| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 11/14/2007 | CN100348665C Process for in-situ polymerization preparation of nylon 6/epoxy resin/silicon dioxide nano composite materials |
| 11/14/2007 | CN100348661C Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards |
| 11/13/2007 | US7294660 Contains aluminum borate whisker being dispersed uniformly therein, is excellent in mechanical strength, and is suppressed with respect to the anisotropy of a mechanical property |
| 11/08/2007 | WO2007126130A1 Solder resist material, wiring board using the solder resist material, and semiconductor package |
| 11/08/2007 | WO2007125926A1 Epoxy resin composition for fiber-reinforced composite material |
| 11/08/2007 | WO2007125925A1 Epoxy resin composition for fiber-reinforced composite material |
| 11/08/2007 | WO2007125907A1 Polyamide resin composition |
| 11/08/2007 | WO2007125759A1 Epoxy resin composition, fiber-reinforced composite material and method for producing the same |
| 11/08/2007 | US20070256857 Conductive Paste and Flexible Printed Wiring Board Produced Using the Conductive Paste |
| 11/08/2007 | CA2650559A1 Epoxy resin composition for fiber-reinforced composite material |
| 11/08/2007 | CA2650554A1 Epoxy resin composition for fiber-reinforced composite material |
| 11/07/2007 | EP1852452A1 Latent hardener for epoxy resin and epoxy resin composition |
| 11/07/2007 | CN101068846A 环氧树脂组合物及半导体器件 Epoxy resin composition and semiconductor device |
| 11/06/2007 | US7291684 Curable epoxidized phenolic resins containing biphenylene groups, an inorganic filler, a curing accelerator, a silane coupler, and and a dihydroxyaromatic compound; low viscosity for improved flowability without deterioration of curing; fireproofing; heat resistance (soldering); anticracking agents |
| 11/06/2007 | CA2128118C Improved method of forming shaped hydrogel articles including contact lenses using inert displaceable diluents |
| 11/01/2007 | US20070255015 an electrostatic powder coating mixture of thermosetting polyester resins, epoxy resins and adition (co)polymers or addition-condensation caopolymers, used for coating aluminum wheels of automobiles to provide an excellent finished appearance and corrosion resistance |
| 11/01/2007 | US20070254986 Epoxy Resin Molding Material for Sealing and Electronic Component |
| 11/01/2007 | US20070251419 Epoxy Resin Composition For Semiconductor Sealing Agents and Epoxy Resin Molding Material |
| 10/31/2007 | EP1849831A2 Epoxy-Polysiloxane Polymer Composition |
| 10/31/2007 | EP1848782A1 Thermosetting powder paint composition and polyester resin that can be used for the production thereof |
| 10/31/2007 | EP1848754A1 Low shrinkage amine-curing epoxy resin compositions comprising a lactone |
| 10/31/2007 | EP1765945B1 Metal packaging coating containing 1,3,5-triazine carbamate crosslinker |
| 10/31/2007 | EP1412445B1 Polysilazane-modified polyamine hardeners for epoxy resins |
| 10/31/2007 | EP1310525B1 Copper foil with resin and printed wiring boards made by using the same |
| 10/31/2007 | EP1172393B1 Curable resin composition, process for producing the same, and coated object made with the same |
| 10/31/2007 | CN101065444A Low voiding no flow fluxing underfill for electronic devices |
| 10/31/2007 | CN101062995A PC/ABS spray paint waste modified recovering dispense |
| 10/31/2007 | CN101062993A Carbon fiber composite resin material and method of producing the same |
| 10/31/2007 | CN100345918C Powder coating compositions |
| 10/31/2007 | CN100345904C High strength bioresorbables containing poly-glycolic acid |
| 10/31/2007 | CN100345903C 生物降解聚酯混合物 Biodegradable polyester mixture |
| 10/30/2007 | US7288607 High solids primer composition based on epoxy ring opening curing reaction |
| 10/30/2007 | US7288606 Useful for casting out optoelectronic components; acid anhydride-curable epoxy compounds, particularly bisphenol A-diglycidyl ether, contains multi-functional epoxy novolak resins, particularly an epoxy cresol novolak |
| 10/30/2007 | US7288604 Interpenetrating polymer networks using blocked polyurethane/polyurea prepolymers for golf ball layers |
| 10/30/2007 | US7288595 A reaction product having polyether carbamate groups formed from polyoxyalkylene amine and a cyclic carbonate |
| 10/30/2007 | US7288161 Heating cured product of azodicarbonamide, p-toluenesulfonyl semicarbazide, 4,4'-oxydibenzenesulfonyl hydrazide, p-toluene sulfonyl hydrazide, or diamine carbamate curing agent; a catalyst; and a multifunctional epoxide having a second thermally-labile group to effect chain scission of labile groups |
| 10/25/2007 | WO2007120203A2 Flame retardant compositions with a phosphorated compound |
| 10/25/2007 | WO2007119582A1 Multifunctional oxetanyl group-containing ultraviolet-curable resin composition |
| 10/25/2007 | WO2007100724A3 A halogen-free phosphorous epoxy resin composition |
| 10/25/2007 | US20070249760 Modified Epoxy Resin Composition |
| 10/24/2007 | EP1846501A1 Use of aramid fiber conjunction with thermoplastics to improve wash-off resistance and physical properties such as impact and expansion |
| 10/24/2007 | EP1786849B1 Polyaminoamide-monoepoxy adducts |
| 10/24/2007 | EP1761581B1 Curing agents for epoxy resins |
| 10/24/2007 | EP0978542B1 Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device |
| 10/24/2007 | EP0954547B1 Epoxy-polysiloxane polymer composition |
| 10/24/2007 | CN101060201A Extensible mirror body with shape memory material lining substrate |
