Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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09/26/2001 | CN1314924A Hydroxy-functionalized poly(amino ether) salts |
09/26/2001 | CN1071772C Single-component thermosetting masses, its preparing method its their use |
09/25/2001 | US6294610 Coating powders for heat-sensitive substrates |
09/25/2001 | US6294597 Curable polymeric composition and use in protecting a substrate |
09/25/2001 | US6294596 Self-dispersing curable epoxy resins, dispersions made therewith, and coating compositions made therefrom |
09/25/2001 | US6294593 Combining host polymer with guest crossliniking agent; exposing combined host polymer and guest crosslinking agent to electric field to pole second order nonlinear optical component of polymer; exposing to electromagnetic radiation |
09/25/2001 | US6294270 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
09/20/2001 | WO2001068595A1 Novel sulfur compounds and intermolecular compounds containing the same as the component compound |
09/20/2001 | US20010023276 Polymeric material, method for its manufacture, and its utilization |
09/19/2001 | EP1133989A2 Polymer compositions for use in therapy |
09/19/2001 | CN1313872A Resin system |
09/19/2001 | CN1313871A Epoxy resin composition and process for producing silane-modified epoxy resin |
09/19/2001 | CN1313868A Preparation of water-soluble cross-linked cationic polymers |
09/19/2001 | CN1313360A 环氧树脂组合物及半导体装置 Epoxy resin composition and a semiconductor device |
09/18/2001 | US6291627 Epoxy resin rendered flame retardant by reaction with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide |
09/18/2001 | US6291626 Phosphorus-containing dihydric phenol or naphthol-advanced epoxy resin or cured |
09/18/2001 | US6291597 Reacting lactide monomer in presence of non-initiating reactant containing cyclic ester groups, to form a polylactide polymer |
09/18/2001 | US6291557 Alkali-soluble adhesive agent |
09/18/2001 | US6291554 Curable system of self-emulsified aqueous epoxy resin and its polymeric hybrids |
09/18/2001 | US6291545 Fluorine-containing epoxy resin composition readily soluble in solvent |
09/18/2001 | US6291540 Iodonium salt with low toxicity; e.g., (ch(ch3)2-c6h4)2-i+ |
09/18/2001 | US6291059 Foam core layer with surfaces and thermosetting seal layers of photopolymerization composition |
09/13/2001 | WO2001066621A1 High strength polymers and aerospace sealants therefrom |
09/13/2001 | US20010021753 Polymer compositions, their preparation and their use |
09/13/2001 | US20010021726 Overcoating with hardenable resin |
09/13/2001 | US20010021454 Phosphonium borate |
09/13/2001 | CA2402112A1 High strength polymers and aerospace sealants therefrom |
09/12/2001 | EP1132442A1 Thermosetting powder coating composition and method for forming a topcoat using the same |
09/12/2001 | EP1131371A1 Curable epoxy resin compositions |
09/12/2001 | EP1131370A1 Hydroxy-functionalized poly(amino ether) salts |
09/12/2001 | CN1070890C Epoxidized monohydroxylated rubber toughening modifiers for epoxy resins |
09/12/2001 | CN1070883C Thermosetting resin compositions |
09/12/2001 | CN1070877C Method to manufacture liquid epoxy resins |
09/11/2001 | US6288208 Highly branched oligomers, process for their preparation and applications thereof |
09/11/2001 | US6288169 Butadiene rubber particles with secondary particle sizes for epoxy resin encapsulant |
09/11/2001 | US6287992 Nanocomposite comprising an organophilic, intercalated, multilayered inorganic material dispersed within an epoxy vinyl ester resin |
09/11/2001 | US6287748 Solid imaging compositions for preparing polyethylene-like articles |
09/11/2001 | CA2020940C Imidazoline amine-epoxy adduct as a pigment dispersant |
09/06/2001 | US20010020071 Thermosetting resins |
09/06/2001 | US20010018880 Mortar composition, curable by frontal polymerization, and a method for fastening tie bars |
09/05/2001 | EP1130041A1 Epoxy resin composition and semiconductor device |
09/05/2001 | EP1129157A1 Preservation / lubricant / primer-composition for metallic surfaces |
09/05/2001 | CN1311729A Rotary trowel for use in the molding of ceramics and method for production thereof |
09/05/2001 | CN1311172A Hardened-able double component mortar and its application |
09/04/2001 | US6284869 Prepregs and electrolaminates |
09/04/2001 | US6284827 Having a reduced content of fluoride ions extractable with water; magnesium compound |
09/04/2001 | US6284818 Epoxy resin, a curing agent, an inorganic filler, an adduct of triphenylphosphine with benzoquinone, and a hydrous bismuth nitrate oxide |
09/04/2001 | CA2157468C Superabsorbent polymer foam |
08/30/2001 | US20010018498 Acetylide-form propargyl-containing resin composition for cationic electrocoating |
08/30/2001 | US20010018122 Epoxy resin blend |
08/30/2001 | DE10101305A1 Moisture-curable epoxy resin composition used as adhesive, sealant, capping agent, and coating composition, uses oxazolidine compound as latent curing agent |
08/30/2001 | DE10009298A1 Phosphorus-modified epoxy resin mixture for electrical laminates contains the reaction product of a poly-epoxide with a phosphorus-containing ester-anhydride as the resin, with a phosphorus-modified novolak as hardener |
