C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups

Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
11/2011
11/02/2011	EP1745104B1 Comb-like polyetheralkanolamines in inks
11/02/2011	CN102229701A Non-ionic aqueous epoxy resin emulsion and its preparation method
11/02/2011	CN102229700A Epoxy resin nanometer montmorillonite composite material and preparation method thereof
11/02/2011	CN102229695A Production process of glass fiber reinforced plastic paint
11/02/2011	CN101921373B Acrylic modified epoxy resin emulsion and preparation method thereof
11/02/2011	CN101485990B Solid supported heteropoly acid catalyst and preparation method thereof
11/02/2011	CN101213490B 感光性树脂组合物 The photosensitive resin composition
11/01/2011	US8048981 Thermally curable compositions and method
11/01/2011	US8048969 Semiconductor encapsulating epoxy resin composition and semiconductor device
10/2011
10/27/2011	WO2011132674A1 Thermosetting composition
10/27/2011	WO2011132637A1 Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate
10/27/2011	WO2011132408A1 Epoxy resin composition, prepreg, metal-clad laminate, and printed wiring board
10/27/2011	US20110263881 Method of separating solid salt from epoxy resin solutions
10/27/2011	US20110259830 Seed-conjugated polymer support
10/27/2011	US20110259628 Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same
10/26/2011	EP2381304A1 Sealing agent for liquid crystal dropping method, which contains photocurable resin and thermosetting resin
10/26/2011	EP2380882A1 Salts of heterocyclic anions and their uses as ionic conductive materials
10/26/2011	EP2379615A1 Coating compositions with branched phosphorous-containing resin
10/26/2011	EP2379614A1 Method of separating solid salt from epoxy resin solutions
10/26/2011	EP2222748B1 Epoxy curing system and coatings obtained thereof
10/26/2011	CN102227813A Forming agent for gate dielectric film of thin film transistor
10/26/2011	CN102227457A Curing accelerator for epoxy resin composition and one-pack type thermosetting epoxy resin composition
10/26/2011	CN102226033A Epoxy resin composition as well as prepreg and metal-foil-clad laminated board manufactured by using same
10/26/2011	CN102226032A Low-modulus epoxy resin system and preparation method thereof
10/26/2011	CN102225986A Environmentally-friendly type solvent-free impregnating resin and preparation method thereof
10/26/2011	CN101819953B Transparent epoxy resin packaging adhesive
10/26/2011	CN101701058B Epoxy resin containing melamine-organic silicon hybrid structure and preparation method and application thereof
10/25/2011	US8044117 Latent hardener, process for producing the same, and adhesive containing latent hardener
10/25/2011	US8044110 Optical fiber with polymeric coating crosslinked in the presence of both radical and cationic photoinitiators
10/25/2011	US8043460 Reversible dry adhesives
10/25/2011	US8043459 Reversible dry adhesives for wet and dry conditions
10/20/2011	WO2011129372A1 Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive film
10/20/2011	WO2011129206A1 Photoacid generator and photoreactive composition
10/20/2011	WO2011030143A3 Curable formulation
10/20/2011	US20110258147 Heat Transfer Compositions
10/20/2011	US20110258146 Heat Transfer Compositions
10/20/2011	US20110253434 Epoxy resin composition, and prepreg and printed circuit board using the same
10/19/2011	EP2376556A1 Oil extended rubber compositions
10/19/2011	CN102224549A Resin composition for filling discharge gap, and electrostatic discharge protector
10/19/2011	CN102224140A Curable composition comprising a thermolatent base
10/19/2011	CN101899141B Self-emulsifying water borne epoxy resin curing agent and preparation method thereof
10/19/2011	CN101681929B Gate insulating film forming agent for thin-film transistor
10/18/2011	US8039551 Modified epoxy resins comprising the reaction product of rosin and a linking molecule and aqueous dispersions and coatings comprising such resins
10/18/2011	US8039530 High thermal conductivity materials with grafted surface functional groups
10/13/2011	WO2011126070A1 Resin composition, prepreg and laminate
10/13/2011	WO2011125962A1 Epoxy resin composition and cured product thereof
10/13/2011	WO2011125939A1 Optical waveguide structure and electronic apparatus
10/13/2011	WO2011125888A1 Polyamide curing agent composition
10/13/2011	WO2011125821A1 Thermosetting resin composition and printed wiring board
10/13/2011	US20110250459 Epoxy resin composition, prepreg, laminate board, and multi-layer board
10/13/2011	US20110250458 Low coefficient of thermal expansion (cte) thermosetting resins for integrated circuit applications
