| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 10/24/2001 | EP0642558B2 Catalyzed cationic paint binders, process for their preparation, and their use |
| 10/24/2001 | CN1319112A Epoxy resin composition and seimconductor device |
| 10/24/2001 | CN1318571A Semiconductor device and its manufacture |
| 10/24/2001 | CN1073585C Polyester resins with acid functional grup and epoxy functional group |
| 10/24/2001 | CN1073584C Hyperbranched macromolecule of polyester type |
| 10/24/2001 | CN1073581C Prep. of injection epxoy resin for high voltage switch |
| 10/23/2001 | US6306935 Thermosetting resin compositions for build-up method |
| 10/23/2001 | US6306792 Mixing with water, subjecting to pressure cooking, measuring electroconductivity of extraction mixture |
| 10/23/2001 | US6306555 Iodonium salts as latent acid donors |
| 10/23/2001 | CA2210700C Cathodic electrodeposition method utilizing cyclic carbonate-curable coating composition |
| 10/23/2001 | CA2010819C Novel electrodeposition coating system having improved impact and chip resistance |
| 10/18/2001 | WO2001077202A1 Aqueous two-component cross-linkable composition |
| 10/18/2001 | WO2001077197A2 Hydrogels and methods for their production |
| 10/18/2001 | WO2001077192A1 Aromatic oligomer, phenolic resin composition containing the same, and epoxy resin composition and cured object obtained therefrom |
| 10/18/2001 | US20010031851 Thermosetting resin composition |
| 10/18/2001 | US20010031837 Pressure sensitive adhesives |
| 10/18/2001 | US20010031829 Thermosetting compositions containing carboxylic acid functional polymers prepared by atom transfer radical polymerization |
| 10/18/2001 | US20010031362 Epoxy resin with an organosilane curing agent |
| 10/17/2001 | EP1146101A1 Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same |
| 10/17/2001 | EP1146084A2 Curable composition |
| 10/17/2001 | EP1144470A2 Thermally stable polyetheramines |
| 10/17/2001 | EP1144190A2 Manufacture of void-free laminates and use thereof |
| 10/17/2001 | EP0886667B1 Initiators for the cationic crosslinking of polymers containing organofunctional groups |
| 10/17/2001 | EP0836627B1 Polymer material, process for its production and use thereof |
| 10/17/2001 | EP0644803B1 Encapsulated semiconductor device |
| 10/17/2001 | EP0528874B2 Use of a dispersion-based two-component, filmforming reactive system |
| 10/17/2001 | CN1318077A Glycidyl ether group-contg. partial alkoxysilane condensate, silane-modified resin, compsns. of these, and processes for producing these |
| 10/17/2001 | CN1317515A Polythioalcohol, polymerizable compsn. resin and lens and process for preparing thio-alcohol compound |
| 10/17/2001 | CN1073127C Hologen-free flame-retardant epoxy resin compsn. and prepreg and laminate containing same |
| 10/17/2001 | CN1073126C Method for preparing end amino or polyamino polymer |
| 10/16/2001 | US6303672 For coating |
| 10/16/2001 | US6303219 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device |
| 10/16/2001 | US6303050 Compounds, process for their manufacture, as well as a process for manufacturing liquid-crystalline polymers using these compounds |
| 10/11/2001 | WO2001075524A2 Solid imaging compositions for preparing polypropylene-like articles |
| 10/11/2001 | WO2001074798A1 Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent |
| 10/11/2001 | WO2001000405A3 Manufacture of void-free laminates and use thereof |
| 10/11/2001 | DE10014640A1 Halogenfreies Epoxidharz mit definierter Molekülmasse Halogen-free epoxy resin with defined molecular mass |
| 10/11/2001 | DE10013735A1 Härter für Epoxidverbindungen, Verfahren zu ihrer Herstellung und Verwendung Hardeners for epoxy compounds, processes for their preparation and use |
| 10/11/2001 | CA2403595A1 Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent |
| 10/10/2001 | EP1142953A1 Cyanate-epoxy resin composition, and prepreg, metal foil-laminated plate and printed wiring board using the same |
| 10/10/2001 | EP1142924A1 Acid catalyzed polymerization of aqueous epoxy resin emulsions and uses thereof |
| 10/10/2001 | EP1142923A1 Flame-retardant epoxy resin composition and semiconductor device made using the same |
| 10/10/2001 | EP1142922A2 Photo-curable resin composition, process for producing the same and products using the same |
| 10/10/2001 | EP1142921A1 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board |
| 10/10/2001 | EP1141161A1 Photo curable adhesive composition |
| 10/10/2001 | EP1141127A1 Hydrophobic epoxide resin system |
| 10/10/2001 | EP1141085A1 Partial oxidation of polyoxyalkylene polyol compositions to polycarboxylic acid compositions |
| 10/10/2001 | EP1141074A1 Photo-polymerizable compositions and articles made therefrom |
| 10/10/2001 | EP1141073A1 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 10/10/2001 | EP1141072A1 Epoxy functional polyester resins, process for their preparation, and outdoor durable coating compositions comprising them |
| 10/10/2001 | EP1141071A2 High strength epoxy adhesive and uses thereof |