08/29/2001 | EP1127094A1 Curable coating compositions containing blends of carbamate-functional compounds |
08/29/2001 | EP1127093A1 Curable coating compositions containing blends of carbamate-functional compounds |
08/29/2001 | EP0701690B1 Process for measurement of the degree of cure and percent resin of fiberglass-reinforced epoxy resin prepreg |
08/29/2001 | CN1310750A Adhesive which hardens in several stages |
08/29/2001 | CN1310666A Phenol-novolacs with improved optical properties |
08/29/2001 | CN1070199C Oligomeric sterically hindered polyamide crosslinkers and coating composition containing the same |
08/28/2001 | US6281307 Polymerizable composition, process for producing cross linked polymers, and cross-linkable polymers |
08/28/2001 | US6281260 Expansion temperature tolerant dry expandable sealant and baffle product |
08/23/2001 | WO2001060938A1 Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device |
08/23/2001 | WO2001060914A1 Composite resin composition |
08/23/2001 | WO2001060913A1 Thermosetting resin composition |
08/23/2001 | WO2001060901A1 Branched polymeric surfactant reaction products, methods for their preparation, and uses therefor |
08/23/2001 | WO2001060701A2 Gas barrier compositions having improved barrier properties |
08/23/2001 | DE10006592A1 Latente Kombinationsverbindungen und latente Ammoniumsalze aus Epoxidharzhärter und Flammschutzmittel sowie daraus hergestellte Epoxidharz-Systeme und -Produkte Deferred combination compounds and latent ammonium salts of epoxy resin curing and flame retardants, and from epoxy resin systems and products produced |
08/23/2001 | CA2400780A1 Branched polymeric surfactant reaction products, methods for their preparation, and uses therefor |
08/22/2001 | EP1125960A2 A latent combination compound and a latent ammonium salt from an epoxy resin curing agent and a flame retardant, epoxy resin systems or -products made therefrom |
08/22/2001 | EP1124909A1 Curable coating compositions containing blends of carbamate-functional compounds |
08/22/2001 | EP1124876A1 Curable coating compositions |
08/22/2001 | EP1124862A1 Preparation of water-soluble cross-linked cationic polymers |
08/22/2001 | EP0827974B1 Epoxy resin composition and optical information recording medium made by using the same |
08/22/2001 | CN1309680A Heat curable epoxy compositions |
08/21/2001 | US6277944 Reacting polyhydroxy aromatic compound with an alkene or aralkene compound in presence of mixture of oxalic acid and boric acid to form alkylated or aralkylated polyhydroxy aromatic compound |
08/21/2001 | US6277930 Epoxy resin composition containing unsaturated monomer, curing agent, photoinitiator and epoxy (meth) acrylate |
08/21/2001 | US6277928 Epoxy-functional amidoamine reacted with excess polyamine and monoepoxy as epoxy curative |
08/21/2001 | US6277903 Sound damping coating of flexible and rigid epoxy resins |
08/21/2001 | US6277898 Curable sealant composition |
08/21/2001 | CA2056982C Powder compositions for primer coatings suitable for pvdf-based top coatings |
08/21/2001 | CA2039748C Thermosetting resin composition |
08/16/2001 | WO2001059524A1 Liquid, radiation-curable composition, especially for stereolithography |
08/16/2001 | WO2001058979A1 Photocurable composition, process for producing photocurable composition, photocurable pressure-sensitive adhesive sheet, process for producing photocurable pressure-sensitive adhesive sheet, and method of bonding |
08/16/2001 | WO2001058977A1 Photocurable/thermosetting composition for forming matte film |
08/16/2001 | US20010014706 Heat curing; adhesives |
08/16/2001 | US20010014399 Solvent-free |
08/16/2001 | EP1123944A1 Glycidyl ether group-containing partial alkoxysilane condensate, silane-modified resin, compositions of these, and processes for producing these |
08/16/2001 | EP1123348A2 Impact-resistant epoxide resin compositions |
08/16/2001 | CA2398160A1 Liquid, radiation-curable composition, especially for stereolithography |
08/15/2001 | CN1308570A 涂敷磨料制品 Coated abrasive article |
08/15/2001 | CN1069658C Epoxy resin compositions containing cure inhibiting agent and laminates prepared from the compositions |
08/15/2001 | CN1069657C Gelled reactive resin compositions |
08/14/2001 | US6274682 Epoxy resin system |
08/14/2001 | US6274673 Hardeners for epoxy resins |
08/14/2001 | US6274650 Epoxy resin compositions for liquid encapsulation |
08/14/2001 | US6274649 Aqueous binding agent dispersion for cationic electro-dipcoat paint |
08/14/2001 | US6274251 Semiconductor encapsulating epoxy resin composition and semiconductor device |
08/09/2001 | WO2001057110A1 Epoxy resin composition |
08/09/2001 | US20010012564 For forming a corrosion resistant coating film on steel, comprising a polyol-modified, amino group-containing epoxy resin modified with caprolactone |
08/09/2001 | DE10002605A1 Härtbare Zwei-Komponenten-Nörtelmasse und deren Verwendung A curable two-component Nörtelmasse and their use |
08/08/2001 | EP1121386A1 Highly branched oligomers, process for their preparation and applications thereof |