| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 04/24/2008 | WO2008047700A1 Non-thermofusible granular phenol resin, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| 04/24/2008 | WO2008019401A3 Curable sealing method and baffle composition |
| 04/24/2008 | US20080097046 Resin composition |
| 04/24/2008 | US20080097010 resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The invention has solved the object by a resin composition for semiconductor encapsulation |
| 04/24/2008 | US20080095946 Radiation Curable Compositions |
| 04/24/2008 | DE102006049519A1 Flame retardant for curable molding materials comprises ethylenediamine phosphate, a halogen-free phosphorus compound and a halogen-free nitrogen compound |
| 04/23/2008 | EP1914285A1 Electropeeling composition, and making use of the same, adhesive and electropeeling multilayer adhesive |
| 04/23/2008 | EP1914266A1 Prepreg |
| 04/23/2008 | EP1841803A4 Thermally curable resin composition with extended storage stability and good adhesive property |
| 04/23/2008 | CN101166792A Curable silicone composition and electronic components |
| 04/23/2008 | CN101166789A Composition containing fluorine-containing aromatic polymer and laminated body containing fluorine-containing aromatic polymer |
| 04/23/2008 | CN101166772A Resorcinol-based mannich base |
| 04/23/2008 | CN101165076A Anti-flaming phosphorus-containing epoxy resin, preparation method thereof and composition containing the same |
| 04/23/2008 | CN100383172C Halogen-free phosphorus-free flame-retardant epoxy resin semi-cured composition and flame-retardant epoxy resin composition |
| 04/22/2008 | US7361290 Electroconductive resin, composition useful for forming electroconductive resin, and method of producing electroconductive resin |
| 04/17/2008 | WO2008044766A1 Resin composition |
| 04/17/2008 | WO2008044618A1 Curable resin composition, optical material, and method of regulating optical material |
| 04/17/2008 | WO2008044579A1 Epoxy resin composition for sealing of semiconductor and semiconductor device |
| 04/17/2008 | WO2008044552A1 Resin composition, insulating sheet with base, prepreg, multilayer printed wiring board and semiconductor device |
| 04/17/2008 | WO2008014053A3 Toughened activatable material for sealing, baffling or reinforcing and method of forming same |
| 04/17/2008 | US20080090965 Polyester compositions, method of manufacture, and uses thereof |
| 04/17/2008 | US20080090959 Epoxide polymer surfaces |
| 04/17/2008 | US20080090951 Dispersing nanoparticles in a solution, mixing the solution of dispersed nanoparticles with an epoxy; improved flexural strength and modulus |
| 04/17/2008 | US20080090943 Epoxy compositions |
| 04/17/2008 | DE102006048739A1 Foamable composition useful for reinforcing and/or stiffening structural members e.g. stiffening thin-walled building components, comprises epoxy resins; curatives; blowing agents; and polyesters |
| 04/16/2008 | EP1911579A1 Epoxy resin composition for encapsulating semiconductor device and thin semicondutor device |
| 04/16/2008 | CN101161755A Antifogging surface treatment agent and antifogging resin chip |
| 04/16/2008 | CN101161721A Heat conductive electrical-insulation polymeric material and heat-dissipating substrate including same |
| 04/16/2008 | CN101161720A Hot-curing resin composition |
| 04/16/2008 | CN101161702A Water dispersion method for preparing epoxy resin composite material |
| 04/16/2008 | CN100381500C Buoyancy material with micro bubble and cell composite structure |
| 04/16/2008 | CN100381497C Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same |
| 04/15/2008 | US7358312 High solid coatings; adhesives |
| 04/10/2008 | WO2008041555A1 Epoxy resin molding material for sealing and electronic component device |
| 04/10/2008 | WO2008040963A1 Composite materials with improved performance |
| 04/10/2008 | US20080085969 Epoxy resin composition for encapsulating semiconductor element and semiconductor device |
| 04/10/2008 | US20080085957 Flame-Retardant Polyester Artificial Hair |
| 04/10/2008 | US20080083995 Epoxy resin composition for encapsulating semiconductor device and thin semiconductor device |
| 04/10/2008 | CA2664927A1 Composite materials with improved performance |
| 04/09/2008 | EP1908799A1 Aqueous liquid containing vinyl-modified epoxy resin, process for producing the same, and water-based coating material |
| 04/09/2008 | EP1907492A1 Pre-sealed steel sheet with improved anti- corrosion and weldability and preparing method thereof |
| 04/09/2008 | EP1656423B1 Biodegradable polyester mixture |
| 04/09/2008 | EP1484347B1 Resin composition and optical elements |
| 04/09/2008 | CN101157790A Two-component heat-proof epoxy dipping insulating resin combination and method for making same |
| 04/09/2008 | CN101157770A Enhanced boron nitride composition and compositions made therewith |
| 04/09/2008 | CN101157524A Composite of glass and hot melt composition and method of producing the same |
| 04/09/2008 | CN100379831C Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby |
| 04/09/2008 | CN100379813C Water adhesive composition for adhering elastomer |
| 04/09/2008 | CN100379554C Autodeposition compositions |
| 04/08/2008 | US7354978 Soldering resistance; mixture with phenolic resin, hardener promoter, filler and triazole compound; encapsulating semiconductors |
