Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
03/2008
03/19/2008EP1899768A1 Toner, and toner production process
03/19/2008EP1899416A1 Molding composition and method, and molded article
03/19/2008CN101144007A Heat conduction paste
03/19/2008CN101143933A Solid epoxy plastic plate and producing method thereof
03/19/2008CN100375757C Organic titanium epoxy resin catalytic ester cyanate system
03/18/2008US7345140 Phenol-reacted non-ester alicyclic diepoxides
03/18/2008US7345102 mixture of epoxy resins, curing agent and flame retarders used as seals for light emitting diodes; reliability and transparency within a broad temperature range
03/18/2008US7345101 Aqueous composition of reaction product of epoxy and phosphorus materials with curing agent
03/18/2008CA2432296C Organic carboxylate composition, method for producing the same, and additive for epoxy resin
03/18/2008CA2335229C Polycationic polymer salts, their production and use
03/18/2008CA2215503C Thermosetting composition, its uses and a flexible, unfoldable preform containing this composition
03/13/2008WO2008030048A1 Sealant composition for improving collision performance
03/13/2008US20080064792 Flame retarding and thermosetting resin composition
03/13/2008US20080064791 Encapsulation; reliable high temperature operation; including phenol resin, curing accelerator, silica and alumina
03/13/2008US20080063978 Photo-curable resin composition, method of patterning the same, and ink jet head and method of fabricating the same
03/13/2008US20080063816 Homogeneous dispersion alumina, zirconia, silicon nitride; silica, titanium black pigment; cross-linked rubber fine particles, core-shell structure; curing agent, polymerization inhibitor, ion scavenger, antioxidant; epoxy; high adhesion strength and excellent gap-forming power
03/12/2008EP1896517A1 Toughened epoxy adhesive composition
03/12/2008CN101142528A Photosensitive resin composition, printed wiring board, and semiconductor package substrate
03/12/2008CN101142280A Curable silicone composition and electronic device produced therefrom
03/11/2008US7342357 Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
03/11/2008US7341783 Functionalized polyphenylene ether
03/06/2008WO2008027119A1 Epoxy-based compositions having improved impact resistance
03/06/2008WO2008026588A1 Thermosetting resin composition, method for producing the same and circuit board
03/06/2008US20080057314 Low Heat Release and Low Smoke Reinforcing Fiber/Epoxy Composites
03/05/2008EP1895580A1 Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device
03/05/2008EP1894972A2 Photosensitive resin composition for flexible circuit board and flexible circuit board using the same
03/05/2008EP1893680A1 Flame retardant composition exhibiting superior thermal stability and flame retarding properties and use thereof
03/05/2008EP1893664A1 Sealer compositions
03/05/2008CN101137717A Non-halogen flame retardant and highly heat resistant phosphorous-modified epoxy resin compositions
03/05/2008CN101137716A 环氧树脂组合物和半导体器件 Epoxy resin composition and a semiconductor device
03/05/2008CN101134848A Clad plate and method for preparing same
03/04/2008US7339010 Polyurea prepolymer with terminal isocyanate groups, a blocking agent and a polyamine cured with a curing agent, and an epoxy resin layer with curing agent
03/04/2008US7338989 Epoxy resin as binder; polyamine as curing agent; powder coating; wear resistance
03/04/2008US7338712 Coating composition for a smoothing and/or polishing element and a grinding wheel provided with said coating composition
03/04/2008US7338226 Crosslinking agent casing is located separately from the epoxy binder and is activated externally; especially for the automotive industry and automotive repair
02/2008
02/28/2008WO2008023692A1 Casting resin composition, insulating material using the same, and insulating structure
02/28/2008WO2008023224A1 Resin compositions for coatings and coating compositions wherein these are used
02/28/2008US20080051524 Epoxy-Based Compositions Having Improved Impact Resistance
02/28/2008US20080051500 Method for Producing Aqueous Composite Particle Dispersions
02/28/2008US20080047462 Comb-Like Polyetheralkanolamines In Inks
02/28/2008DE10328525B4 Verwendung von Siebdrucklacken bei der Herstellung von Abziehbildern zur Dekoration von keramischen Substraten, Porzellan und Glas The use of screen printing in the manufacture of paints decals for decorating ceramic substrates, porcelain and glass
02/27/2008EP1501909B1 Wavelength-converting reactive resinous compound and light-emitting diode component
02/27/2008CN101133120A Epoxy resin composition for semiconductor encapsulation and semiconductor device
02/27/2008CN101130633A High impact polyphenylene sulfide alloy material and method of producing the same
02/27/2008CN101130622A Epoxy resin composition and epoxy asphalt mixture
02/27/2008CN100371387C Epoxidation silicon oil modified three kinds of composite material of epoxy resin
02/27/2008CN100371376C Fireproof epoxy resin composite and its application
02/27/2008CN100371368C Preparation method of sealing packing material for in vivo embedding microelectronic device
02/26/2008CA2337389C Aqueous dispersions of epoxy resins and a process to prepare them
