| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
|---|
| 05/25/2011 | CN102076735A Epoxy resin composition and prepreg using same |
| 05/25/2011 | CN102076734A Modified resin composition, method for producing the same, and curable resin composition containing the same |
| 05/25/2011 | CN102076733A Epoxy resin composition |
| 05/25/2011 | CN102070875A Epoxy resin glue for photoelectron attenuation-resistant packaging |
| 05/25/2011 | CN102070874A High-permeability and high-strength epoxy grouting material, preparation method thereof and application thereof |
| 05/25/2011 | CN102070873A Environmentally-friendly flexible epoxy resin grouting material |
| 05/25/2011 | CN102070770A Phosphorous epoxy resin curing agent and preparation method thereof |
| 05/25/2011 | CN102070760A Method for preparing aqueous epoxy resin curing agents |
| 05/25/2011 | CN102070233A Quaternary ammonium salt positive ion-type organic polymeric flocculant and preparation method thereof |
| 05/25/2011 | CN101189274B Latent curing agent |
| 05/25/2011 | CN101137620B Base multiplying agents and base-reactive curable compositions |
| 05/25/2011 | CN101052919B Sulfonic-ester-containing composition for formation of antireflection film for lithography |
| 05/25/2011 | CN101037529B Photosensitive thermosetting resin composition, flattened and resist film coated printed wiring board and method of preparing the same |
| 05/24/2011 | US7947785 Polyoxazolidones derived from bisanhydrohexitols |
| 05/24/2011 | US7947779 Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer |
| 05/24/2011 | US7947759 Cement products and methods of making and using the same |
| 05/19/2011 | WO2011059633A2 Polyoxazolidone resins |
| 05/19/2011 | WO2011058962A1 Epoxy resin composition |
| 05/19/2011 | US20110118423 Development of a cross-linked epoxy resin with flame-retardant properties |
| 05/19/2011 | US20110118387 Sealer compositions |
| 05/19/2011 | US20110118374 Method for Preparing a Hard Film or Coating from a Cationically Cross-Linkable/Polymerizable Composition Comprising an Iodonium Borate and Giving Off an Acceptable Odour |
| 05/19/2011 | CA2778906A1 Curable compositions |
| 05/18/2011 | EP2323178A2 Light-emitting device, method for manufacturing same, molded body and sealing member |
| 05/18/2011 | EP2322569A2 Polymer derivates |
| 05/18/2011 | EP1858905B1 Organotrisiloxane, its preparation and its use in curable resin composition |
| 05/18/2011 | CN1930206B Epoxy adhesive composition |
| 05/18/2011 | CN1603300B Cyclohexanetricarboxylic monoester and its use |
| 05/18/2011 | CN102066454A Optically isomeric thin film material and optically isomeric thin film |
| 05/18/2011 | CN102066453A Thermosetting resin containing irradiated thermoplastic toughening agent |
| 05/18/2011 | CN102066452A Polyamine having a reduced blushing effect, and use thereof as a curing agent for epoxy resins |
| 05/18/2011 | CN102066451A Hyperbranched polymers and oligomers comprising terminal amino groups as curing agents for epoxy resins |
| 05/18/2011 | CN102061065A Photosensitive cured super resin composition for sealing liquid crystal display (LCD) and preparation method thereof |
| 05/18/2011 | CN102061064A Fast curing epoxy resin system for blades of wind driven generator and preparation method thereof |
| 05/18/2011 | CN102061063A Epoxy resin injecting paste material for maintenance of road engineering and preparation method thereof |
| 05/18/2011 | CN102061062A Synthetic resin composition for cast-in-situ medium-voltage bus |
| 05/18/2011 | CN102061060A High-reliability intelligent-card encapsulating glue and preparation method thereof |
| 05/18/2011 | CN102060979A Novel epoxy modified resin for anti-corrosion primer and one-step preparation method thereof |
| 05/18/2011 | CN102060978A Pyridine polyether ionic liquid toughened epoxy resin and preparation method thereof |
| 05/18/2011 | CN102060977A Brominated epoxy resin with highly symmetrical or saturated aliphatic heterocyclic ring and preparation method thereof |
| 05/18/2011 | CN102060976A Method for preparing epoxy toughening diluent from solar silicon wafer cutting waste liquid |
| 05/18/2011 | CN101307132B Epoxy resins modified by silanol hydroxyl or alkoxyl blocking silicone resin and method for preparing same |
| 05/18/2011 | CN101096411B Curing agent for epoxy resin and coating composition |
| 05/17/2011 | US7943726 Process for preparation of oxymethylene polymers in a homogeneous phase, and use |
| 05/17/2011 | US7943706 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 05/17/2011 | CA2630163C Copolymers produced from reacting a glycidyl ester and/or ether with a polyol and the use of the copolymers in coating compositions |
| 05/17/2011 | CA2623337C Radiation-curing resin composition and prepreg |
| 05/17/2011 | CA2502961C Aqueous non-ionically stabilised epoxy resins |
| 05/12/2011 | WO2011055850A1 Phosphorus-containing epoxy resin, resin composition and fire-resistant cured product thereof |
| 05/12/2011 | WO2011055784A1 Thermopolymerization initiator system and adhesive composition |
| 05/12/2011 | WO2011055667A1 Coating composition and optical article |
| 05/12/2011 | WO2011055588A1 Adhesive composition |
