| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 11/29/2011 | US8067497 Flame-retardant for engineering thermoplastic applications |
| 11/29/2011 | US8067481 Low shrinkage dental material and method |
| 11/24/2011 | WO2011146304A1 Novel epoxy resins for solvent-free waterborne emulsions |
| 11/24/2011 | WO2011146106A1 Hardeners for thermosettable resin compositions |
| 11/24/2011 | WO2011145733A1 Diolefin compound, epoxy resin, curable resin composition, and cured article |
| 11/24/2011 | WO2011145551A1 Photoelectric conversion element using thermosetting sealing agent for photoelectric conversion element |
| 11/24/2011 | WO2011144659A1 Semicarbazones as accelerators for curing epoxy resins |
| 11/24/2011 | WO2011144015A1 Polymercapto compound and synthesis method thereof |
| 11/24/2011 | WO2011090668A3 Epoxy compositions and surfacing films therefrom |
| 11/24/2011 | WO2011083329A3 Novel resin curing agents |
| 11/24/2011 | US20110288259 Process for production of thermoplastic cured epoxy resin with transparency to visible light, and thermoplastic epoxy resin composition |
| 11/24/2011 | US20110284447 Monolith separation medium for chromatography and process for producing the same |
| 11/23/2011 | EP2388279A1 Two-part adhesive |
| 11/23/2011 | EP2387596A2 Epoxy resin composition |
| 11/23/2011 | EP2084205B1 Composite materials with improved performance |
| 11/23/2011 | CN1918514B Photosensitive resin composition and cured product thereof |
| 11/23/2011 | CN102257064A 液体树脂组合物和半导体器件 Liquid resin composition and a semiconductor device |
| 11/23/2011 | CN102257039A Carboxylic acid compound and epoxy resin composition containing same |
| 11/23/2011 | CN102257028A Epoxy resin composition, prepreg, laminate board and multilayer board |
| 11/23/2011 | CN102250321A Quick-drying room temperature curing waterborne epoxy resin curing agent and preparation method thereof |
| 11/23/2011 | CN102250320A Preparation method of modified epoxy resin curing agent and epoxy varnish paint |
| 11/23/2011 | CN102250319A Copper electroplating bath and method |
| 11/23/2011 | CN102250318A Full-rosinyl epoxy resin composite and condensate thereof |
| 11/23/2011 | CN102250317A Rapid curable epoxy resin for electronic packaging, and application thereof |
| 11/23/2011 | CN102250316A Epoxy resin diluent with novel structure and synthesis thereof |
| 11/23/2011 | CN102250315A Amino-acid-derived epoxy resin |
| 11/23/2011 | CN102250314A Low-molecular-weight liquid bisphenol A epoxy resin |
| 11/23/2011 | CN101906238B Epoxy resin composition and semiconductor device |
| 11/23/2011 | CN101591424B Fast epoxy resin curing agent and preparation method thereof |
| 11/23/2011 | CN101511900B Epoxy resin composition for printed circuit board, resin composition Chinese varnish, preforming material, metal-coating lamination body, printed circuit board and multi-layer printed circuit board |
| 11/22/2011 | US8063157 Curing agents for epoxy resins |
| 11/22/2011 | US8062467 Two-component adhesive for producing semi-finished products and composite sandwich materials |
| 11/22/2011 | CA2384176C Uv-curable compositions |
| 11/17/2011 | WO2011142855A2 Room temperature ionic liquids and ionic liquid epoxy adducts as initiators for epoxy systems |
| 11/17/2011 | WO2011142468A1 Curable composition, method for manufacturing an epoxy resin/inorganic polymer composite material using said curable composition, and epoxy resin/inorganic polymer composite material |
| 11/17/2011 | WO2011142466A1 Epoxy resin, epoxy resin composition, and cured product thereof |
| 11/17/2011 | WO2011112596A3 Method of making a cyclic guanidine from a guanidinium salt and a weak acid and coating compositions containing same |
| 11/17/2011 | WO2011100049A3 Phosphorus-containing epoxy resin |
| 11/17/2011 | WO2011097009A3 Curable epoxy resin compositions |
| 11/17/2011 | US20110281399 Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 11/16/2011 | EP2387067A1 Method for manufacturing semiconductor package, method for encapsulating semiconductor, and solvent-borne semiconductor encapsulating epoxy resin composition |
| 11/16/2011 | EP2386587A1 Process for production of thermoplastic cured epoxy resin with transparency to visible light, and thermoplastic epoxy resin composition |
| 11/16/2011 | EP2385962A1 Metal stabilizers for epoxy resins and advancement process |
| 11/16/2011 | CN102246296A Semiconductor-sealing resin composition, method for producing semiconductor device, and semiconductor device |
| 11/16/2011 | CN102246295A Granulated epoxy resin composition for semiconductor encapsulation, semiconductor device using same, and method for manufacturing semiconductor device |
| 11/16/2011 | CN102245669A Process for the preparation of polyuretdione resins |
| 11/16/2011 | CN102245550A Glycerol treatment process |
| 11/16/2011 | CN102241909A Repair putty for turbine blade of wind generating set and preparation method thereof |
| 11/16/2011 | CN102241872A Aluminum methylcyclohexyl phosphinate/epoxy resin flame-retardant composite material |
