| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 09/05/2007 | CN100335541C Method for preparing composition of epoxy resin for packaging semiconductor |
| 09/04/2007 | US7265167 Containing phenolic resin and inorganic filler; preventing short circuiting in devices having reduced pitch distance between interconnection electrodes or wires |
| 09/04/2007 | US7264706 Cathodic electrocoating compositions containing an anti-crater agent |
| 09/04/2007 | US7264705 Cathodic electrocoating compositions containing an anti-crater agent |
| 08/30/2007 | WO2007097405A1 Thermosetting resin composition containing low-chlorine multifunctional aliphatic glycidyl ether compound, cured product of such composition and use thereof |
| 08/30/2007 | WO2007097196A1 Flame-retardant resin composition, prepreg using same, resin sheet and molded article |
| 08/30/2007 | WO2007095730A1 Highly filled composite materials |
| 08/30/2007 | US20070203308 Resin composition, prepreg and metal-foil-clad laminate |
| 08/29/2007 | EP1826227A1 Thermosetting epoxy resin composition and use thereof |
| 08/29/2007 | EP1694769A4 Dual-stage wafer applied underfills |
| 08/29/2007 | CN101027359A 改性环氧树脂组合物 Modified epoxy resin composition |
| 08/29/2007 | CN101027358A Amphiphilic block copolymer-toughened thermoset resins |
| 08/29/2007 | CN101024720A PC/ABB alloy modified from PC (polycarbonate) substandard material |
| 08/29/2007 | CN101024715A Resin composition, prepreg and metal-foil-clad laminate |
| 08/29/2007 | CN100334125C High temperature corrosion-resisting resin |
| 08/28/2007 | US7262514 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device |
| 08/28/2007 | US7262233 Surface treated silicas |
| 08/28/2007 | US7262228 A iodonium salt, an alpha-diketone visible light sensitizer, an alkoxy substituted anthracene electron donor; photopolymerizable epoxy resins for dental prosthetics and restoratives with improved cure speeds and depths and discoloration inhibition |
| 08/23/2007 | US20070196908 Stabilizers For Polymerizable Biocompatible Materials |
| 08/23/2007 | US20070196664 Epoxy resin composition and semiconductor device |
| 08/23/2007 | US20070196612 Liquid epoxy resin composition |
| 08/23/2007 | US20070194274 Low odor binders curable at room temperature |
| 08/22/2007 | EP1819792A1 Polymeric compositions with modified siloxane networks, corresponding production and uses thereof |
| 08/22/2007 | CN1333011C Curable composition |
| 08/22/2007 | CN101020779A Fireproof thermosetting resin composition |
| 08/21/2007 | US7259213 Indole resins epoxy resins and resin compositions containing the same |
| 08/16/2007 | WO2007090335A1 Halogen-free phosphor-free fire-retardant epoxide resin composition |
| 08/16/2007 | US20070191556 Polymeric epoxy resin composition |
| 08/16/2007 | US20070191555 Thermosetting resin composition and its article |
| 08/16/2007 | US20070191552 Adhesive composition, adhesive film, and method of producing semiconductor device |
| 08/16/2007 | US20070191544 Curable Composition Based on Polyurethane-Urea and on Block Copolymers, and Transparent Material Obtained From Said Composition |
| 08/16/2007 | US20070191520 Photo-radically curable resin composition containing epoxy resin |
| 08/16/2007 | US20070191513 Hardenable reaction resin system |
| 08/16/2007 | US20070191512 Curing an aqueous adduct of a polyepoxide and amidodiamine or amidopolyamine by reaction with a polymercaptan; curing a polyepoxide with a polymercaptan and a diamine, polyamine, amidodiamine or amidopolyamine; improved solvent resistance and flexibility; decreased shrinkage |
| 08/16/2007 | US20070190332 Dry-type encapsulated transformer coils |