02/21/2008WO2007149377A3 Epoxy adhesive composition and use thereof
02/21/2008WO2007013761A8 Pre-sealed steel sheet with improved anti- corrosion and weldability and preparing method thereof
02/21/2008US20080045632 Method for preventing blocking and deterioration in flowability of epoxy molding compound powder
02/21/2008US20080044660 Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards
02/20/2008EP1890352A1 Fuel cell separator composition, fuel cell separator, and method for producing the same
02/20/2008EP1890324A2 Circuit-connecting material and circuit terminal connected structure and connecting method
02/20/2008EP1889862A1 Curable resin composition, process for producing the same, and coated object made with the same
02/20/2008EP1888680A1 Unsaturated polyester resin or vinyl ester resin composition
02/20/2008EP1888478A1 Use of epoxy derivatives as additives for cementitious building materials
02/20/2008EP1149130B1 Acrylic terpolymer for the use as a self-fixturing adhesive
02/20/2008CN101128503A Two-component epoxy adhesive composition
02/20/2008CN101128502A Latent hardener for epoxy resin and epoxy resin composition
02/20/2008CN101126013A Cold-setting bi-component water-proof anti-rot material
02/20/2008CN100369964C Resin composition, prepreg and laminate using the composition
02/14/2008WO2008018873A1 Comb-like polyetheralkanolamines in inks and coatings
02/14/2008WO2008018557A1 Semiconductor package and method for manufacturing same, and sealing resin
02/14/2008US20080039595 Oligomeric halogenated chain extenders for preparing epoxy resins
02/14/2008US20080039594 epoxidized butadiene, isoprene homopolymers, copolymers; tackifying resin; photoinitiator; for labelling packages
02/14/2008US20080039591 Acid Anhydride Ester and Composition Thereof, and Heat-Curable Resin Composition and Cured Product Thereof
02/14/2008US20080039557 Carbon nanotube composite and method for fabricating the same
02/14/2008US20080039556 Encapsulated Epoxy-Resin Molding Compound, And Electronic Component Device
02/13/2008EP1887028A1 Process for producing rubbery polymer particle and process for producing resin composition containing the same
02/13/2008EP1885800A1 Polymeric composite material for cold moulding and a process for obtaining it
02/13/2008EP1885774A2 Use of a particular composition for producing parts by filament winding
02/13/2008EP1885764A1 Two-component epoxy adhesive composition
02/13/2008CN101124275A Fire-retardant low-density epoxy composition
02/13/2008CN101124258A Thermosetting composition for solder resist and cured product thereof
02/13/2008CN101121878A Thermally conductive material
02/13/2008CN101121812A Epoxy resin base fast repairing material and preparation method thereof
02/13/2008CN100368475C Curable flame retardant epoxy resin compositions
02/12/2008US7329711 Moldings containing polyarylene ether sulfones, fillers, and additives
02/12/2008CA2185207C 1-imidazolylmethyl-2-naphthols as catalysts for curing epoxy resins
02/07/2008US20080033117 Sealing epoxy resin; reducing dielectrics: toughness
02/07/2008US20080032176 Fuel cell separator composition, fuel cell separator, and method for producing the same
02/07/2008US20080029216 Applying a two phase mixture of an acrylic acid-functional terpolymer and an epoxy-functional copolymer, adding moisture; use as protective coatings and adhesion for production of laminates, antigraffiti coatings, construction, automotive industries; overcome disadvantages of pressure-sensitive adhesives
02/06/2008EP1884531A1 Sheet molding compounds (smc) comprising thermosetting resins based on renewable resources
02/06/2008EP1523519B1 Tool consisting of plastic material
02/06/2008CN101120627A Electromagnetic-wave-shielding adhesive film, process for producing the same, and method of shielding adherend from electromagnetic wave
02/06/2008CN101120072A Resin composition for sealing material, sealing material, sealing method and electroluminescent display
02/06/2008CN101120049A Resin for filling into electronic substrate
02/06/2008CN101117560A Method for preparing modified epoxide resin embedding material
02/06/2008CN101117429A Method for producing flame-proof insulating epoxy powder
02/06/2008CN101117428A Process for making compound base-material
02/06/2008CN101117390A Method for preparing aqueous epoxy emulsion
02/06/2008CN100367521C Wavelength-converting casting composition and white light-emitting semiconductor component
02/06/2008CN100366697C Foamable underfill encapsulant
02/05/2008US7326755 Blend of a phenolic resin, an epoxy resin, and the reaction product of an amino-functional silane (N-phenyl-gamma-aminopropyltrimethoxysilane) and an isocyanato-functional silane (gamma-isocyanatopropyltriethoxysilane); surface treated talc; bonding an elastomer to a metal
02/05/2008CA2300169C Aqueous dispersions of epoxy resins
01/2008
01/31/2008WO2008013346A1 Method of preparing resin composition for artificial marble chip having high specific gravity and high index of refraction
01/31/2008US20080027169 Thermohardenable Epoxy Resin-Based Compositions, 3(4)-(Aminomethyl)-Cyclohexane-Propanamine and 1,4(5)-Cyclooctane Dimethanamine
01/31/2008CA2652744A1 Toughened activatable material for sealing, baffling or reinforcing and method of forming same