| 04/08/2008 | US7354499 Separately mixing each of an epoxy base and a methylamino accelerator with microcrystalline filler, talc and titanium oxide under vacuum dispersion (accelerator mixture includes hydrocarbon resin: polyalpha-methylstyrene); blending equal amounts of mixtures formed at ambient temperature; high lubricity |
| 04/03/2008 | WO2008038257A2 Novel adducts and curable compositions using same |
| 04/03/2008 | US20080079903 Adhesives inhibiting formation of artifacts in polymer based optical elements |
| 04/03/2008 | US20080079891 Sealant and liquid crystal display using the same |
| 04/03/2008 | DE102006045814A1 Unsymmetrisch substituierte Phosphinsäuren Asymmetrically substituted phosphinic |
| 04/03/2008 | DE102006044487A1 Sheet material for repairing fibre-reinforced components, e.g. cracked panels in airliners, comprises heat-curable resin containing glass fibres with a conductive coating which heats up in an alternating electromagnetic field |
| 04/03/2008 | DE102006044486A1 Inductively heatable filler composition, useful for sealing sandwich plate edges, comprises thermosetting resin matrix containing hollow glass spheres with electrically conductive coating |
| 04/03/2008 | CA2661347A1 Novel adducts and curable compositions using same |
| 04/02/2008 | EP1906242A1 Photosensitive resin composition |
| 04/02/2008 | EP1904578A1 Toughened compositon |
| 04/02/2008 | EP1904577A2 Composition, treated backing, and abrasive articles containing the same |
| 04/02/2008 | EP1904568A1 Electroconductive curable resins |
| 04/02/2008 | EP1529079B1 Rubber-modified styrene resin composition |
| 04/02/2008 | CN101155855A Epoxy-functional polysiloxanes, silicone composition, and coated optical fiber |
| 04/02/2008 | CN101153212A Set of resin compositions for preparing system-in-package type semiconductor device |
| 04/02/2008 | CN101153109A Matched assembly of epoxy additive and method of producing the same |
| 04/02/2008 | CN101153108A Self-repaired polyalcohol composite material at room temperature |
| 04/02/2008 | CN101153107A Fire retardant resin composition |
| 04/02/2008 | CN101153067A Epoxy resin toughness reinforcing accelerant containing butylbenzene emulsion and high content aquosity epoxy resin emulsion |
| 04/02/2008 | CN101152772A Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards |
| 04/02/2008 | CN100378166C Workable solid buoyancy material for deep sea and method for preparing the same |
| 04/02/2008 | CN100378165C Epoxy composition for light semiconductor packing |
| 04/02/2008 | CN100378144C Powder slurry composition |
| 04/01/2008 | CA2514994C Epoxy resin composition |
| 04/01/2008 | CA2269378C Curable resin composition |
| 03/27/2008 | WO2008035815A1 Resin composition, prepreg and laminate |
| 03/27/2008 | WO2008035514A1 Liquid curable composition and cured product thereof |
| 03/27/2008 | US20080076856 Boron nitride powder surface is treated by calcination process or by coating with a siloxanes or silazanes |
| 03/27/2008 | US20080076051 Control of Crazing, Cracking or Crystallization of a Charge Transport Layer In a Photoconductor |
| 03/27/2008 | US20080073029 Bisphenol-A diglycidyl ether, bisphenol-F diglycidyl ether, or bisphenol-A/F diglycidyl ether as liquid epoxy resins; epoxy adduct of a dicarboxylic acid and a diglycidyl ether; a urea derivative (reaction product of diphenylmethane diisocyanate/p, p*-/ and butylamine) as thixotropic agent; curing agent |
| 03/26/2008 | EP1903605A1 Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same |
| 03/26/2008 | EP1902829A1 Three-dimensional shaped item with smoothed molding end face |
| 03/26/2008 | EP1902106A1 Primer compositions for adhesive bonding systems |
| 03/26/2008 | EP1902095A1 Curable composition and method |
| 03/26/2008 | EP1838776B1 Fire-retardant low-density epoxy composition |
| 03/26/2008 | EP1550678B1 Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
| 03/26/2008 | CN101151322A Polymeric material |
| 03/26/2008 | CN101151294A Epoxy resin composition |
| 03/26/2008 | CN101148573A Waterproof edge sealing agent used for floor |
| 03/26/2008 | CN101148535A Water-phase decomposition method for thermosetting epoxy resin or composite material thereof |
| 03/26/2008 | CN101148515A Composite pnenolic aldehyde foam heat-insulating board for building and forming method thereof |
| 03/25/2008 | US7348370 Metal oxides and hydroxides as corrosion inhibitor pigments for a chromate-free corrosion resistant epoxy primer |
| 03/25/2008 | US7348061 Slip-resistant coatings and substrates coated therewith |
| 03/25/2008 | US7348057 Acrylic adhesive sheet |
| 03/25/2008 | US7348056 Fine particle dispersion composition, optical component, optical film laminate, polarization splitting device, and method for manufacturing the optical component |
| 03/20/2008 | WO2008033611A1 Poly(arylene ether) composition, method, and article |
| 03/20/2008 | WO2008032620A1 Semiconductor device |
| 03/20/2008 | US20080071028 Crosslinked diene rubber and ethylene-propylene-diene rubber dispered in a mixture of a thermoplastic elastomer and a thermoplastic resin; ethylene oxide-propylene oxide-allyl glycidyl ether and an anion-containing salt; a polymeric micro-capsule with an acrylic outer shell; ink jet, laser printers |
| 03/20/2008 | CA2630824A1 Semiconductor device |
| 03/19/2008 | EP1900774A1 Hardenable resin composition |