| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 08/03/2011 | CN102144265A Insulating polymer material composition |
| 08/03/2011 | CN102143987A Heat-cured epoxy resin composition |
| 08/03/2011 | CN102143986A Siloxane compound, curable resin composition, cured object obtained therefrom, and photosemiconductor element |
| 08/03/2011 | CN102143985A Process for continuous production of epoxy resins |
| 08/03/2011 | CN102140323A High adhesive force dipping-adhesive manufacturing process |
| 08/03/2011 | CN101432330B Resin composition, prepreg, laminate, and wiring board |
| 08/03/2011 | CN101370846B Curing agents for epoxy-functional compounds |
| 08/02/2011 | USRE42593 Photo-curable resin composition used for photo-fabrication of three-dimensional object |
| 08/02/2011 | US7989582 Process for producing poly-tetrahydrofuran |
| 08/02/2011 | US7989557 Surface improver for reinforced composite compositions |
| 08/02/2011 | US7989556 Modifier for polyester resin and process for producing molded article with the same |
| 08/02/2011 | US7989523 Alicyclic diepoxy compound, epoxy resin composition comprising the same, and cured article therefrom |
| 08/02/2011 | US7989517 Actinic ray curable composition, actinic ray curable ink, and image formation process employing the same |
| 07/28/2011 | WO2011090038A1 Thermosetting resin composition, flip-chip mounting adhesive, semiconductor device fabrication method, and semiconductor device |
| 07/28/2011 | WO2011089947A1 Light-resistant sealing resin composition |
| 07/28/2011 | WO2011089874A1 Clathrate and method for producing same |
| 07/28/2011 | WO2011088950A1 Epoxy resin composition and surface mounting device coated with said composition |
| 07/28/2011 | WO2011071961A3 Divinylarene dioxide presins |
| 07/28/2011 | WO2011059883A3 One-pack type liquid epoxy resin composition and adhesion method using same |
| 07/28/2011 | WO2011048022A3 Impact resistant two-component epoxy-based substance curing at room temperature |
| 07/28/2011 | CA2785777A1 Epoxy compositions and surfacing films therefrom |
| 07/27/2011 | EP1447420B1 Curable resin composition |
| 07/27/2011 | CN102134376A Halogen-free flame-retardant resin composition and preparation method of prepreg and laminated plate |
| 07/27/2011 | CN102134375A Halogen-free Tg resin composite and presoaked material and laminated board made by adopting same |
| 07/27/2011 | CN102134306A Cardanol epoxy floor curing agent and preparation method thereof |
| 07/27/2011 | CN102134305A Solvent lignin-modified epoxy resin curing agent and preparation method thereof |
| 07/27/2011 | CN102134304A Reactive type phosphoric epoxy resin flame retardant and preparation method thereof |
| 07/27/2011 | CN102134303A Resin composition, prepreging, laminating, and wiring board |
| 07/27/2011 | CN101787110B Photoelastic plastic material and preparation method |
| 07/27/2011 | CN101693760B Polyacrylic acid lead base epoxy resin radiation protection composite material and preparation method thereof |
| 07/27/2011 | CN101659677B Triphosphazene epoxy resin and preparation method thereof |
| 07/27/2011 | CN101597371B High-ductility co-cured resin of cyanate, preparation method and use thereof |
| 07/27/2011 | CN101128505B Epoxy resin composition, cured object obtained therefrom, semiconductor-encapsulating material, novel phenolic resin, and novel epoxy resin |
| 07/26/2011 | US7985822 Epoxy resin cured with phenol-formaldehyde resin |
| 07/26/2011 | US7985808 Distortional matrix of epoxy resin and diamine |
| 07/21/2011 | WO2011087486A1 Oxazolidone ring contaning adducts |
| 07/21/2011 | WO2011087477A1 Substantially solvent-free epoxy formulations |
| 07/21/2011 | WO2011061452A3 Bicarbonate precursors, method for preparing same and uses thereof |
| 07/21/2011 | WO2011055141A3 Syntactic foam |
| 07/21/2011 | US20110178252 Phenol novolac resin, phenol novolac epoxy resin and epoxy resin composition |
| 07/20/2011 | EP2346044A1 Uv-curable resin compositions for optical discs and cured products thereof |
| 07/20/2011 | EP1876495B1 Composition comprising polymer having ethylene-dicarbonyl structure for use in forming anti-reflective coating for lithography |
| 07/20/2011 | CN1957013B Resin composition for encapsulating semiconductor and semiconductor device |
| 07/20/2011 | CN1957012B Hardener for epoxy resin and epoxy resin composition |
| 07/20/2011 | CN102131867A Magnetic sheet composition, magnetic sheet, and process for producing magnetic sheet |
| 07/20/2011 | CN102131841A Epoxy resin composition and prepreg using same, fiber-reinforced composite resin tubular body manufactured from prepreg and manufacturing method therefor, and fiber-reinforced composite resin molded body |
| 07/20/2011 | CN102127291A Halogen-free epoxy resin composition and covering film prepared from same |
| 07/20/2011 | CN102127290A Epoxy resin composition and flexible copper-clad plate prepared from same |
| 07/20/2011 | CN102127206A Hyperbranched polyetheramine and preparation method thereof |
| 07/20/2011 | CN102127205A Phosphorus-containing epoxy resin semi-cured material and preparation method thereof |
| 07/20/2011 | CN102127036A Process for producing epichlorhydrin |
| 07/20/2011 | CN102127025A Tri(2-hydroxyl cyclohexyl) isocyanurate as well as preparation method and application thereof |