| 08/16/2007 | US20070187056 increasing wet strength to soft, absorbent paper sheets by curing an epoxy-functional polymer (epichlorohydrin-methyldiallylamine copolymer) and an epoxy-reactive polymer such as a carboxylated ethylene-vinyl acetate copolymer; formaldehyde-free curing; paper towels |
| 08/15/2007 | EP1818351A1 Underfill encapsulant for wafer packaging and method for its application |
| 08/15/2007 | EP1622980B1 Fast crystallizing polyester compositions |
| 08/15/2007 | CN1331911C Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin |
| 08/15/2007 | CN101016445A Underfill encapsulant for wafer packaging and method for its application |
| 08/15/2007 | CN101016402A Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
| 08/15/2007 | CN101016389A Method of treating aluminum hydroxide combustion inhibitor in epoxide resin encapsulation material |
| 08/14/2007 | US7256228 Stabilized polycarbonate polyester composition |
| 08/14/2007 | US7255927 Laminate composition |
| 08/14/2007 | US7255926 Layered structure includes an optically or an electrically active thin film, such as a radiation detector, a solar cell or a solar module, or an optoelectronical component, such as a light emitting displaying device and a liquid crystal display (LCD) screen, insensitive to moisture |
| 08/14/2007 | US7255925 Dielectrics accuracy; heat dissipation ; glass transition temperature; heat resistance; copper cladding laminate ; high speed signal transfer |
| 08/09/2007 | WO2007089643A1 Non-aqueous, liquid coating compositions |
| 08/09/2007 | WO2007089517A1 Molding compositions containing modified polybutylene terephthalate (pbt) random copolymers derived from polyetheylene terephthalate (pet) |
| 08/09/2007 | WO2007064366B1 Expandable sealant for fasteners |
| 08/09/2007 | WO2006001518A3 Cationic photopolymerizable epoxy resin composition, minute structural member using the same and method for manufacturing minute structural member |
| 08/09/2007 | US20070185287 Modified epoxy resin, process for its production, photosensitive resin composition and photsensitive element |
| 08/09/2007 | US20070185246 Asphalt-epoxy resin compositions |
| 08/09/2007 | US20070185244 solvent-free mixture of epoxy resin, hardener for epoxy resin( phenol novolaks and cresol novolaks), microgel which is reaction product of unsaturated carboxylic acid ( acrylic acid ) and base ( 2-ethyl-imidazole), and electroconductive filler like graphite; biopolar plates |
| 08/09/2007 | US20070185243 Conductive adhesive |
| 08/09/2007 | US20070184290 Method of bonding adherend |
| 08/09/2007 | US20070184281 A curable liquid blends comprising amines, latent curing agent which does not react until temperatures above 70 degrees C., a photopolymerizable compound and a photoinitiator; use as impregnating resins, forming fibre-reinforced composite materials |
| 08/09/2007 | US20070184280 Epoxy compounds and cured epoxy resins obtained by curing the compounds |
| 08/08/2007 | EP1814949A1 Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same |
| 08/08/2007 | EP1814948A1 Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom |
| 08/08/2007 | EP1814947A1 Amphiphilic block copolymer-toughened epoxy resins |
| 08/08/2007 | EP1548082B1 Adhesive composition and glass plate with thermoplastic elastomer molding |
| 08/08/2007 | CN1330704C Epoxy resin composition and method for producing epoxy resin composition and semiconductor device obtained thereby |
| 08/08/2007 | CN101014644A Anhydride-functional silsesquioxane resins |
| 08/08/2007 | CN101014639A Polyaminoamide-monoepoxy adducts |
| 08/08/2007 | CN101012330A Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same |
| 08/08/2007 | CN101012311A Preparation and application for fluorescence false-proof point material |
| 08/07/2007 | US7253219 using a cold worked TiNi alloy wire; assumable a martensite phase or an austenite phase through phase transformation temperatures |
