| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 12/26/2007 | CN100357346C Process for preparing multifunctional carbon nanotube for epoxy resin nano composites |
| 12/25/2007 | US7312278 Crosslinked polymer; disposable product |
| 12/25/2007 | US7312261 Metal filler particles dispersed in solvent-free hybrid epoxy polymer matrix; electronics; semiconductors; heat sinks |
| 12/25/2007 | US7312260 Epoxide adducts and their salts as dispersants |
| 12/25/2007 | US7312104 Comprises epoxy resin, curing agent, and inorganic composite oxide particles (silicon dioxide and group III/IV oxide); formed via stripping sheet on bump-mounting wafer |
| 12/25/2007 | US7311974 acid staining a grout surface, then applying clear coats comprising epoxy resins and optionally polyurethanes to increase the hardness and durability of the exterior surfaces |
| 12/25/2007 | US7311972 comprising borosilicate glass particle fillers, hardeners, accelerators, and ternary epoxy mixture consisting of bisphenol-A epoxy resins, cyclo-aliphatic epoxy resins and triglycidyl isocyanurate resins, used for encapsulation of optoelectronic device or optical components |
| 12/25/2007 | US7311971 One part, heat cured pressure sensitive adhesives |
| 12/21/2007 | WO2007145264A1 Thermosetting resin composition, method for forming antihalation film of solid-state imaging device, antihalation film of solid-state imaging device, and solid-state imaging device |
| 12/21/2007 | WO2007120203A3 Flame retardant compositions with a phosphorated compound |
| 12/20/2007 | US20070293637 epoxides in the monomer or oligomer is linked by group comprising a siloxane to a silicon atom, a binder, an acid generator capable of producing an acid upon exposure to actinic radiation; decreased shrinkage, cracking and brittleness |
| 12/20/2007 | US20070292620 curing agent for epoxy resins; for bridging cracks in a substrate; low temperature crosslinking; good adhesion to the substrate, good resistance to chemicals and resilience |
| 12/20/2007 | US20070290369 Resin Paste For Die Bonding And Its Use |
| 12/19/2007 | EP1867672A1 Epoxy resin composition |
| 12/19/2007 | EP1867671A2 Castor Oil/Epoxidized soybean oil based elastomeric compositions |
| 12/19/2007 | EP1866371A1 Ultraviolet curing resin composition |
| 12/19/2007 | EP1866369A2 Thermoset materials with improved impact resistance |
| 12/19/2007 | CN101090944A Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 12/19/2007 | CN101089048A Epoxy-organic silicon mixed resin combination and luminous semiconductor device |
| 12/19/2007 | CN101089041A Expandable or expanded mastic composition for the structural reinforcement of a hollow metal body and such a hollow body |
| 12/19/2007 | CN101088754A Molded epoxy resin sheet and its prepn process |
| 12/13/2007 | WO2007143646A2 Foamable compositions based on epoxy resins and polyesters |
| 12/13/2007 | WO2007142731A2 High elastic modulus polymer electrolytes |
| 12/13/2007 | WO2007142140A1 Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
| 12/13/2007 | WO2007141843A1 Spherical sintered ferrite particle, semiconductor sealing resin composition making use of the same and semiconductor device obtained therewith |
| 12/13/2007 | WO2006052729A8 Amphiphilic block copolymer-toughened epoxy resins |
| 12/13/2007 | US20070287811 Oligomeric halogenated chain extenders for preparing epoxy resins |
| 12/13/2007 | US20070287808 Polyamide curing agent compositions |
| 12/13/2007 | US20070287801 Moldable poly(arylene ether) thermosetting compositions, methods, and articles |
| 12/13/2007 | US20070287775 Low viscosity curable compositions |
| 12/13/2007 | US20070287021 Prepreg, Metal-Clad Laminate and Printed Circuit Board Using Same |
| 12/13/2007 | DE102006027053A1 Cast stone molded body, comprises individual surface formation, which is adapted to a surface formation of a natural stone or a wood grain |
| 12/12/2007 | EP1865013A1 Polyamide curing agent compositions |