| 07/20/2011 | CN101717557B Hot curing conductive silver slurry for manufacturing radio frequency identification (RFID) tag antenna |
| 07/20/2011 | CN101671318B Cycloaliphatic epoxy resin and preparation method thereof |
| 07/20/2011 | CN101649041B Method for preparing self-emulsifying aqueous epoxy resin curing agent |
| 07/20/2011 | CN101531754B Method for preparing phosphorus containing epoxide resin |
| 07/19/2011 | US7981951 Process for producing epoxides from olefinic compounds |
| 07/19/2011 | US7981515 Bis epoxy polyesters and food cans coated with a composition comprising same |
| 07/19/2011 | US7981511 Hollow resin fine particles, organic/inorganic hybrid fine particles, and method for producing hollow resin fine particles |
| 07/14/2011 | WO2011084583A1 Multifunctional additives in engineering thermoplastics |
| 07/14/2011 | WO2011084304A1 Production of epoxy resins using improved ion exchange resin catalysts |
| 07/14/2011 | US20110172384 Phosphorus-containing epoxy resin and method for synthesizing the same |
| 07/14/2011 | US20110172331 Reactive monomer-dispersed silica sol and production method thereof, and curable composition and cured article thereof |
| 07/14/2011 | US20110170227 Anchor group for monolayers of organic compounds on metal and component produced therewith by means of organic electronics |
| 07/14/2011 | CA2784756A1 Multifunctional additives in engineering thermoplastics |
| 07/13/2011 | EP2343597A2 Composition for forming underlayer coating for lithography containing epoxy compound and carboxylic acid compound |
| 07/13/2011 | EP2343327A1 Curable resin composition and cured product thereof, printed circuit board, and epoxy resin and method for producing same |
| 07/13/2011 | EP2343326A1 Photocurable composition and cured product |
| 07/13/2011 | EP2342209A1 Solar cells modules comprising low haze encapsulants |
| 07/13/2011 | CN102124054A Unsaturated ester resin composition, unsaturated ester-cured product, and manufacturing method therefor |
| 07/13/2011 | CN102120865A Epoxy-phenolic aldehyde amine composition and preparation method and application thereof |
| 07/13/2011 | CN102120864A Composition for forming substrate, and prepreg and substrate using the same |
| 07/13/2011 | CN102120721A Method for preparing epoxy resin curing agent by degrading polyethylene terephthalate with glycerine |
| 07/13/2011 | CN101479310B Amine imide compound to be activated by irradiation of active energy ray, composition using the same, and method for curing the same |
| 07/13/2011 | CN101239292B Surfactant and preparation and application thereof |
| 07/06/2011 | EP2341510A1 Blockcopolymer solid electrolyte, ion-conductive membrane and process for producing the blockcopolymer |
| 07/06/2011 | EP2341093A1 Novel diamino-alcohol compounds, their manufacture and use in epoxy resins |
| 07/06/2011 | EP2341092A1 Epoxy compound and manufacturing method thereof |
| 07/06/2011 | CN201891623U Epoxy resin processing air cooling device |
| 07/06/2011 | CN102119201A One-part structural epoxy resin adhesives containing elastomeric tougheners capped with phenols and hydroxy-terminated acrylates or hydroxy-terminated methacrylates |
| 07/06/2011 | CN102119184A Thermosetting composition |
| 07/06/2011 | CN102115575A Preparation method of recyclable resin mold material |
| 07/06/2011 | CN101698741B Synthetic resin composite for pouring low-voltage bus bar |
| 07/06/2011 | CN101698740B Synthetic resin composite for pouring middle-voltage bus bar |
| 07/05/2011 | US7973403 Adhesive sheet for light-emitting diode device and light-emitting diode device |
| 06/30/2011 | WO2011078372A1 Epoxy resin, epoxy resin composition and cured product of same |
| 06/30/2011 | WO2011078322A1 Epoxy resin composition, curable resin composition, and cured object obtained therefrom |
| 06/30/2011 | WO2011078205A1 Diolefin compound, epoxy resin, curable resin composition, cured product thereof, and optical semiconductor device |
| 06/30/2011 | WO2011078114A1 Epoxy resin composition, process for production of assembly using same, and assembly |
| 06/30/2011 | WO2011078113A1 Partially esterified epoxy resin and process for production thereof |
| 06/30/2011 | WO2011078099A1 Diepoxy compound, process for preparation thereof, and compositions containing the diepoxy compound |
| 06/30/2011 | WO2011077094A1 Modified resin systems for liquid resin infusion applications & process methods related thereto |
| 06/30/2011 | WO2011054769A3 Process for manufacturing a product derived from epichlorohydrin |
| 06/30/2011 | US20110160346 Dispersion of carbon nanotubes by microfluidic process |
| 06/30/2011 | CA2785279A1 Modified resin systems for liquid resin infusion applications & process methods related thereto |
| 06/29/2011 | CN201883054U Solid epoxy resin production system utilizing one-step process |
| 06/29/2011 | CN102112544A Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate |
| 06/29/2011 | CN102112517A Resin composition for semiconductor encapsulation and semiconductor device using the same |
| 06/29/2011 | CN102112516A Epoxy resin curing agent, epoxy resin composition, hardened material thereof, and optical semiconductor device |
| 06/29/2011 | CN102112096A Initiator system containing a diarylakylamine derivative, hardenable composition and use thereof |