |
| 01/25/2000 | CA2012497C Bis(1-hydrocarbyloxy-2,2,6,6-tetramethylpiperidin-4-yl)- amine derivatives and stabilized compositions |
| 01/20/2000 | WO2000003300A1 Stereolithographic composition for preparing polyethylene-like articles |
| 01/20/2000 | WO2000002948A1 Hardener for epoxy resins |
| 01/20/2000 | WO2000002945A1 Self-dispersing hardenable epoxy resins |
| 01/20/2000 | WO2000002731A1 Adhesive material with flexibility modifiers |
| 01/19/2000 | EP0763073B1 Wet strength resin composition and methods of making the same |
| 01/18/2000 | US6015872 Substrate for printed circuit board |
| 01/18/2000 | US6015848 Coating composition and method for application thereof |
| 01/18/2000 | CA2079427C Thermosetting compositions, thermal latent acid catalysts, method of co ating and coated articles |
| 01/13/2000 | WO2000002091A1 Water-based solder resist composition |
| 01/13/2000 | WO2000001779A1 Coating composition |
| 01/13/2000 | DE19830282A1 Selbstdispergierbare härtbare Epoxidharze Self-dispersible curable epoxy resins |
| 01/13/2000 | DE19830280A1 Härter für Epoxidharze Hardeners for epoxy resins |
| 01/12/2000 | EP0971009A2 Adhesive composition for bonding semiconductor chips |
| 01/12/2000 | EP0970133A1 Chemical compositions |
| 01/12/2000 | CN1048270C Compatible blends of epoxy resins and epoxidized polydienes |
| 01/11/2000 | US6013757 Coating or impregnant of epoxy resin and aqueous polyamide-amine dispersion |
| 01/11/2000 | US6013730 At least trifunctional epoxy resin reacted with solid rubber mixed with epoxy resin and curing agent |
| 01/11/2000 | US6013714 Resin composition and fibrous material forming mold |
| 01/11/2000 | CA2090092C Higher modulus compositions incorporating particulate rubber |
| 01/11/2000 | CA2085077C Polysulphide-modified epoxy resins |
| 01/05/2000 | EP0851885B1 Cross-linked biobased materials and uses thereof |
| 12/29/1999 | WO1999051675A8 Conductive sheet molding compound |
| 12/29/1999 | EP0966254A1 Foaming shaving cream |
| 12/29/1999 | EP0773267B1 Thermosetting powder coating composition |
| 12/28/1999 | US6008313 Curing agent for epoxy resin is the reaction product of a fatty mono-acid, dimer acid, ethyleneamine adducts, and piperazine or n-aminoalkyl piperazine reacted in specific molar ratios; higher amine hydrogen equivalent weight |
| 12/28/1999 | US6008266 Includes an epoxy monomer of given formula which is curable using actinic radiation and incorporates a cleavable acetal linkage which renders the cured epoxy formulations soluble in dilute acid, to allow recovery following cure |
| 12/28/1999 | US6008150 Binder composition for producing fibrous webs and a process for producing fibrous web mouldings |
| 12/28/1999 | US6007734 Comprising magnetic particles having a particle diameter of 10 to 150 mum, 0.01 to 0.5 wt % of an antistatic agent, 1 to 10% by weight of an organic thickening agent, 0.1 to 10% by weight of a colorant and a balance of an organic dispersing medium |
| 12/28/1999 | CA2049837C Powder coating compositions |
| 12/22/1999 | EP0964897A1 Crosslinker for film forming composition |
| 12/21/1999 | US6005060 Epoxy resin composition and cured composite product |
| 12/21/1999 | US6005030 Jet flow epoxy resin |
| 12/21/1999 | CA2182564C Matrix resin formulations containing anhydride curing agents and surface-active agents |
| 12/16/1999 | WO1999064518A1 Molded resin and process for producing the same |
| 12/16/1999 | WO1999064513A1 Semiconductor sealing epoxy resin composition and semiconductor device using the same |
| 12/16/1999 | WO1999064494A1 Carboxy-functionalized polyphenylene ethers and blends containing them |
| 12/15/1999 | CN1047397C Polyamide-based powder composition for the coating of matal substrates |
| 12/14/1999 | US6001950 Heating glyoxal at a temperature of about 80-100 degrees c with a molar excess of a phenol in the presence of an acidic catalyst which is eliminated from the reaction mixture |
| 12/14/1999 | US6001919 Conductive sheet molding compound |
| 12/14/1999 | US6001902 Wollastonite-containing curable epoxy resin mixture |
| 12/14/1999 | US6001901 Epoxy resins, phenolic resins and fillers |
| 12/14/1999 | US6001483 Epoxy resin comprising: an epoxy resin; a hardener; and an alkylene-ethylene glycol copolymer of given formula; superior mold releasability and transparency |
| 12/14/1999 | US6001428 Solid epoxy resin compositions crosslinkable with UV rays |
| 12/08/1999 | EP0962495A1 A curable polyphenylene ether-thermosetting resin composition |