| 12/12/2007 | EP1864323A1 Refractory solid, adhesive composition, and device, and associated method |
| 12/12/2007 | EP1863874A1 Resin compositions and methods of use thereof |
| 12/12/2007 | CN101085871A Asphalt modified by epoxy resin and rubber powder |
| 12/12/2007 | CN101085856A Low viscosity curable compositions |
| 12/12/2007 | CN101085855A Ultraviolet and high temperature aging resistant organic silicon epoxy resin composition used for luminescent diode encapsulation |
| 12/12/2007 | CN101085831A Polyamide curing agent compositions |
| 12/12/2007 | CN100354363C Thermoplastic composition having low gloss appearance |
| 12/11/2007 | US7307286 epoxy resin complex comprising an epoxy resin matrices containing silicon dioxide nanoparticles dispersions, and optionally curing agent and glass powders, used as seals for light emitting diodes; reliability and transparency within a broad temperature range |
| 12/11/2007 | US7307128 A curable compound, or adduct, or epoxy resins of anthrahydroquinone and epichlorohydrin; phenolic resin as curing agents; cured product is used for semiconductor encapsulation; solid, low melt viscosity, flame retardance, halogen-free; mechanical strength, heat resistance, moisture resistance |
| 12/11/2007 | US7307123 For stereolithography, allow for variation in color, opacity, and surface properties, form opaque white or colored objects |
| 12/06/2007 | WO2007138168A1 A vibration damping system |
| 12/06/2007 | US20070282081 Adhesive composition and adhesive film therefrom |
| 12/06/2007 | US20070282058 rapid curing and produces a cured product of excellent flexibility and adhesiveness for seals for electronic and electrical elements; product of a branched phenolic-hydroxy substituted polysiloxane, and an epoxy-functional aliphatic siloxane |
| 12/05/2007 | EP1861453A1 Process for making foam resins |
| 12/05/2007 | CN101083233A Semiconductor device encapsulated with resin composition |
| 12/05/2007 | CN101081923A High-performance compound resin and method for making same |
| 12/05/2007 | CN101081910A Sealing material, application and production process |
| 12/05/2007 | CN101081909A Sealing material, application and production process |
| 12/05/2007 | CN101081389A Process for the production of entry sheet for drilling and use thereof |
| 12/05/2007 | CN101081352A Compound material exhaustsmoke desulfurizing tower and method for making the same |
| 12/05/2007 | CN100352885C Wavelength-converting reactive resinous compound and light-emitting diode component |
| 12/05/2007 | CN100352859C Nano composite fire retardant parent material, preparation method and application |
| 12/05/2007 | CN100352858C Uvioresistant epoxy composition and its preparing method and use |
| 12/04/2007 | US7304120 Preparing a curable compound, or adduct, or epoxy resins of anthrahydroquinone and epichlorohydrin; cured product is used for semiconductor encapsulation; solid, low melt viscosity, flame retardance, halogen-free; mechanical strength, heat and moisture resistance |
| 12/04/2007 | US7304114 Processes for preparing tougheners for thermoset compositions |
| 12/04/2007 | US7304103 Process for making polymers comprising derivatized carbon nanotubes and compositions thereof |
| 12/04/2007 | US7304102 Process for making encapsulant for opto-electronic devices |
| 12/04/2007 | US7303700 formed by positioning fillers coated with coupling agents in molds, then impregnating with heated thermosetting resins, curing the resin, such that said laminate is formed and demolding the laminate |
| 12/04/2007 | CA2511567C Manufacture of void-free laminates and use thereof |
| 11/29/2007 | WO2007136600A1 Styrene copolymers with a bimodal molecular weight distribution |
| 11/29/2007 | US20070275250 Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross linking agent |
| 11/28/2007 | EP1858983A1 Curable silicone composition and electronic device produced therefrom |
| 11/28/2007 | EP1858950A1 Thermosetting composition for solder resist and cured product thereof |