| 11/16/2011 | CN102241870A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 11/16/2011 | CN102241868A Epoxy resin composition for high-voltage power insulation |
| 11/16/2011 | CN102241807A Epoxy resin composition for optical-semiconductor element encapsulation and optical-semiconductor device using the same |
| 11/16/2011 | CN102241806A Cardanol epoxy resin |
| 11/16/2011 | CN101870762B High temperature resistant modified epoxy resin, preparation method thereof and use thereof |
| 11/16/2011 | CN101696316B Method for preparing radiation protection materials |
| 11/16/2011 | CN101633772B Process for epoxy resin composition for casting transformer |
| 11/16/2011 | CN101445587B Resin binding agent for a diamond wire saw and preparation method thereof |
| 11/16/2011 | CN101374880B Molding method for lithography techniques |
| 11/15/2011 | US8058362 Manufacture of novel epoxy resins semi-thermosets and their high TG thermosets for electronic applications |
| 11/15/2011 | US8058361 Polymer and a film or sheet containing the same |
| 11/15/2011 | US8058327 Composition |
| 11/15/2011 | US8057902 Epoxy phosphorous-containing resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition |
| 11/10/2011 | WO2011138868A1 Thermosetting epoxy resin composition |
| 11/10/2011 | WO2011138254A1 1c epoxy resin composition with reduced toxicity |
| 11/10/2011 | WO2011071726A3 Curable resin compositions useful as underfill sealants for low-k dielectric-containing semiconductor devices |
| 11/10/2011 | US20110275739 Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin |
| 11/09/2011 | EP2384345A1 Divinylarene dioxide formulations for vacuum resin infusion molding |
| 11/09/2011 | EP1939234B1 Resin composition for optical three-dimensional molded object |
| 11/09/2011 | EP1914266B1 Prepreg |
| 11/09/2011 | EP1802701B1 Fibre reinforced assembly |
| 11/09/2011 | EP1637526B1 Curable polycyclic compounds and process for the production thereof |
| 11/09/2011 | CN102239157A Diolefin compound, epoxy resin, curable resin composition and cured product |
| 11/09/2011 | CN102239144A Novel sulfonium borate complex |
| 11/09/2011 | CN102234515A liquid crystal orientation agent and various applications thereof, polymer and producing method thereof |
| 11/09/2011 | CN102234409A Epoxy resin composition and prepreg and printed circuit board (PCB) manufactured therefrom |
| 11/09/2011 | CN102234374A Method for preparing dendrimer antiphase demulsifier |
| 11/09/2011 | CN102234363A Halogen-free flame-retardant resin composition |
| 11/09/2011 | CN101962435B Paint wax epoxy resin and preparation method thereof |
| 11/09/2011 | CN101704989B Fluorine-containing imine matrix resin used for advanced composite material and preparation method thereof |
| 11/09/2011 | CN101665562B Preparation method of POSS-epoxy hybrid material with controllable phase structure |
| 11/09/2011 | CN101492527B Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
| 11/09/2011 | CN101384574B Adamantane derivative, composition comprising the derivative, and optical and electronic member using the composition |
| 11/09/2011 | CN101277991B Resin composition for stereo planography |
| 11/09/2011 | CN101133097B Hardening accelerator, hardenable resin composition, and electronic component device |
| 11/08/2011 | US8053587 Reworkable thermosetting resin composition |
| 11/08/2011 | US8053547 Conjugated polymers and blends containing carbazole, representation and use thereof |
| 11/08/2011 | US8053487 Multifunctional acrylates used as cross-linkers in dental and biomedical self-etching bonding adhesives |
| 11/08/2011 | US8053156 Toner, and toner production process |
| 11/03/2011 | WO2011136846A1 Polycyclopentadiene compounds with saturated cyclopentane ring |
| 11/03/2011 | WO2011136843A1 Epoxy polycyclopentadiene compounds |
| 11/03/2011 | WO2011136084A1 Curable resin composition for screen printing and printed wiring board |
| 11/03/2011 | WO2011136074A1 Positive radiation-sensitive composition, interlayer insulating film for display element, and formation method for same |
| 11/03/2011 | WO2011135925A1 Diepoxy compound, process for preparation thereof, and compositions that contain the diepoxy compound |
| 11/03/2011 | US20110269974 Polymer Derivatives |
| 11/03/2011 | US20110269076 Surface modifying material, method of forming resist pattern, and method of forming pattern |
| 11/03/2011 | US20110269066 Bronsted acid compound, manufacturing method of condensation compound, dispersion liquid of condensation compound particles, manufacturing method of electrostatic image developing toner, manufacturing method of binder resin, binder resin, dispersion liquid of resin particles, electrostatic image developing toner, electrostatic image developer, and image-forming method |
| 11/02/2011 | EP2383310A1 Curable composition |
| 11/02/2011 | EP2382337A1 Sulfo or sulfamyl group-containing cathodic electrocoat resin |
| 11/02/2011 | EP2382256A1 Impregnating resin system for insulating materials in switchgear assemblies |
| 11/02/2011 | EP2158250B1 Catalyst for curing epoxides |