| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
|---|
| 06/29/2011 | CN102112095A Initiator system with biphenylene derivates, method of production and use thereof |
| 06/29/2011 | CN102108185A Epoxy matrix resin and prepreg and preparation method thereof and device for preparation thereof |
| 06/29/2011 | CN102108184A Epoxy resin composition and application thereof |
| 06/29/2011 | CN101591440B Epoxy resin modified by isocyanate terminated silicon rubber and preparation method thereof |
| 06/29/2011 | CN101307183B Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method |
| 06/29/2011 | CN101044183B Polyepoxy compound, method for producing same, thermosetting resin composition containing same, cured product of such composition, and method for removing such cured product |
| 06/29/2011 | CN101040025B Epoxy adhesive composition |
| 06/28/2011 | US7968672 Phenolic resin, process for production thereof, epoxy resin, and use thereof |
| 06/28/2011 | US7968656 Faster absorption or hydrolysis, while preserving mechanical strength required for e.g. surgical sutures; also used to produce microspheres for use as an injectable composition or drug delivery carrier; copolymer of diglycolid acid, diethylene glycol, and a lactone |
| 06/28/2011 | US7968622 Inkjet ink composition for color filter, production method for color filter, and color filter |
| 06/28/2011 | US7968193 Polymer mixture of organosilicon polymer and addition polymer |
| 06/23/2011 | WO2011075217A1 Epoxy resin curing compositions and epoxy resin systems including same |
| 06/23/2011 | WO2011075216A1 Epoxy resin curing compositions and epoxy resin systems including same |
| 06/23/2011 | WO2011075128A1 Heat-curable epoxy functional composition and transparent heat-cured caustic-resistant hard-coatings prepared therefrom |
| 06/23/2011 | WO2011074517A1 Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product |
| 06/23/2011 | WO2011074494A1 Composition for formation of resist underlayer film |
| 06/23/2011 | WO2010018392A3 Novel curing agents and process for their manufacture |
| 06/23/2011 | US20110152497 Catalysts and methods for polymer synthesis |
| 06/23/2011 | US20110152492 Polymer Compositions and Methods of Making and Using Same |
| 06/23/2011 | US20110152448 Epoxy resin curing compositions and epoxy resin systems including same |
| 06/23/2011 | US20110150819 Inhibition of bacterial biofilms with imidazole derivatives |
| 06/23/2011 | CA2784735A1 Epoxy resin curing compositions and epoxy resin systems including same |
| 06/23/2011 | CA2784734A1 Epoxy resin curing compositions and epoxy resin systems including same |
| 06/22/2011 | EP2336214A1 A two-component adhesive suitable for construction purposes, its use and the cured structural bonds obtained thereby |
| 06/22/2011 | EP2336213A1 Low viscosity epoxide resin compound with low blushing |
| 06/22/2011 | EP2334711A1 Epoxy resins and composite materials with improved burn properties |
| 06/22/2011 | DE102004006312B4 Mehrschichtige Leiterplatte, ein Verfahren zu deren Herstellung und einen isolierenden Film Multilayer printed wiring board, a process for their preparation and an insulating film |
| 06/22/2011 | CN201873637U O-cresol-formaldehyde epoxy resin treatment device based on two-stage solvent removal agent |
| 06/22/2011 | CN102101935A Halogen-free epoxy resin composition and flexible copper clad plate prepared from same |
| 06/22/2011 | CN101665475B Preparation method of tetraglycidyl-3,3'-diethyl-4,4'-diaminodiphenyl-methane |
| 06/16/2011 | WO2011071726A2 Curable resin compositions useful as underfill sealants for low-k dielectric-containing semiconductor devices |
| 06/16/2011 | WO2011071650A1 Hydroxyl-functional polyester resins |
| 06/16/2011 | WO2011070739A1 Epoxy resin composition for semiconductor encapsulation, cured product thereof, and semiconductor device using epoxy resin composition |
| 06/16/2011 | WO2011070074A1 Polyether-modified epoxy amine adducts as wetting and dispersing agents |
| 06/16/2011 | WO2011069846A1 Low-viscosity epoxy resin composition with low blushing |
| 06/16/2011 | US20110144259 Use of 1,1-dimethylol cycloalkanes or 1,1-dimethylol cycloalkenes for the production of polymers |
| 06/16/2011 | DE19757762B4 Verfahren zur Herstellung von Bindemittelsystemen und Verwendung Process for the preparation of binder systems and using |
| 06/15/2011 | EP2333000A1 Polyether modified epoxide-amine adducts as wetting and dispersing agents |
| 06/15/2011 | EP2331599A1 Photocurable composition |
| 06/15/2011 | EP2331456A1 Process for purifying hydrogen chloride |
| 06/15/2011 | EP2147035B1 Pre-impregnated composite materials with improved performance |
| 06/15/2011 | CN201864681U One-step solid epoxy resin water-saving production system |
| 06/15/2011 | CN102099395A Adhesion promoter compounds for oiled steel |
| 06/15/2011 | CN102093672A Halogen-phosphorus-free flame retardant epoxy resin composition and application thereof in bonding sheet and copper-clad plate |
| 06/15/2011 | CN102093671A Epoxy resin composite and pouring method thereof |
| 06/15/2011 | CN102093667A Epoxy resin composite and covering film prepared from same |
| 06/15/2011 | CN102093666A Halogen-free resin composite and preparation method of halogen-free copper clad laminate using same |