10/12/2011	EP2374828A1 Preparation of a low dielectric brominated resin with a symmetric or saturated heterocyclic aliphatic molecular structure and composition comprising said resin
10/12/2011	EP2373613A1 Linear amine functionalized poly(trimethylene ether) compositions
10/12/2011	EP2373603A1 Glycerol treatment process
10/12/2011	EP2029655B1 Coating system
10/12/2011	CN102216394A Thermosetting resin composition and prepreg utilizing same
10/12/2011	CN102212249A Epoxy resin composition and semiconductor device
10/12/2011	CN102212247A Aqueous epoxy resin composition and preparation method thereof
10/12/2011	CN102212246A Epoxy composition for encapsulating an optical semiconductor element, manufacturing method thereof and cured product
10/12/2011	CN102211984A Epoxy molding compound, epoxy resin and preparation methods thereof
10/11/2011	CA2457876C Process for the preparation of activated polyethylene glycols
10/06/2011	WO2011123173A1 Curable compositions
10/06/2011	WO2011122617A1 Curable resin composition and light emitting device
10/06/2011	WO2011122161A1 Thermosetting resin composition, cured material thereof, and printed wiring board using cured material
10/06/2011	US20110245434 Hydroxyl-functional polyethers and a preparation process therefor
10/06/2011	CA2794939A1 Curable compositions
10/05/2011	EP2372725A1 Production of electrical insulation and insulated products
10/05/2011	EP1568723B1 Photo- and thermo-setting resin composition and printed wiring boards made by using the same
10/05/2011	EP1509560B1 Actinic radiation curable compositions and their use
10/05/2011	CN102209742A Phenolic resin mixture, epoxy resin mixture, epoxy resin composition, and cured article
10/05/2011	CN102209741A Divinylarene dioxide formulations for vacuum resin infusion molding
10/05/2011	CN102206401A Halogen-free flame-retardant epoxy resin composition and preparation method thereof
10/05/2011	CN102206398A Liquid epoxy underfill, preparation method and application thereof
10/05/2011	CN102206326A Multielement hydroxyl resin, epoxy resin, methods of manufacturing multielement hydroxyl resin and epoxy resin, epoxy resin composition and cured resin comprising multielement hydroxyl resin and epoxy resin
10/05/2011	CN102206325A Modification method of heat-resistant toughened methyl tetrahydrophthalic anhydride
10/05/2011	CN102206324A Full-biobased epoxy resin composition and condensate
10/05/2011	CN102206323A Epoxy resin modified by multifunctional heat resistant unsaturated polyester resin
10/05/2011	CN102206322A Epoxy-modified organic silicone resin for manufacturing composite glue, and processing technology thereof
10/05/2011	CN102206165A Preparation method for epoxy resin curing agent
10/05/2011	CN101851397B Synthetic resin and ultraviolet photo-curing adhesive prepared by using the same
10/05/2011	CN101735568B Epoxy resin component used for blades of wind driven generator
10/05/2011	CN101313007B Cured composition
10/04/2011	US8030439 Method for the production of polytetrahydrofurane or tetrahydrofurane copolymers
10/04/2011	US8030431 curable bi- or polyfunctional aromatic cyanate or a prepolymer formed from at least one bi- or polyfunctional aromatic cyanate
10/04/2011	US8030425 Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
10/04/2011	US8030401 Photoinitiated cationic epoxy compositions
09/2011
09/29/2011	WO2011119655A2 Process for preparing divinlylarene dioxides
09/29/2011	WO2011119216A2 Epoxy resin compositions comprising poly ( propylene oxide) polyol as toughening agent
09/29/2011	WO2011118584A1 Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board
09/29/2011	WO2011118368A1 Diepoxy compound, manufacturing method therefor, and composition containing said diepoxy compound
09/29/2011	WO2011118157A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device using same
09/29/2011	WO2011118106A1 Epoxy resin composition for use in a carbon-fiber-reinforced composite material, prepreg, and carbon-fiber-reinforced composite material
09/29/2011	WO2011117614A1 Novel curing agents
09/29/2011	WO2011059633A3 Polyoxazolidone resins
09/29/2011	WO2011054945A3 Use of guanidine derivatives as curing accelerators for epoxy resins
09/29/2011	CA2788739A1 Epoxy resin composition with reduced toxicity
09/29/2011	CA2788525A1 Epoxy resin composition for use in a carbon-fiber-reinforced composite material, prepreg, and carbon-fiber-reinforced composite material
09/28/2011	EP2368930A1 Novel low dielectric resin varnish composition for laminates and the preparation thereof
09/28/2011	EP2368929A1 Epoxy resin composition, prepreg, laminate board and multilayer board
09/28/2011	EP2367794A1 Curable composition comprising a thermolatent base

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