| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 09/28/2011 | EP2145880B1 Novel epoxy compound, alkali-developable resin composition, and alkali-developable photosensitive resin composition |
| 09/28/2011 | EP1707585B1 One-component epoxy resin composition |
| 09/28/2011 | CN102203862A Uv-curable resin compositions for optical discs and cured products thereof |
| 09/28/2011 | CN102199413A Modified epoxy resin adhesive used for polyimide flexible copper-clad plate |
| 09/28/2011 | CN102199334A Method for preparing polybenzimidazole functionalized carbon tube-enhanced acidification polyether amine compound |
| 09/28/2011 | CN102199277A Carbon nanotube reinforced polyether amine composite and preparation method thereof |
| 09/28/2011 | CN102199276A Silicon-containing epoxy resin composition for light-emitting diode (LED) package and preparation method thereof |
| 09/28/2011 | CN102199275A Production technology for one-step synthesis of solid epoxy resin |
| 09/28/2011 | CN102199256A Third-generation vacuum pressure impregnation (VPI) resin |
| 09/28/2011 | CN102199135A Epoxy resin and preparation method thereof |
| 09/28/2011 | CN101691419B Hyperbranched polymer surface grafted and modified inorganic nanoparticle/epoxy resin anti-friction wear-resistant composite material and preparation method thereof |
| 09/22/2011 | WO2011115159A1 Curable composition, dicing-die bonding tape, connecting structure and method for producing semiconductor tape with cohesive/adhesive layer |
| 09/22/2011 | WO2011115020A1 Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate |
| 09/22/2011 | WO2011114993A1 Cross-linked polymer particle and method for producing same |
| 09/22/2011 | WO2011114935A1 Epoxy resin composition and cured substance |
| 09/22/2011 | WO2011114687A1 Resin composition for sealing semiconductors, and semiconductor device using same |
| 09/22/2011 | WO2011114665A1 Heat-resistant adhesive |
| 09/21/2011 | EP2366742A1 Thermosetting resin composition and prepreg utilizing same |
| 09/21/2011 | CN102197339A Photosensitive resin composition, photosensitive adhesive film, and light-receiving device |
| 09/21/2011 | CN102197334A Sealant for liquid crystal dropping process, vertically conducting material, and liquid crystal display element |
| 09/21/2011 | CN102191000A Adhesive composition |
| 09/21/2011 | CN102190864A Epoxy resin composition for sealing packing of semiconductor, semiconductor device, and manufacturing method thereof |
| 09/21/2011 | CN102190863A Epoxy resin composition |
| 09/21/2011 | CN102190861A Sealant for liquid crystal dripping process |
| 09/21/2011 | CN102190800A Preparation method of nonionic waterborne epoxy curing agent |
| 09/21/2011 | CN102190778A Epoxy resin latent curing agent with coupling property |
| 09/21/2011 | CN102190777A Epoxy resin curing composition |
| 09/21/2011 | CN102190776A Thermosetting resin composition for optical-semiconductor element encapsulation and cured material thereof, and optical-semiconductor device obtained using the same |
| 09/21/2011 | CN101831078B Preparation method of film forming agent and impregnating compound containing film forming agent |
| 09/21/2011 | CN101805490B Organic silicon modified epoxy-composite estolide nanometer composite heavy anticorrosive material and preparation |
| 09/21/2011 | CN101712749B Silicon nitride hybridization type epoxy resin curing agent and preparation method and application thereof |
| 09/20/2011 | US8022151 Adamantane derivative, method for producing the same, resin composition containing the adamantane derivative and use thereof |
| 09/20/2011 | US8022140 Epoxy resin, styrene-maleic anhydride copolymer and crosslinking agent |
| 09/20/2011 | US8022119 Epoxy and silane group-containing oligomers and polymers and a method for the production and the use thereof |
| 09/20/2011 | US8021752 Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, fiber-reinforced composite sheet, and casing for electrical/electronic equipment |
| 09/15/2011 | WO2011112596A2 Method of making a cyclic guanidine from a guanidinium salt and a weak acid and coating compositions containing same |
| 09/15/2011 | WO2011111727A1 Insulating polymer material composition |
| 09/15/2011 | WO2011111667A1 Curable composition, hardened material, and method for using curable composition |
| 09/15/2011 | WO2011109956A1 Thermosetting epoxy asphalt material with wide temperature region and high performance and preparation method thereof |
| 09/15/2011 | WO2011059500A3 Curable compositions |
| 09/15/2011 | US20110224403 Method of making a cyclic guanidine from dicyandiamide and coating compositions containing same |
| 09/15/2011 | US20110224328 Method of making a cyclic guanidine from a guanidinium salt and a weak acid and coating compositions containing the same |
| 09/15/2011 | CA2790837A1 Storage stable water based epoxy-amine curable systems |
| 09/14/2011 | EP2365046A1 Toughened two component structural adhesive being curable at room temperature |
| 09/14/2011 | EP2365015A1 Storage stable water based epoxy-amine curable systems |
| 09/14/2011 | EP1771522B1 Viscous chemical anchoring adhesive |
| 09/14/2011 | EP1524332B1 Surface-treated steel sheet excellent in resistance to white rust and method for production thereof |
| 09/14/2011 | EP1276799B1 Flame retardant epoxy molding compositions |