| 06/15/2011 | CN102093665A Heat conduction insulating casting glue and preparation method thereof |
| 06/15/2011 | CN102093664A Thermosetting glue solution for copper-clad substrate, preparation method thereof and forming process of halogen-free flame-retardant copper-clad substrate |
| 06/15/2011 | CN101717490B Rosin-modified epoxy ester resin and preparation method thereof |
| 06/15/2011 | CN101321799B Liquid resin composition for electronic element and electronic element device |
| 06/15/2011 | CN101283017B High-stability microencapsulated hardener for epoxy resin and epoxy resin composition |
| 06/15/2011 | CN101084250B Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition |
| 06/14/2011 | US7960483 Adamantane derivative, composition comprising the derivative, and optical and electronic member using the composition |
| 06/14/2011 | US7959838 Epoxy resin for prepreg, prepreg, fiber-reinforced composite material and methods for production thereof |
| 06/09/2011 | WO2011068858A1 Adducts based on divinylarene oxides |
| 06/09/2011 | WO2011068645A1 Coating compositions |
| 06/09/2011 | WO2011068644A1 Epoxy resin compositions |
| 06/09/2011 | WO2011068157A1 Resin composition for use in formation of bonding layer in multilayer flexible printed circuit board, resin varnish, resin-coated copper foil, manufacturing method for resin-coated copper foil for use in manufacturing of multilayer flexible printed circuit board, and multilayer flexible printed circuit board |
| 06/09/2011 | WO2011068092A1 Epoxy resin composition |
| 06/08/2011 | EP2330600A1 Insulating polymer material composition |
| 06/08/2011 | EP1785441B1 Epoxy resin composition, products of curing thereof, material for the encapsulation of semiconductors, novel phenol resin, novel epoxy resin, process for production of novel phenol resin and process for production of novel epoxy resin |
| 06/08/2011 | EP1504051B1 Organo-functional polysiloxanes |
| 06/08/2011 | CN201855696U Vertical type ethoxylation reactor |
| 06/08/2011 | CN1984959B Comb-like polyetheralkanolamines in inks |
| 06/08/2011 | CN1950419B Cationically photopolymerizable composition |
| 06/08/2011 | CN102089870A Gate insulating material, gate insulating film, and organic field effect transistor |
| 06/08/2011 | CN102089346A Composition, polymerizable composition, resin, optical component, and production method of composition |
| 06/08/2011 | CN102086363A Epoxy resin adhesive using modified multielement sulfur alcohol as solidifying agent and preparation method thereof |
| 06/08/2011 | CN102086260A Preparation method of plant oil-based degradable nano compound material |
| 06/08/2011 | CN101698700B Silicon, nitrogen and phosphor coordinate antiflaming epoxide resin |
| 06/08/2011 | CN101313005B Epoxy resin composition |
| 06/03/2011 | WO2011065813A1 Water curable resin formulations |
| 06/03/2011 | WO2011065365A1 Epoxy resin composition for sealing semiconductors, and semiconductor devices |
| 06/03/2011 | WO2011065174A1 Single-component epoxy resin composition and use thereof |
| 06/03/2011 | WO2011065044A1 Curable resin composition and cured product thereof |
| 06/03/2011 | WO2011064176A1 Aqueous epoxy resin dispersions |
| 06/02/2011 | US20110130524 Mixtures of amines with guanidine derivatives |
| 06/01/2011 | EP2327814A1 Leveler Compounds |
| 06/01/2011 | EP2327731A1 A two-component mortar composition suitable for construction purposes, its use and the cured structural objects obtained thereby |
| 06/01/2011 | EP2326679A1 Epoxy resin composition |
| 06/01/2011 | CN102083881A Modified epoxy resin, epoxy resin compositions and cured articles |
| 06/01/2011 | CN102079874A Preparation method of cage-type silsesquioxane-containing low-dielectric cyanate hybrid resin |
| 06/01/2011 | CN102079810A Synthesis and application of light-cured polyurethane-acrylic acid-epoxy resin adhesive |
| 05/31/2011 | US7951878 Reacting an aldehyde or ketone with phosphinic acid; for printed circuits |
| 05/31/2011 | US7951868 Carboxyl group-containing polyurethane and uses thereof |
| 05/26/2011 | WO2011062607A1 Amine adducts |
| 05/26/2011 | WO2011062248A1 Epoxy-containing ethylene copolymer and resin composition |
| 05/26/2011 | WO2011062182A1 Aromatic sulfonium salt compound |
| 05/26/2011 | WO2011062053A1 Flame-retardant solder resist composition and flexible wiring board which is obtained using same |
| 05/26/2011 | WO2011061910A1 Novel thermal radical generator, method for producing the same, liquid crystal sealing agent, and liquid crystal display cell |
| 05/26/2011 | WO2011061906A1 Semiconductor device |
| 05/26/2011 | WO2011061452A2 Bicarbonate precursors, method for preparing same and uses thereof |
| 05/26/2011 | CA2781307A1 Bicarbonate precursors, method for preparing same and uses thereof |
| 05/26/2011 | CA2778802A1 Amine adducts |
| 05/25/2011 | EP2325222A1 Fiber-reinforced polymers, epoxy-based polymeric compositions and use thereof |
| 05/25/2011 | EP2325221A1 Aqueous epoxy resin dispersions |
| 05/25/2011 | EP2137277B1 Heat-resistant structural epoxy resins |
| 05/25/2011 | EP1700874B1 Curable composition |
| 05/25/2011 | CN102076736A Coating composition for the storage of waste that is toxic to health and/or the environment, which is free from an aromatic amine curing agent |