| 08/07/2007 | CA2303788C Sealant composition, article including same, and method of using same |
| 08/02/2007 | US20070179259 Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith |
| 08/02/2007 | US20070179258 curable epoxy resins of bisphenol A or bisphenol F type with a curing agent containing adduct of bisphenol A or F, diglycidyl ether and iosphorondiamine; adduct of bisphenol A or F with cyclohexane-1,3-bis/aminomethyl/-; isophorondiamine and cyclohexane-1,3-bis/aminomethyl/-; cured resin for coating film |
| 08/02/2007 | US20070179257 Epoxy hardener systems based on aminomethylene-ethyleneureas |
| 08/02/2007 | US20070179256 High-purity alicyclic epoxy compound, process for production of the same, curable epoxy resin composition, cured product thereof, and application thereof |
| 08/02/2007 | US20070179217 Flame-retarding and thermosetting resin composition |
| 08/01/2007 | EP1812513A1 Amphiphilic block copolymer-toughened epoxy resins and powder coatings made therefrom |
| 08/01/2007 | EP1812512A1 Amphiphilic block copolymer-modified epoxy resins and adhesives made therefrom |
| 08/01/2007 | EP1812511A1 Amphiphilic block copolymer-toughened epoxy resins and ambient cure high-solids coatings made therefrom |
| 08/01/2007 | EP1812510A1 Amphiphilic block copolymer-toughened epoxy vinyl ester and unsaturated polyester resins |
| 08/01/2007 | EP1597315B1 Molding compositions containing quaternary organophosphonium salts |
| 08/01/2007 | CN1329449C Epoxy modified organopolysiloxane resin based compositions useful for protective coatings |
| 08/01/2007 | CN1329446C 环氧树脂组合物 The epoxy resin composition |
| 08/01/2007 | CN101007935A Foamable underfill encapsulant |
| 08/01/2007 | CN101007892A Core-shell structure polymer base composite material and its preparing process |
| 08/01/2007 | CN101007863A Preparation method of non-ionic room temperature-cured aqueous epoxy curing agent |
| 08/01/2007 | CN101007824A Double-ring cage shape substituted silsesquioxane and its preparation method and uses |
| 07/31/2007 | CA2258040C Curable thermoset resin composition |
| 07/26/2007 | WO2007083801A1 Epoxy resin molding material for sealing and electronic component device |
| 07/26/2007 | WO2007083397A1 Liquid epoxy resin composition and adhesive using the same |
| 07/26/2007 | US20070173629 Modifier for polyester resin and process for producing molded article with the same |
| 07/26/2007 | US20070172665 Spring with high durability and method of coating the same |
| 07/26/2007 | DE19534594B4 Kationisch härtende, flexible Epoxidharzmassen und ihre Verwendung zum Auftragen dünner Schichten Cationically curing, flexible epoxy resin compositions and to their use for application of thin layers |
| 07/25/2007 | EP1810996A1 Curable composition |
| 07/25/2007 | EP1810995A1 Curable composition |
| 07/25/2007 | EP1810994A1 Curable composition |
| 07/25/2007 | EP1809704A1 Coating compositions containing a carbinol functional silicone resin or an anhydride functional silicone resin |
| 07/25/2007 | EP1809701A1 Moldable compositions containing carbinol functional silicone reisins or anhydride functional silicone resins |
| 07/25/2007 | EP1809689A1 Anhydride-functional silsesquioxane resins |
| 07/25/2007 | EP1687374B1 Method for making an organic fibre based on an epoxy resin and a rheology-controlling agent and corresponding dry goods |
| 07/25/2007 | EP1620521B1 Activatable material for sealing, baffling or reinforcing and method of forming same |
| 07/25/2007 | CN1328309C Conductive composite materials with positive temperature coefficient effect and process for making same |
| 07/25/2007 | CN1328307C Heat activated epoxy adhesive and use in a structural foam insert |