Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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12/27/2011 | US8084567 Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin |
12/27/2011 | US8084550 Low gloss thermoplastic composition |
12/27/2011 | US8084519 Curing accelerator for epoxy resin composition, and one-pack type thermosetting epoxy resin composition |
12/24/2011 | CA2743800A1 Improved epoxy systems for composites |
12/22/2011 | WO2011157671A1 Use of cyclic carbonates in epoxy resin compositions |
12/22/2011 | WO2011117229A3 Epoxy resin composition with reduced toxicity |
12/22/2011 | WO2011110535A3 Multi-amine functional oligomers and method for producing the same by the reduction of corresponding oximes |
12/21/2011 | EP2397508A1 Silphenylene-containing photocurable composition, pattern formation method using same, and optical semiconductor element obtained using the method |
12/21/2011 | EP2397507A1 Long chain alkylene group-containing epoxy compound |
12/21/2011 | EP2396361A1 Casting resin system for insulating materials in switch gears |
12/21/2011 | CN102292373A 铝螯合物类潜固化剂及其制造方法 Aluminum chelate type latent curing agent and its manufacturing method |
12/21/2011 | CN102292372A 从环氧树脂溶液分离固体盐的方法 The method of separating the solid salt from the epoxy resin solution |
12/21/2011 | CN102286190A Halogen-free resin composition and copper clad plate prepared from composition |
12/21/2011 | CN102286189A Method for preparing graphene oxide/epoxide resin nano composite material |
12/21/2011 | CN102286151A 热固性改性氰酸酯树脂及其制备方法 Thermosetting modified cyanate ester resin and preparation method |
12/21/2011 | CN102286139A 一种含有双环戊二烯脂环结构的增韧环氧树脂组合物 Toughened epoxy resin composition containing dicyclopentadiene alicyclic structure |
12/21/2011 | CN102286138A 一种快速拉挤用耐高温环氧树脂组合物 A Fast pultrusion high temperature epoxy composition |
12/21/2011 | CN102286137A 一种用于海工混凝土涂料的聚醚改性环氧树脂的制备方法 A method for the preparation of marine concrete polyether modified epoxy paint |
12/21/2011 | CN101886336B 多元醇改性环氧树脂碳纤维乳液上浆剂组分及其制备方法 Polyol modified epoxy carbon fiber sizing agent component emulsion and its preparation method |
12/21/2011 | CN101384642B 酚树脂的制造方法和环氧树脂的制造方法 Manufacturing method of a phenol resin and an epoxy resin |
12/21/2011 | CN101203548B 功能性聚合物与活性硅烷单体的连续同型聚合物反应 Continuous-type polymer with reactive functional polymer with reactive silane monomers |
12/15/2011 | WO2011155613A1 Curable resin composition and substance obtained by curing same |
12/15/2011 | WO2011155583A1 Curable resin composition and cured product thereof |
12/15/2011 | WO2011126834A3 Thioethers, methods for their preparation, and compositions including such thioethers |
12/15/2011 | WO2011119655A3 Process for preparing divinlylarene dioxides |
12/15/2011 | WO2011116177A3 Process for preparing divinylarene dioxides |
12/14/2011 | EP2395032A1 Powdery vinyl polymer, curable resin composition, and cured object |
12/14/2011 | EP2393906A1 Gasoline deposit control additive compositions |
12/14/2011 | EP2393864A1 Room temperature curing epoxy adhesive |
12/14/2011 | EP2393863A1 Two-part liquid shim compositions |
12/14/2011 | EP2393772A1 Curable composition based on epoxy resins and hetero-poly-cyclic polyamines |
12/14/2011 | CN1768306B 含有环氧化合物和羧酸化合物的光刻用形成下层膜的组合物 Lithography containing an epoxy compound and a carboxylic acid compound represented by the underlayer coating forming composition |
12/14/2011 | CN102282660A 半导体封装的制造方法、半导体封装方法和溶剂型半导体封装环氧树脂组合物 Method of manufacturing a semiconductor package, a semiconductor packaging method and solvent-based semiconductor package epoxy resin composition |
12/14/2011 | CN102282210A 环氧树脂组合物 The epoxy resin composition |
12/14/2011 | CN102282192A 可溶性酰亚胺骨架树脂、可溶性酰亚胺骨架树脂溶液组合物、固化性树脂组合物及其固化物 Soluble imide skeleton resin, a soluble polyimide resin solution composition of the skeleton, the curable resin composition and a cured product |
12/14/2011 | CN102282187A 酚醛清漆树脂和热固性树脂组合物 Novolac resin and a thermosetting resin composition |