| 11/28/2007 | CN101077967A Epoxy resin composition for enveloping semiconductor and semiconductor device |
| 11/28/2007 | CN101077923A Transparent epoxy nano composite material and its preparation method and use |
| 11/28/2007 | CN101077922A ABS/PC modified alloy |
| 11/28/2007 | CN100351070C Fibre reinforced vinyl ester resin base pultrusion composite |
| 11/27/2007 | US7300986 Cured network polymer containing a monomer having two or more epoxy group and one or more amide linkage; useful for making resin casting, a film, an adhesive layer, or a bonding agent |
| 11/27/2007 | US7300963 Reaction product of the diglycidyl ether of a polyalkylene oxide, bisphenol a or bisphenol f, and diglycidyl ethers of bisphenol a or bisphenol f, further reacted with a polyamine such as diethylenetriamine; low shrinkage of cured coating |
| 11/27/2007 | US7300756 for covalent attachment of target molecules (nucleic acids) onto substrate; for production of activated slides for use in preparing microarrays; solid phase synthesis |
| 11/27/2007 | CA2511569C Manufacture of void-free laminates and use thereof |
| 11/22/2007 | WO2007132493A1 Polymeric composite material for cold moulding and a process for obtaining it |
| 11/22/2007 | WO2007100734A3 A halogen-free phosphorous epoxy resin composition |
| 11/22/2007 | US20070270526 Solid resin-crosslinker mixture for use in aqueous coatings |
| 11/22/2007 | US20070269660 Coating System for Cement Composite Articles |
| 11/22/2007 | US20070269659 Electrically disbondable compositions and related methods |
| 11/22/2007 | CA2666791A1 Polymeric composite material for cold moulding and a process for obtaining it |
| 11/21/2007 | EP1763559B1 Highly concentrated, aqueous oligoester and polyester formulations |
| 11/21/2007 | EP1325937B1 Epoxy resin composition, process for producing fiber -reinforced composite materials and fiber-reinforced composite materials |
| 11/21/2007 | CN101074312A High-temperature-resisting three-prevention pouring glue and its production |
| 11/21/2007 | CN101074311A Production of micron-solid epoxy-resin microsphere containing surface active group |
| 11/21/2007 | CN100349966C Resin containing dielectric filler for formation of built-in capactor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler |
| 11/21/2007 | CN100349948C Method of preparation of a water based epoxy curing agent |
| 11/20/2007 | US7297406 Cationic base resin; blocked isocyanate crosslinking agent; organotin curing catalyst more than 50% by mass of which is monobutyltin oxide; and 100 to 2,000 ppm of zinc ions |
| 11/20/2007 | CA2511566C Manufacture of void-free laminates and use thereof |
| 11/20/2007 | CA2192368C Curable compositions |
| 11/15/2007 | WO2007129681A1 Shape memory resin |
| 11/15/2007 | WO2007129662A1 Insulating material, process for producing electronic part/device, and electronic part/device |
| 11/15/2007 | US20070261883 Methods For Improving The Flux Compatibility Of Underfill Formulations |
| 11/14/2007 | EP1854845A1 Resin composition for electronic and electric components for high-frequency applications and its molded product |
| 11/14/2007 | EP1814949A4 Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same |
| 11/14/2007 | EP1765518A4 Method of producing an epoxy composition |
| 11/14/2007 | CN101072828A Amphiphilic block copolymer-toughened epoxy vinyl ester and unsaturated polyester resins |
| 11/14/2007 | CN101072808A Method for producing acid anhydride based epoxy resin curing agent, acid anhydride based epoxy resin curing agent, epoxy resin composition, cured article therefrom and optical semiconductor device |
| 11/14/2007 | CN101072807A 热固性环氧树脂组合物及其用途 Thermosetting epoxy resin composition and use thereof |
| 11/14/2007 | CN101070421A High-heat-resisting glass-fiber reinforced polyester composite material and preparing method |
| 11/14/2007 | CN100348668C Thermosetting epoxy asphalt materials for pavement and bridge and process for preparing same |