| 09/14/2011 | CN102186904A Polyamide resin and composition thereof |
| 09/14/2011 | CN102186898A Curable resin composition and cured product thereof, printed circuit board, and epoxy resin and method for producing same |
| 09/14/2011 | CN102181218A Novel polymer anticorrosion painting material |
| 09/14/2011 | CN102181128A Epoxy resin premix and preparation technology of the epoxy resin premix |
| 09/14/2011 | CN102181044A Novel diamino-alcohol compounds, their manufacture and use in epoxy resins |
| 09/14/2011 | CN102181043A latent curing agent with multiple storage stability |
| 09/14/2011 | CN102181042A Method for preparing epoxy resin curing agent |
| 09/14/2011 | CN102181041A Method for preparing performed polymer modified epoxy resin |
| 09/14/2011 | CN102181040A Medium molecular weight solid bisphenol A epoxy resin |
| 09/14/2011 | CN102181039A Process for synthesizing o-cresol formaldehyde epoxy resin with low chlorine content |
| 09/14/2011 | CN102181026A Production method for electronic-grade phenolic resin |
| 09/14/2011 | CN101805441B Demineralizing, purifying and filtering device in epoxy resin production |
| 09/14/2011 | CN101724224B Composite material of NiMnGa magnetic memorial alloy and epoxide resin and preparation method thereof |
| 09/14/2011 | CN101696303B Novel compatibilized polypropylene/glass fiber composite material and preparation method thereof |
| 09/13/2011 | US8017733 Covalent attachment of hydrophilic polymers, such as polyalkylene glycol polymers, also known as polyalkylene oxides, to biologically-active molecules |
| 09/13/2011 | US8017671 Thermosetting resin for expediting a thermosetting process |
| 09/13/2011 | CA2469091C Sizing composition for glass yarns, the glass yarns thus obtained and composite materials comprising said yarns |
| 09/09/2011 | WO2011108588A1 Curable resin composition and cured article thereof |
| 09/09/2011 | WO2011108524A1 Resin composition, prepreg, and laminated sheet |
| 09/09/2011 | WO2011108516A1 Process for production of organopolysiloxane, organopolysiloxane obtained by the process, and composition that contains the organopolysiloxane |
| 09/09/2011 | WO2011107796A1 Novel curing agents |
| 09/09/2011 | WO2011107512A1 The use of linear triethylentetramine as curing agent for epoxy resins |
| 09/09/2011 | WO2011107450A2 Two-component structural adhesive which is impact resistant at room temperature |
| 09/09/2011 | CA2791424A1 Novel curing agents |
| 09/08/2011 | US20110218321 Processes for producing polyalkylene carbonates |
| 09/07/2011 | EP2363430A1 Radiation curable silicone composition |
| 09/07/2011 | CN102177187A Epoxy resins and composite materials with improved burn properties |
| 09/07/2011 | CN102174245A Epoxy asphalt for gravel sealing layer, gravel sealing layer material and gravel sealing layer method |
| 09/07/2011 | CN102174244A Insulating water-proof epoxy resin composition, adhesive tape and preparation methods thereof |
| 09/07/2011 | CN102174173A Flame-retardant latent epoxy curing agent and halogen-free flame-retardant one-component epoxy resin composition |
| 09/07/2011 | CN102174172A Waterborne rosin-based epoxy resin and preparation method as well as application thereof |
| 09/07/2011 | CN102174160A Preparation and application of lignin-phenolic group modified amine waterborne epoxy hardener |
| 09/07/2011 | CN101386673B Oil modified epoxy resins and precoating coiled material coatings containing above resins |
| 09/07/2011 | CN101155854B Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic compo |
| 09/06/2011 | US8013075 Curable composition |
| 09/06/2011 | US8012580 Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device |
| 09/01/2011 | WO2011105192A1 Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition |
| 09/01/2011 | WO2011104997A1 Organic el element, organic el display device, organic el lighting device, and curable composition for sealing agent |
| 09/01/2011 | WO2011104905A1 Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board |
| 09/01/2011 | US20110213052 Method for Producing Dialkylphosphinic Acids and Esters and Salts Thereof by Means of Acrylic Acid Derivatives and Use Thereof |
| 08/31/2011 | EP2361941A1 Cationic acrylic resins |
| 08/31/2011 | EP1595905B1 Process for producing high-purity epoxy resin and epoxy resin composition |
| 08/31/2011 | CN102171269A Production of solid epoxy resin |
| 08/31/2011 | CN102171268A Photocurable composition and cured product |
| 08/31/2011 | CN102167887A Photovoltaic pump stator plastic package agent and plastic package method thereof |
| 08/31/2011 | CN102167828A Preparation method of R-122-based episulfide resin |
| 08/31/2011 | CN102167799A Preparation method of novel phosphorus-containing biphenyl novolac epoxy resin and condensate of novel phosphorus-containing biphenyl novolac epoxy resin |
| 08/31/2011 | CN101824137B Modified bisphenol A epoxy acrylate and preparation method thereof |
| 08/31/2011 | CN101787179B Air-drying epoxy vinylit resin and processing technic thereof |
| 08/31/2011 | CN101775109B Epoxy modified silicon-contained waterborne acrylic resin and coating thereof |
| 08/31/2011 | CN101724137B Method for preparing epoxy resin with biphenyl structure |
| 08/31/2011 | CN101724136B Novel method for preparing lignosulphonate epoxy resin |