| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 02/21/2001 | CN1284521A Aromatic ester compound and its prep., expoxy resin composition using the same and coper-coated laminate |
| 02/21/2001 | CN1284520A Arylester compound and its prep, epoxy resin composition using the compound and copper-coated laminated |
| 02/20/2001 | US6191225 Thermosetting compositions containing carboxylic acid functional polymers and epoxy functional polymers prepared by atom transfer radical polymerization |
| 02/20/2001 | US6190786 Epoxy resin composition and resin-encapsulated semiconductor device |
| 02/15/2001 | WO2001010954A1 Polymerizable compositions |
| 02/15/2001 | WO2001010926A1 Transparent liquid resin material for smt-enabled led-applications at higher temperatures and higher luminosities |
| 02/15/2001 | WO2001010388A1 Adhesive systems |
| 02/15/2001 | DE19936605A1 Transparente Gießharzmasse für SMT-fähige LED-Anwendungen mit hoher Temperatur und hohen Helligkeiten oder Leuchtstärken Transparent casting resin for SMT-compatible LED applications with high temperature and high brightness or lighting levels |
| 02/14/2001 | EP1076262A1 Photosensitive resin |
| 02/14/2001 | EP1076078A1 Polysiloxane compositions for wool treatment |
| 02/14/2001 | EP1075354A1 Coated abrasive article |
| 02/14/2001 | CN1283654A Siloxanes compsn. for treating fleece material |
| 02/13/2001 | US6187836 Dentistry; photopolymerization |
| 02/13/2001 | US6187833 Photopolymerization; debtal prosthetics |
| 02/13/2001 | US6187443 Used as protective coating for any metallic or non metallic surface |
| 02/13/2001 | US6187416 Resin composition for copper-clad laminate, resin-coated copper foil, multilayered copper-clad laminate, and multilayered printed circuit board |
| 02/08/2001 | WO2001055277A1 Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same |
| 02/08/2001 | WO2001009262A1 Method of producing a laminated structure |
| 02/08/2001 | WO2001009221A1 Amine hardener for epoxy resins |
| 02/08/2001 | WO2001009220A1 Hydroxyaliphatic functional epoxy resins |
| 02/08/2001 | WO2001009219A1 Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings |
| 02/08/2001 | WO2001009215A1 Polyamines comprising urea groups, method for their production, and their use as hardeners for epoxide resins |
| 02/08/2001 | WO2000077066A3 Process for the preparation of reaction products of cycloaliphatic epoxides with multifunctional hydroxy compounds |
| 02/08/2001 | DE19937477A1 Silikonhaltige Zusammensetzungen für die Behandlung von Wollematerialien Silicone-containing compositions for the treatment of wool materials |
| 02/08/2001 | DE10000190A1 Silicon and fluorine containing modified cycloaliphatic epoxide resin, solid at room temperature, useful as binder for preparation of pigmented or transparent multi-layer automobile powder coatings |
| 02/08/2001 | CA2380296A1 Amine hardener for epoxy resins |
| 02/07/2001 | EP1074888A1 Aqueous photosolder resist composition |
| 02/07/2001 | EP1074571A2 Liquid potting composition |
| 02/07/2001 | EP1073697A1 Epoxy/thermoplastic photocurable adhesive composition |
| 02/07/2001 | CN1283215A Low VOC coating composition |
| 02/07/2001 | CN1282710A composite material containing organic and/or inorganic material and sized glass fiber bundle |
| 02/07/2001 | CN1061665C Cast epoxy resin for high-voltage switch and its preparation method |
| 02/06/2001 | US6184339 High strength polymeric networks derived from (meth) acrylate resins with organofluorine content and process for preparing same |
| 02/06/2001 | US6183616 Method of electrolyte bath stabilization |
| 02/06/2001 | CA2001300C Powder coating compositions for matt coatings |
| 02/01/2001 | WO2001007519A1 Method for producing flat articles from renewable raw materials |
| 02/01/2001 | WO2001007501A1 Epoxy resin composition and semiconductor device |