| 10/24/2007 | CN101058709A Epoxy resin molding material for sealing use and semiconductor device |
| 10/24/2007 | CN100344695C Resin-coated copper foil, and sprinted wiring board using resin-coated copper foil |
| 10/24/2007 | CN100344694C Process for producing resin composition, modifier for polyester resin, and process for producing modified polyester resin |
| 10/24/2007 | CN100344676C Aqueous polymer dispersions |
| 10/23/2007 | US7285603 Primer-less abrasion coating for organic glass articles |
| 10/23/2007 | US7285602 Granular epoxy resin, production method thereof, and granular epoxy resin package |
| 10/23/2007 | US7285579 Solventless, non-polluting radiation curable coatings |
| 10/23/2007 | CA2204913C Thermosetting compositions with improved waiting time, preparation and uses |
| 10/18/2007 | US20070244269 Amines-epoxy compositions with high chemical resistance properties |
| 10/18/2007 | US20070244268 Hardener for Epoxy Resin and Epoxy Resin Composition |
| 10/18/2007 | US20070244267 Hydrophobic crosslinkable compositions for electronic applications |
| 10/18/2007 | US20070241436 Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device |
| 10/18/2007 | DE202007008291U1 Wärmeübertragungszusammensetzungen Heat transfer compositions |
| 10/17/2007 | EP1845130A2 Hydrophobic crosslinkable compositions for electronic applications |
| 10/17/2007 | EP1844085A1 Composition containing a hydrogenated bisglycidyl ether and a cross-linking agent |
| 10/17/2007 | EP1581577B1 Castor oil/epoxidized soybean oil based elastomeric compositions |
| 10/17/2007 | EP1581573B1 Water-based epoxy grout |
| 10/17/2007 | EP1444283B1 Autodepositing anionic epoxy resin water dispersion |
| 10/17/2007 | CN101056936A Amphiphilic block copolymer-toughened epoxy resins and powder coatings made therefrom |
| 10/17/2007 | CN101056935A Amphiphilic block copolymer-toughened epoxy resins and ambient cure high-solids coatings made therefrom |
| 10/17/2007 | CN101056934A Amphiphilic block copolymer-modified epoxy resins and adhesives made therefrom |
| 10/17/2007 | CN101056933A Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom |
| 10/17/2007 | CN101056932A Polyetheralkanolamine dispersants |
| 10/17/2007 | CN101054508A Composite epoxy type electron packaging material and preparation method thereof |
| 10/17/2007 | CN101054467A Carbon nano-tube composite material and preparation method thereof |
| 10/17/2007 | CN101054462A High conductivity polythiophene composite material and preparing method thereof |
| 10/17/2007 | CN101054461A Preparation method of carbon nano-tube/epoxy resin composite material |
| 10/17/2007 | CN101054460A Flame retardant hot set epoxy resin composition |
| 10/17/2007 | CN100343336C Organic silicon fibre retardant containing phosphorus and epoxy radical and its preparation method |
| 10/17/2007 | CN100343325C Fire-retarded epoxy resin composition, its preparing method and use |
| 10/17/2007 | CN100343322C Halogen-free epoxy resin and process for preparing same |
| 10/17/2007 | CN100343318C Hydrolysis resistant polyester elastomer compositions and related articles and methods |
| 10/17/2007 | CN100343316C Photocatalytic adhesive and its preparing method |
| 10/17/2007 | CN100343302C Flame-retardant epoxy resin composition and cured product obtained therefrom |
| 10/16/2007 | US7282543 Water-based system to manufacture polymeric coatings which generally does not require surfactants, although such surfactants may be utilized |
| 10/16/2007 | US7282266 A curable mixture free of conductive pigments comprising a reaction product of epoxy materials and a phosphorus-containing compound, a curing agent and elemental silicon; excellent adhesion between the metal substrate and any coatings; used with a weldable primer; automobile coatings |
| 10/16/2007 | CA2258644C Novolak compounds useful as adhesion promoters for epoxy resins |
| 10/11/2007 | WO2007114464A1 Resin composition for forming insulating layer |
| 10/11/2007 | WO2007114462A1 Resin composition for insulating layer |
| 10/10/2007 | EP1841803A1 Thermally curable resin composition with extended storage stability and good adhesive property |
| 10/10/2007 | EP1701690A4 Epoxy adhesive composition method of preparing using |
| 10/10/2007 | EP1408087B1 Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method |
| 10/10/2007 | CN101050300A Self-emulsifying type aqueous latex of epoxy hardener, and preparation method |
| 10/10/2007 | CN101050295A Composition of unsaturated resin, preparation method, and method of application |
| 10/10/2007 | CN100341938C Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board |
| 10/10/2007 | CN100341934C Thermosetting resin composition and use thereof |
| 10/09/2007 | US7279574 Heat conductivity, it is also useful as an insulating material requiring high heat releasability such as a printed circuit substrate |
| 10/09/2007 | US7279223 Underfill composition and packaged solid state device |
| 10/09/2007 | US7278709 Photo-curable resin composition, method of patterning the same, and ink jet head and method of fabricating the same |
| 10/09/2007 | CA2317519C Fire-resistant coating material |
| 10/04/2007 | WO2007111452A1 Reinforcing methods using as silane modified epoxy composition for underwater structure |
| 10/04/2007 | WO2007111059A1 Polyester resin composition and molded body |
| 10/04/2007 | US20070232728 resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The invention has solved the object by a resin composition for semiconductor encapsulation |
| 10/04/2007 | US20070232727 Filled epoxy compositions |