| 05/12/2011 | WO2011055531A1 Solar cell module |
| 05/12/2011 | WO2011054770A1 Process for manufacturing an epoxy resin |
| 05/12/2011 | WO2011054769A2 Process for manufacturing a product derived from epichlorohydrin |
| 05/12/2011 | US20110111663 Epoxy resin composition and prepreg using the same |
| 05/12/2011 | US20110111662 Thermosetting Resin Composition for High Performance Laminates |
| 05/11/2011 | EP2319878A1 Epoxy resin composition and prepreg using same, fiber-reinforced composite resin tubular body manufactured from the prepreg and manufacturing method therefor, and fiber-reinforced composite resin molded body |
| 05/11/2011 | EP2319877A1 Aqueous stoving binder |
| 05/11/2011 | EP2318450A2 Novel curing agents and process for their manufacture |
| 05/11/2011 | EP2217637B1 Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins |
| 05/11/2011 | EP1451122B1 Sizing composition for glass yarns, the glass yarns thus obtained and composite materials comprising said yarns |
| 05/11/2011 | CN1942508B Optical refractive index-modifying polymer composition, hologram recording material and method of controlling refractive index |
| 05/11/2011 | CN102056934A Silylimidazolium salt complexes |
| 05/11/2011 | CN102051026A Halogen-free flame-retardant epoxy resin composition and application thereof |
| 05/11/2011 | CN102051025A Halogen-free flame-retardant epoxy resin composition and application thereof |
| 05/11/2011 | CN102051024A Halogen-free flame-retardant epoxy resin composition and application thereof |
| 05/11/2011 | CN102051022A Epoxy resin composition as well as prepreg and laminated board made of same |
| 05/11/2011 | CN102050939A Thermosetting resin composition with acid anhydride curing |
| 05/11/2011 | CN102050930A Photocurable resin composition containing anthraquinone derivative |
| 05/11/2011 | CN101538399B Damping type epoxy resin material and preparation method thereof |
| 05/11/2011 | CN101348562B Preparation of aliphatic alcohol polyether type aqueous amine epoxy hardener |
| 05/11/2011 | CN101300284B Epoxy resin composition, method for forming conductive film, method for forming conductive pattern and method for manufacturing multilayered wiring board |
| 05/11/2011 | CN101283016B Thermosetting epoxy resin composition and semiconductor device |
| 05/11/2011 | CN101177479B Method for preparing self-emulsification aqueous epoxy resin emulsion |
| 05/10/2011 | US7939622 Polymer compound and organic light-emitting device using the same |
| 05/05/2011 | WO2011052161A1 Curable resin composition for optical semiconductor encapsulation, and cured product of same |
| 05/05/2011 | WO2011052157A1 Resin composition for semiconductor encapsulation and semiconductor device using the resin composition |
| 05/05/2011 | WO2011051430A1 Premix and method for producing a thermally expandable and curable epoxy-based compound |
| 05/04/2011 | EP2316883A1 Unsaturated ester resin composition, unsaturated ester-cured product, and manufacturing method therefor |
| 05/04/2011 | EP2315730A2 Curable polymer mixtures |
| 05/04/2011 | EP1854819B1 Epoxy resin composition, cured object obtained therefrom, semiconductor-encapsulating material, novel phenolic resin, and novel epoxy resin |
| 05/04/2011 | CN102047774A Resin composition for forming the adhesive layers of a multi-layer flexible printed circuit board |
| 05/04/2011 | CN102046727A Novel resin composition and use thereof |
| 05/04/2011 | CN102046726A Epoxy resin composition for printed wiring board, solder resist composition, resin film, resin sheet, prepreg, metal foil with resin, cover lay, and flexible printed wiring board |
| 05/04/2011 | CN102046691A Carboxyl group-containing resin, curable composition containing carboxyl group-containing resin, and cured product of the composition |
| 05/04/2011 | CN102046690A Optical semiconductor sealing resin composition and optical semiconductor device using same |
| 05/04/2011 | CN102046689A Process for manufacturing liquid epoxy resins |
| 05/04/2011 | CN102040934A Silver conductive adhesive and preparation method thereof |
| 05/04/2011 | CN102040805A Epoxy resin system for manufacturing blade mould of wind-driven generator and preparation method thereof |
| 05/04/2011 | CN102040804A 环氧树脂组成物 An epoxy resin composition |
| 05/04/2011 | CN102040802A Epoxy resin system and application thereof |
| 05/04/2011 | CN102040801A Epoxy resin composition as well as film and substrate |
| 05/04/2011 | CN102040744A Mixed salt flame retardant of phosphoric acid, gluconic acid and melamine and preparation method thereof |
| 05/04/2011 | CN102040738A Method for preparing water-soluble acrylic epoxy resin |
| 05/04/2011 | CN102040568A Synthesis method of low-molecular weight epoxy resin |
| 05/04/2011 | CN102039701A Prepreg and metal foil substrate |
| 05/04/2011 | CN101321800B Phenolic resin, process for production thereof, epoxy resin, and use thereof |
| 05/04/2011 | CN101240104B Alkylated polyalkyleneamines and uses thereof |
| 05/04/2011 | CN101220135B Synthesis of o-cresol formaldehyde epoxy resin |
| 05/04/2011 | CN101103311B Cationic photopolymerizable epoxy resin composition, minute structural member using the same and method for manufacturing minute structural member |