Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
10/2007
10/04/2007US20070232713 Radiation Curable Liquid Resin Composition for Optical Three-Dimensional Molding and Optical Molded Article Obtained by Photocuring Same
10/04/2007US20070231582 Curable composition, especially an amine-curing epoxy compound or a polyisocyanate-curing polyol, containing an iron(III) derivative of a 3-substituted phenol, particularly iron (III) complexes of 3-hydroxybenzoic acid, 3,4,5-trihydroxybenzoic acid, 3-hydroxysalicylic acid, or 3,5-dihydroxybenzoic acid
10/04/2007US20070231581 Epoxy with low coefficient of thermal expansion
10/04/2007US20070231580 Process for the preparation of powder coatings on heat-sensitive substrates
10/04/2007US20070231579 Weldable coating compositions, substrates and related methods
10/04/2007US20070231291 Polymeric anti-microbial agents
10/04/2007DE202006008913U1 Formteil aus Mineralwerkstoff Molding solid surface
10/04/2007CA2647134A1 Polyester-series resin composition and molded article
10/03/2007EP1840166A1 Curable composition
10/03/2007EP1838776A1 Fire-retardant low-density epoxy composition
10/03/2007EP1838764A1 Thermoplastic polymer based nanocomposites
10/03/2007EP1838529A2 Polyvinylidene fluoride coating for metal substrates
10/03/2007CN101048464A Coating compositions containing a carbinol functional silicone resin or an anhydride functional silicone resin
10/03/2007CN101048461A Self-bonding coating composition
10/03/2007CN101048460A Moldable compositions containing carbinol functional silicone reisins or anhydride functional silicone resins
10/03/2007CN101045863A Two-purpose luminous film of X-ray detection and display and preparation method thereof
10/03/2007CN101045852A Sealing material tablet, method of manufacturing the tablet and electronic component device
10/03/2007CN101045809A Epoxy resin composite, and preparation method thereof and using method thereof
10/03/2007CN101045808A Preparation method of piezoelectric ceramic/epoxy resin composite
10/03/2007CN101045793A A method of forming a crosslinked polymer gel
10/03/2007CN100340604C Thermosetting resin composition for high speed transmission circuit board
10/02/2007US7276736 Wavelength-converting casting composition and white light-emitting semiconductor component
10/02/2007US7276563 Polyphenylene ether oligomer compound, derivatives thereof and use thereof
10/02/2007US7276562 Protective encapsulating material, free from dust attraction and exhibits low elasticity, crack resistance, adhesion properties
09/2007
09/27/2007WO2007108242A1 Epoxy resin curable composition for prepreg
09/27/2007US20070225453 Polyacrylic Hydrazide and Crosslinking Agent or Curing Agent for Resin
09/27/2007US20070225437 Aromatic-free polysiloxane containing at least 2 epoxy groups, 1,3-bis((3-m-hydroxyphenyl)propyl)-1,3-dimethyldisiloxane, and a curing accelerator; cured product has high flexibility and improved adhesive characteristics
09/27/2007US20070224362 Two-part waterborne epoxy coating composition and method
09/27/2007US20070221890 Phosphorus Containing Compounds Useful for Making Halogen-Free, Ignition-Resistant Polymer
09/26/2007EP1837383A1 Die-attach composition for high power semiconductors
09/26/2007EP1837358A1 Latent curing agent
09/26/2007EP1837354A1 Sealing substance on the basis of epoxidised polysulphide and isocyanate
09/26/2007EP1836260A1 Bonded composite of silicone resin and epoxy resin and a method for manufacturing thereof
09/26/2007EP1695989B1 Curable composition
09/26/2007EP1559735B1 Sealing material for liquid crystal and liquid crystal display cell using same
09/26/2007CN101044204A Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same
09/26/2007CN101041744A Bitumen modifier
09/26/2007CN101041741A PC (polycarbonate) defective material modified PC/ABS alloy (three)
09/26/2007CN101041740A PC (polycarbonate) defective material modified PC/ABS alloy (two)
09/26/2007CN101041739A PC (polycarbonate) defective material modified PC/ABS alloy (one)
09/26/2007CN100339440C Colored cementing agent in use for road and preparation method
09/26/2007CN100339439C Red phosphorus fire retardant for epoxy, red phosphorus fire retardant composition for epoxy, their mfg. method, epoxy composition for semiconductor sealing materials
09/26/2007CN100339421C Carbon fiber-reinforced resin composite materials
09/25/2007US7273897 Ink jet ink composition
09/25/2007US7273687 Toner fuser member having release layer formed from glycidyl end-capped polymer and perfluoroalkyl glycidyl-reactive compound
09/20/2007WO2007105795A1 Phenoxy resin for optical material, resin composition for optical material, resin film for optical material, and optical waveguide using those
09/20/2007WO2007105713A1 Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film
09/20/2007WO2007104654A1 Use of a hyperbranched polymer for the surface modification of a matrix which is solid in the hardened state
09/20/2007US20070219295 Polyphosphonate Flame Retardant Curing Agent For Epoxy Resin
09/20/2007US20070216281 Wavelength-converting casting composition and light-emitting semiconductor component
09/20/2007US20070216040 Epoxy Resin Composition for the Encapsulation of Semiconductors and Semiconductor Devices