| 02/01/2001 | WO2001007500A1 Flame retardants, flame-retarded resin compositions and processes for making the same |
| 02/01/2001 | WO2001007487A1 Polyreactions in non-aqueous miniemulsions |
| 02/01/2001 | DE19935329A1 Harnstoffgruppen aufweisende Polyamine, Verfahren zu ihrer Herstellung wie ihre Verwendung als Härter für Epoxidharze Polyamines containing urea groups, processes for their preparation, such as their use as hardeners for epoxy resins |
| 02/01/2001 | DE19935325A1 Lösemittelfreie, raumtemperaturhärtende Reaktivsysteme und ihre Verwendung zur Herstellung von Klebstoffen, Dichtungsmassen, Vergußmassen, Formteilen oder Beschichtungen Solvent-free, room temperature curing reactive systems and their use for the production of adhesives, sealants, casting compounds, moldings or coatings |
| 01/31/2001 | EP1073319A2 Substrate material for wiring and substrate material for printed circuit using the same |
| 01/31/2001 | EP1072647A2 Expandable reinforcing sheet material for vehicle outer panel |
| 01/31/2001 | EP1071729A1 High temperature resistant coating composition and method of using thereof |
| 01/31/2001 | CN1282349A Conductive thermoset molding composition and method for producing same |
| 01/31/2001 | CN1061360C Resin composition for sealing film-made liquid crystal cells |
| 01/30/2001 | US6180727 Capped ester containing epoxy amine adduct curing agents for curing epoxy resins at ambient or sub-ambient temperatures without external catalysts |
| 01/30/2001 | US6180726 High temperature resistant coating composition and method of using thereof |
| 01/30/2001 | US6180723 Producing an epoxy agent by reacting certain p-hydroxystyrene novolak polymers and epichlorohydrin in the presence of one or more alkali agents; low melt viscosity prior to cure and high glass transition temperature after curing |
| 01/30/2001 | US6180719 Molding material of an epoxidized block copolymer of a vinyl aromatic hydrocarbon and conjugated diene, or hydrogenated products thereof, and specified thermoplastic elastomer(s); moldings such as turntable of a cd-rom driver |
| 01/30/2001 | US6180696 A cured epoxy materials has high glass transition temperature as well as excellent electrical and mechanical properties; soldering interconnected structures for jointing semiconductor devices to substrates |
| 01/30/2001 | US6180695 Flame-retardant resin composition and semiconductor sealant using the same |
| 01/30/2001 | US6180287 Polyether copolymer and solid polymer electrolyte |
| 01/30/2001 | US6180250 Epoxy resin obtained by glycidyl etherifying a condensation product of a phenol and hydroxybenzaldehyde; condensation product of bisphenol a and formaldehyde; and a urea derivative. |
| 01/25/2001 | WO2001006520A1 High voltage capable non-volatile low viscosity insulating resins |
| 01/25/2001 | WO2001005901A1 Curable composition |
| 01/25/2001 | WO2001005862A1 Glycidyl ether group-containing partial alkoxysilane condensate, silane-modified resin, compositions of these, and processes for producing these |
| 01/25/2001 | WO2001005843A1 Process for the continuous production of epoxy-(meth)acrylic-styrene polymers and their use in coating |
| 01/25/2001 | WO2001005841A1 Process for the continuous production of gel free polymers, and powder and liquid coating applications containing gel free polymers |
| 01/25/2001 | DE19934519A1 Polyaddition reaction in mini-emulsion, for production of polyurethanes, polyureas and polyepoxides, comprises forming adduct of mini-emulsion in liquid medium and reacting |
| 01/25/2001 | DE19934517A1 Polyreaction in non-aqueous mini-emulsion, comprises forming edduct of the mini-emulsion in non-aqueous liquid dispersion medium using surfactant and osmotically stabilizing component and reacting |