12/14/2011 | CN102276962A 一种环氧沥青桥面快速冷修补用树脂及其制备方法 An epoxy asphalt cold patch fast deck with resin and preparation method |
12/14/2011 | CN102276961A 无卤无磷环氧树脂组合物及使用其制作的半固化片及层压板 Halogen-free and phosphorus-free epoxy resin composition used in its production and the prepreg laminate |
12/14/2011 | CN102276959A Halogen-free non-phosphorization flame-retardant epoxy resin composition and preparation method thereof |
12/14/2011 | CN102276856A 一种纺织增强复合材料的制备方法 A textile reinforced composite material of |
12/14/2011 | CN102276797A 一种具有优良温度循环性能的环氧树脂组合物及其制备方法 An epoxy resin composition having excellent temperature cycle performance and preparation method |
12/14/2011 | CN102276796A 镀液及镀覆方法 Bath and plating method |
12/14/2011 | CN102276795A Preparation method of glass fiber/carbon nanotube/epoxy resin multi-dimensional hybrid composite material |
12/14/2011 | CN102276794A 室温固化无色透明环氧树脂固化剂 Room temperature curing colorless, transparent epoxy resin curing agent |
12/14/2011 | CN102276793A 耐高温液态酸酐固化剂及其制备方法 High temperature liquid acid anhydride hardener and its preparation method |
12/14/2011 | CN102276792A 加热快速固化液态酸酐固化剂及其制备方法 Heating fast curing liquid acid anhydride hardener and its preparation method |
12/14/2011 | CN102276791A 阻燃环氧树脂复合物 Flame retardant epoxy resin composites |
12/14/2011 | CN102276790A 环氧树脂改性沥青的增容剂的制备方法 Preparation of epoxy resin modified asphalt compatibilizer |
12/14/2011 | CN102276789A 一种废旧纸基覆铜板非金属材料的回收利用方法 A method of recycling waste paper-based CCL non-metallic materials |
12/14/2011 | CN102276788A 一种基于没食子酸的环氧树脂及其制备方法和应用 Epoxy resin and its preparation method and application based on gallic acid |
12/14/2011 | CN102276781A 水性聚脲改性环氧乳液固化剂制备方法及应用 Polyurea modified waterborne epoxy curing agent emulsion preparation method and application |
12/14/2011 | CN102276780A 水性聚氨酯-脲改性环氧乳液固化剂的制备方法 Waterborne Polyurethane - Preparation of urea modified epoxy curing agent emulsion |
12/14/2011 | CN101831052B 低残余四溴双酚a溴化环氧树脂的生产方法 Producing a low residual TBBPA brominated epoxy resin |
12/14/2011 | CN101663335B 光和/或热固化性共聚物、固化性树脂组合物以及固化物 Light and / or heat-curable copolymer, the curable resin composition and the cured product |
12/14/2011 | CN101624439B 阻燃型海因环氧树脂的合成方法 Synthesis flame retardant epoxy resin Hein |
12/14/2011 | CN101466753B 具有环氧固体树脂的低温抗冲击性可热固化的环氧树脂组合物 A solid epoxy resin having an epoxy resin composition of low temperature impact resistance heat curable |
12/14/2011 | CN101085831B 聚酰胺固化剂组合物 Polyamide curing agent composition |
12/14/2011 | CN101044432B 碱性显影型感光性树脂组合物、带有使用其形成的液晶分割取向控制用突起的基板以及液晶显示装置 Alkali-developable photosensitive resin composition, which is formed with the use of liquid crystal alignment control projection split substrate, and a liquid crystal display device |
12/13/2011 | US8076424 Heat-curable compositions comprising low-temperature impact strength modifiers |
12/08/2011 | WO2011152413A1 Prepreg, metal-clad laminate, and printed circuit board |
12/08/2011 | WO2011152412A1 Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition |
12/08/2011 | WO2011152251A1 Alicyclic monoallyl ether-monoglycidyl ether compound |
12/08/2011 | WO2011152126A1 Cationically polymerizable composition, adhesive containing same, and cured product and polarizing plate which are obtained using same |
12/08/2011 | WO2011151584A1 Acid-hardening epoxy thermoset resins and composites that can be hot-processed and recycled |
12/08/2011 | US20110301254 Process for preparing organic silicon compounds |
12/07/2011 | EP1947130B1 Resin composition for radiation curing and prepreg |
12/07/2011 | CN1849560B 感光性树脂组合物及使用该组合物的图案形成方法 The photosensitive resin composition and the composition using a pattern forming method |
12/07/2011 | CN102272908A 晶片接合用树脂浆料、使用该浆料的半导体装置的制造方法及半导体装置 The method of manufacturing a wafer bonding resin slurry, the slurry using a semiconductor device and a semiconductor device |
12/07/2011 | CN102272227A 可辐射固化树脂组合物以及使用这种组合物的快速三维成像方法 The radiation curable resin composition and the use of such compositions, three-dimensional imaging method of rapid |