09/20/2007DE102006043357A1 Photoempfindliche, hitzehärtbare Harzzusammensetzung, mit einem mit Resistfilm überzogene, geglättete, gedruckte Schaltungsplatine und Verfahren zu ihrer Herstellung A photosensitive thermosetting resin composition, with a resist film coated, smoothed, and printed circuit board processes for their preparation
09/20/2007DE102006012550A1 Verwendung einer substituierten Guanidin-Verbindung sowie deren Salze oder Hydrate als Härter für Epoxidharze Use of a substituted guanidine compound and their salts or hydrates as a curing agent for epoxy resins
09/19/2007CN101040005A 气体阻隔性树脂组合物和气体阻隔性薄膜 The gas barrier resin composition and the gas barrier films
09/19/2007CN101039984A 环氧树脂组合物及半导体装置 Epoxy resin composition and a semiconductor device
09/19/2007CN101037530A Light-curved aqueous crylic acid epoxy resin latex and coating prepared thereby
09/19/2007CN101037529A Photosensitive thermosetting resin composition, flattened and resist film coated printed wiring board and method of preparing the same
09/19/2007CN101037528A Heat-resistant bismaleimide/epoxy resin and preparation method thereof
09/19/2007CN100338141C Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product
09/18/2007US7271225 having high flame retardancy; having a structural unit derived from a secondary phosphine preferably at least one selected from 1,4-cyclooctylenephosphine oxide and 1,5-cyclooctylenephosphine oxide
09/18/2007US7271224 Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same
09/18/2007US7271219 Curable resin, curable resin material, curable film, and insulator
09/18/2007US7271206 Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof
09/18/2007US7270776 Having a low room temperature resistance and large change ratio of resistance value, as well as superior operating stability
09/13/2007WO2007075334A3 Damage-resistant epoxy compound
09/13/2007US20070213477 polymerization catalysts; improved flame resistance, flowability and solder-reflow resistance; lead-free solder; integrated circuits
09/13/2007US20070213476 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
09/13/2007US20070213452 usable for optical elements such as for liquid crystal displays; excellent in brightness, color tone, steam resistance, and thermal stability; blend includes aromatic polycarbonate, phosphorus compound stabilizer, acrylic resin, light diffuser, polysiloxane, alicyclic epoxy compound
09/13/2007US20070213429 Anisotropic conductive adhesive
09/13/2007US20070213427 Uv Hardening Glass Printing Ink And Uv Hardening Glass Printing Lacquer And Method For Printing A Glass Substrate
09/13/2007US20070212556 Curable materials containing siloxane
09/13/2007US20070212551 Adhesive composition
09/12/2007EP1408083B1 Curable epoxy resin composition
09/12/2007CN101035858A Polyoxymethylene resin composition having an excellent heat stability
09/12/2007CN101033327A Resin composition and presoaking material, copper coating plate for printed circuit and printed circuit board using the same
09/12/2007CN101033293A Polyfunctional phenylene ether oligomer, derivative thereof, resin composition containing the same, and use thereof
09/12/2007CN100336864C 环氧树脂组合物 The epoxy resin composition
09/12/2007CN100336863C Preparation method of epoxy/polyaniline composite base-material for anticorrosion paint
09/12/2007CN100336856C Silicomethane coupling agent containing cyanide and secondary amino and its preparation process and application thereof
09/12/2007CN100336838C Epoxy resin compositions, methods of preparing, and articles made therefrom
09/11/2007US7268192 Process for producing high-purity epoxy resin and epoxy resin composition
09/11/2007US7268191 Mixing an epoxy resin, a phenol resin, and a hardening accelerator, under a reduced pressure and under a heating condition and then mixing
09/11/2007US7268181 Curable epoxy resin, hardeners, accelerators with fillers and flexibility agents with colors for potting and crosslinking of polysiloxanes, crosslinking
09/11/2007US7268174 Homogeneous alumoxane-LCT-epoxy polymers and methods for making the same
09/11/2007US7267877 Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same
09/11/2007CA2349139C Cationic resin composition
09/07/2007WO2007100816A2 Sizing for high performance glass fibers and composite materials incorporating same
09/07/2007WO2007100734A2 A halogen-free phosphorous epoxy resin composition
09/07/2007WO2007100724A2 A halogen-free phosphorous epoxy resin composition
09/07/2007CA2641644A1 Sizing for high performance glass fibers and composite materials incorporating same
09/06/2007US20070208098 Composition Curable By Radical Photo Curing And Cationic Photo Curing In Combination
09/06/2007US20070207322 Semiconductor encapsulating epoxy resin composition and semiconductor device
09/05/2007EP1546231B1 Solvent-borne two component modified epoxy-aminosilane coating composition
09/05/2007EP1303567B2 Volume-modified casting compounds based on polymeric matrix resins
09/05/2007CN101031616A Semiconductor-sealing epoxy resin composition and semiconductor device sealed therewith
09/05/2007CN101030476A An electronic component
09/05/2007CN101029166A Thermosetting resin compositions, resin films in b-stage and build-up multi-layer board
09/05/2007CN101029165A Epoxy-resin mould plastic for packing IC circuit and its production
09/05/2007CN101029158A Particular-filling shape memory composite material and its production
09/05/2007CN100336210C Barrier layer made of a curable resin containing polymeric polyol