| 01/25/2001 | DE19934036A1 Production of a flat article for use as a floor covering, comprises pre-crosslinking a mixture of an epoxidizing product of carboxylic acid ester(s) with crosslinker(s), molding to give flat surface and curing using second agent |
| 01/25/2001 | CA2378191A1 Curable composition |
| 01/24/2001 | EP1070733A1 Method of synthesis of polyaminofunctional hydroxyurethane oligomers and hybride polymers formed therefrom |
| 01/24/2001 | EP1029000A4 Crystallization resistant amidoamine compositions |
| 01/24/2001 | EP0925320B1 Coating compositions polymerisable and/or cross-linkable by ultraviolet or visible light |
| 01/24/2001 | CN1281491A Curable resin compositions |
| 01/24/2001 | CN1281478A Condensation polymer containing hydroxyalkylamide groups |
| 01/24/2001 | CN1281476A Novolaks as water-unaffected accelerators for epoxy resin hardeners |
| 01/24/2001 | CN1280994A Process for preparing polyoxyvinethene as condensate of styrene, phenol and formaldehyde |
| 01/24/2001 | CN1060961C Absorbent members containing interparticle crosslinked aggregates |
| 01/23/2001 | US6177541 Process for producing an isocyanurate derivative |
| 01/23/2001 | US6177489 Blend of epoxy resin, curing agent, silica, and polysiloxane |
| 01/23/2001 | US6177488 Blend of acrylic resin, melamine resin and acyclic epoxy containing compound |
| 01/23/2001 | US6177487 Blend of epoxy resin, curing agent and additives |
| 01/23/2001 | US6176965 Method for producing a bonded structure of aluminum alloy pressed plate |
| 01/23/2001 | CA2053287C Aqueous coating composition |
| 01/17/2001 | EP1069167A2 Coating composition |
| 01/17/2001 | EP1068277A1 Adhesive composition and precursor thereof |
| 01/17/2001 | CN1280524A Method for treatment of metal substrates using mannich-derived polyethers |
| 01/17/2001 | CN1060771C Novel aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin |
| 01/16/2001 | US6174967 Composition of epoxy resin and (cyclo)alkoxy-substituted organosilane |
| 01/16/2001 | US6174961 Nonlinear-optically active copolymers, polyadducts produced from them, and their use for nonlinear-optical media |
| 01/16/2001 | US6174932 Curable sealant composition |
| 01/16/2001 | US6174928 Process for producing fluorinated oligomer having COOH groups at both ends |
| 01/16/2001 | US6174640 Epoxy based liquid toner formulations |
| 01/16/2001 | US6174227 A polishing pad with a surface having vickers hardness of 2.5 to 40, comprising an epoxy resin selected from bisphenol a or bisphenol f epoxy resin, novolac epoxy resin, denatured epoxy resin, aromatic anhydride or amine or imidazole curing agent |
| 01/11/2001 | WO2001002506A1 Composition to be used in paints |
| 01/11/2001 | WO2001002486A1 Liquid thermosetting resin composition and method of permanent hole-filling for printed wiring board using the same |
| 01/11/2001 | WO2001002469A1 Method for producing fiber reinforced materials |
| 01/11/2001 | WO2001002454A1 Phenol-novolacs with improved optical properties |
| 01/11/2001 | WO2001002382A1 Hydrophobic, high tg cycloaliphatic epoxy resins |
| 01/11/2001 | DE19930863A1 Preparation of solid modified cycloaliphatic epoxy resins, involves using liquid cycloaliphatic polyepoxide compounds with at least one ether oxygen bond per mol. |
| 01/11/2001 | CA2377754A1 Method for producing fiber reinforced materials |
| 01/11/2001 | CA2346238A1 Phenol-novolacs with improved optical properties |
| 01/10/2001 | EP1067163A1 Adhesive and semiconductor devices |
| 01/10/2001 | EP0858471B1 Aqueous powder paint dispersions |
| 01/09/2001 | US6172182 Process for the manufacture of epoxy compounds |
| 01/09/2001 | US6171522 Heterocyclic aromatic anion salts, and their uses as ionic conducting materials |
| 01/09/2001 | US6171440 Process for repulping wet strength paper having cationic thermosetting resin |