12/07/2011 | CN102272191A 具有可见光透明性的热塑性环氧树脂固化物的制造方法和热塑性环氧树脂组合物 The method of producing visible light transparency of a thermoplastic having a cured epoxy resin and a thermoplastic epoxy resin composition |
12/07/2011 | CN102272190A 环氧树脂的金属稳定剂和增长方法 Epoxy metal stabilizers and growth methods |
12/07/2011 | CN102272189A 含有含磷的支化树脂的涂料组合物 The coating composition containing the phosphorus-containing branched resin |
12/07/2011 | CN102268214A 一种水性环氧树脂涂料的制备方法 Preparation of a waterborne epoxy coatings |
12/07/2011 | CN102268174A 一种高耐热性高韧性环氧树脂组合物及其制备方法 Of a high heat resistance and high toughness of epoxy resin composition and its preparation method |
12/07/2011 | CN102268126A 有机硅潜伏性环氧树脂固化剂的制备方法 Preparation of silicone latent epoxy curing agent |
12/07/2011 | CN101824136B 含萘环和联苯结构环氧树脂及其合成方法 Naphthalene and biphenyl structure containing epoxy resin and synthetic methods |
12/07/2011 | CN101824133B 水性聚氨酯改性环氧树脂固化剂的制备方法 Preparation of waterborne polyurethane modified epoxy curing agent |
12/07/2011 | CN101802692B 液晶取向剂、液晶取向膜以及液晶显示元件 The liquid crystal aligning agent, a liquid crystal alignment film and a liquid crystal display element |
12/07/2011 | CN101735428B 风力发电机叶片用的环氧树脂体系制备方法 Wind turbine blades preparation of epoxy resin systems |
12/07/2011 | CN101730862B 液晶取向剂、液晶取向膜及其形成方法以及液晶显示元件 The liquid crystal aligning agent, and method of forming a liquid crystal alignment film and a liquid crystal display element |
12/07/2011 | CN101712748B 一种风力发电环氧树脂专用料 A wind power Epoxy Compound |
12/07/2011 | CN101497737B 一种水性环氧树脂的制备方法 Method for preparing aqueous epoxy resin |
12/07/2011 | CN101466767B 立体光刻造型用树脂组合物 Stereolithography resin composition |
12/06/2011 | US8071207 Gelator stabilized crystalline resins |
12/01/2011 | WO2011150155A1 Polymer bonded redox molecules and methods of making the same |
12/01/2011 | WO2011149018A1 Transparent film |
12/01/2011 | WO2011148923A1 Curable resin composition and cured product thereof |
12/01/2011 | WO2011148857A1 Fluorine- and epoxy group-containing copolymer, and method for producing same |
12/01/2011 | WO2011148620A1 Sheet-like resin composition, circuit component using the sheet-like resin composition, method for sealing electronic component, method for connecting electronic component, method for affixing electronic component, composite sheet, electronic component using the composite sheet, electronic device, and method for producing composite sheet |
12/01/2011 | WO2011148545A1 Alcohol compound, polyester resin, unsaturated polyester resin, resin particle and electrophotography toner |
11/30/2011 | EP2389406A1 Homogeneous bismaleimide - triazine - epoxy compositions useful for the manufacture of electrical laminates |
11/30/2011 | CN102265212A 液晶显示面板密封用光固化性组合物和液晶显示面板 Sealing the liquid crystal display panel and the photo-curable composition of the liquid crystal display panel |
11/30/2011 | CN102264793A 树脂组合物、半固化片、树脂片、覆金属层叠板、印刷布线板、多层印刷布线板及半导体装置 The resin composition, a prepreg, a resin sheet, a metal-clad laminated plate, a printed wiring board, a multilayer printed wiring board and a semiconductor device |
11/30/2011 | CN102264750A 作为阻燃剂的含磷硅倍半氧烷衍生物 As the phosphorus-containing flame retardant silsesquioxane derivative |
11/30/2011 | CN101880374B Silicon framework hyperbranched epoxy resin and preparation method thereof |
11/30/2011 | CN101704836B 一种含硅环氧单体及其应用 A siliceous epoxy monomer and its application |
11/30/2011 | CN101379108B 微胶囊型环氧树脂用固化剂、母料型环氧树脂用固化剂组合物、单液型环氧树脂组合物、及其加工品 Microcapsule-based hardener for the epoxy resin, the masterbatch-based hardener composition for the epoxy resin, one-part epoxy resin composition, and its processed products |
11/30/2011 | CN101374879B 可固化组合物 The curable composition |
11/30/2011 | CN101121704B 酸酐酯及其组合物、热固化性树脂组合物及其固化物 Anhydride ester, and combinations thereof, a thermosetting resin composition and a cured product |
11/29/2011 | US8067523 Thermosetting resin composition, laminated body using it, and circuit board |