| 10/10/2001 | EP0866820B1 Latent curing agent compositions and a method of making |
| 10/10/2001 | CN1317027A Accelerators for hardenable systems |
| 10/10/2001 | CN1317023A Radiation-hardening and/or heat-hardening substances and preparations |
| 10/10/2001 | CN1317019A Polymer and epoxy resin compositions |
| 10/10/2001 | CN1316463A Phasphorus-containing epoxy resin composition, flame-retarded sheet resin composite metal forming, semi-solidified sheet, veneer shect, multiply sheet using the phasphorus-containing epoxy resin |
| 10/10/2001 | CN1316448A Acid catalysis polymerization of epoxy resin aqueous emulsion and its appliance |
| 10/10/2001 | CN1072687C Solid double-metal pressiate catalyst and its preparation method and opoxide polymerizing method |
| 10/09/2001 | US6300464 Polymerizable composition |
| 10/09/2001 | US6300428 Useful for forming cured coated substrates, that are suitable for food and beverage packaging |
| 10/09/2001 | US6300425 Adhesive property, resistance to humidity, and heat resistance after curing; used for protective layers, electric insulation coatings and like for electric appliances, electronic devices |
| 10/04/2001 | WO2001072919A2 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| 10/04/2001 | WO2001072898A1 Thermally degradable epoxy underfills for flip-chip applications |
| 10/04/2001 | WO2001072869A2 Mannich bases and further compounds based on alkyldipropylenetriamines as hardeners for epoxy resins |
| 10/04/2001 | WO2001072868A1 Halogen free epoxy resin having a defined molecule mass |
| 10/04/2001 | US20010027228 Volatile organic compound content reduced without sacrificing adhesion with top coats; pollution control |
| 10/04/2001 | US20010027227 Antifoam agent |
| 10/04/2001 | US20010026837 Epoxy resin and curing agent |
| 10/04/2001 | EP1138711A1 Curing agents for epoxy resins |
| 10/04/2001 | EP1138704A1 Curable compositions |
| 10/04/2001 | EP1138695A1 Biodegradable elastomer, item made of the same and production method of item |
| 10/04/2001 | EP1138670A1 Polythiol, polymerizable composition, resin and lens, and process for preparing thiol compound |
| 10/04/2001 | EP1138494A2 Ink jet printhead |
| 10/04/2001 | EP1137957A2 Method of preparing a shaped article having a photochromic coating thereon |
| 10/04/2001 | EP0941286A4 Self-dispersing curable epoxy resins, dispersions made therewith, and coating compositions made therefrom |
| 10/04/2001 | EP0914259B1 Thermal transfer compositions, articles and graphic articles made with same |
| 10/04/2001 | DE10014655A1 Alkyldipropylenetriamine-based Mannich bases and adducts and their reaction products with epoxides are useful as low viscosity hardeners for e.g. epoxy coatings to give rapid hardening at low temperature and high humidity |
| 10/04/2001 | CA2402454A1 Mannich bases and further compounds based on alkyldipropylenetriamines as hardeners for epoxy resins |
| 10/04/2001 | CA2342658A1 Acid catalyzed polymerization of aqueous epoxy resin emulsions and uses thereof |
| 10/03/2001 | CN1316066A Stereolithographic composition for preparing polyethylene-like articles |
| 10/03/2001 | CN1315975A Polymeric pigment dipersant having propenoic acid main chain, polyester side chains, cyclic imide groups and quaternary ammonium groups |
| 10/03/2001 | CN1315734A Insulative material for printed circuit board |
| 10/03/2001 | CN1072091C Coated abrasive article incorporating energy cured hot melt bottom coat and making method thereof |
| 10/02/2001 | US6297344 Heat-setting single-component LVA (low viscosity adhesive) system for bonding in the micro-range |
| 10/02/2001 | US6297332 Epoxy-resin composition and use thereof |
| 10/02/2001 | US6296940 Laminate comprising a flame-retardant resin composition |
| 10/02/2001 | CA2042008C Phosphorus compounds |
| 10/02/2001 | CA2022628C Coating compositions containing 1,3-dialkylimidazole-2-thione catalysts |
| 09/27/2001 | WO2001070886A2 Silicone amino-epoxy cross-linking system |
| 09/27/2001 | WO2001070867A2 Flame retardant epoxy molding compositions |
| 09/27/2001 | WO2001070844A1 Flame-retardant epoxy resin composition, molded object thereof, and electronic part |
| 09/27/2001 | WO2001070843A2 High molecular weight epoxy resin and resinous composition for printed circuit board |
| 09/27/2001 | US20010024749 Surface modified carbonaceous materials |
| 09/27/2001 | CA2402383A1 Flame retardant epoxy molding compositions |
| 09/27/2001 | CA2401597A1 Silicone amino-epoxy cross-linking system |
| 09/26/2001 | EP1137328A2 Insulating material for printed wiring board |
| 09/26/2001 | EP1136509A1 Epoxy hardening agents, process for preparing them and use |
| 09/26/2001 | EP1135445A2 Weldable, coated metal substrates and methods for preparing and inhibiting corrosion of the same |
| 09/26/2001 | EP1135429A1 Polyadditions in aqueous and non-aqueous mini-emulsions |
| 09/26/2001 | CN1314925A Storage-stable compositions useful for the production of structural forms |