| 12/07/1999 | US5998509 Resin composition and semiconductor device employing the same |
| 12/07/1999 | US5998508 Curable epoxy resin |
| 12/02/1999 | WO1999061874A1 Temperature sensor and electronic apparatus containing the same |
| 12/02/1999 | WO1999061517A1 Method for producing soft pvc foamed materials |
| 12/02/1999 | DE19920319A1 Process for the production of optical resin films |
| 12/02/1999 | DE19823491A1 Verfahren zur Herstellung von Weich-PVC-Schaumstoffen A process for the production of soft PVC foam |
| 12/01/1999 | EP0960161A1 High-melting polyamide resin compositions and molded articles thereof |
| 12/01/1999 | EP0960159A1 Primer for plastic films |
| 12/01/1999 | EP0792314B1 Epoxy polysiloxane coating and flooring compositions |
| 12/01/1999 | CN1237192A Synthetic resin composition having resistance to thermal deterioration and molded articles |
| 12/01/1999 | CN1237186A Thermosetting resin compositions useful as underfill sealants |
| 12/01/1999 | CN1236789A Cyanate ester composition and cured product thereof |
| 12/01/1999 | CN1046950C Epoxy resin mixture |
| 12/01/1999 | CN1046949C 环氧树脂混合物 Epoxy resin mixture |
| 12/01/1999 | CN1046882C Abrasive articles comprising grinding aid |
| 11/30/1999 | US5994785 Epoxy resin compositions and semiconductor devices encapsulated therewith |
| 11/30/1999 | US5994480 Resin composites and method for producing the same |
| 11/30/1999 | US5994475 Reaction products of amine and a carboxyl functional microgel |
| 11/30/1999 | US5994467 Polycarbonate blend compositions |
| 11/30/1999 | CA2078560C Porous, absorbent, polymeric macrostructures and methods of making the same |
| 11/24/1999 | EP0958326A1 Method for gluing a surface to a component |
| 11/24/1999 | CN1046742C Process for increasing molecular weight of polyesters and premix useful for this process |
| 11/23/1999 | US5990247 Base and solvent-decomposed molding of thermosetting resin and aliphatic polyester |
| 11/23/1999 | US5990245 α, ω-polymethacrylate glycols, methods for their synthesis and their use for the preparation of polymers, particularly polyurethanes and polyesters |
| 11/23/1999 | US5990213 Comprising a polyester matrix, an ethylene/alkyl(c2-c8) (meth or eth)acrylate/glycidyl (meth)acrylate, a bromopolymer and a brominaated dialkyl phthalate; potting material for transformers; low viscosity; fluid flow; impact strength |
| 11/18/1999 | WO1999058606A1 Method for reinforcing thermosetting resins with isobornyl acrylate or methacrylate polymers |
| 11/18/1999 | DE19916332A1 Fluorinated oligomer with terminal carboxylic acid groups, useful as a chain-extender for epoxy resin, etc. |
| 11/17/1999 | EP0957123A2 Cyanate ester composition and cured product thereof |
| 11/17/1999 | EP0957118A2 Thermosetting resin composition |
| 11/17/1999 | CN1235615A Liquid curable resin composition |
| 11/17/1999 | CN1235176A Blackboard made from polymer materials |
| 11/16/1999 | US5986038 Adhesive composition |
| 11/16/1999 | US5985954 Epoxy resin composition for sealing photo-semiconductor element and photo-semiconductor device sealed with the epoxy resin composition |
| 11/16/1999 | US5985510 Stereolithography, exposure to beams, curing, molding an epoxycyclohexane |
| 11/16/1999 | US5985455 Semiconductor element sealed with an epoxy resin compound |
| 11/16/1999 | US5985431 Epoxy resin comprising tetraglycidyldiaminodiphenylmethane and m,m*-diaminodiphenylsulfone; heat resistance |
| 11/16/1999 | CA2000761C Curable epoxide resin compositions |
| 11/11/1999 | WO1999057216A1 Epoxy/thermoplastic photocurable adhesive composition |
| 11/11/1999 | WO1999057200A1 Synthetic resin composition, and permeable pavement and permeable material using the same |
| 11/11/1999 | WO1999057197A1 Energy cured sealant composition |
| 11/10/1999 | EP0955675A2 Epoxy resin compositions and semiconductor devices encapsulated therewith |
| 11/10/1999 | EP0955331A2 Self-water dispersible particle made of biodegradable polyester and process for the preparation thereof |
| 11/10/1999 | EP0954553A1 Latent catalysts for epoxy curing systems |
| 11/10/1999 | EP0954547A1 Epoxy-polysiloxane polymer composition |
| 11/09/1999 | US5982056 Thermosetting resin composition, electrically insulated coil, electric rotating machine and method for producing same |
| 11/09/1999 | US5981622 Foundry binder of polyurethane, phenolic resin, polyisocyanate and epoxy resin |
| 11/04/1999 | WO1999055780A1 Epoxy resin composition for jig and tool, and mold made of epoxy resin |