Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
09/2001
09/26/2001CN1314924A Hydroxy-functionalized poly(amino ether) salts
09/26/2001CN1071772C Single-component thermosetting masses, its preparing method its their use
09/25/2001US6294610 Coating powders for heat-sensitive substrates
09/25/2001US6294597 Curable polymeric composition and use in protecting a substrate
09/25/2001US6294596 Self-dispersing curable epoxy resins, dispersions made therewith, and coating compositions made therefrom
09/25/2001US6294593 Combining host polymer with guest crossliniking agent; exposing combined host polymer and guest crosslinking agent to electric field to pole second order nonlinear optical component of polymer; exposing to electromagnetic radiation
09/25/2001US6294270 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
09/20/2001WO2001068595A1 Novel sulfur compounds and intermolecular compounds containing the same as the component compound
09/20/2001US20010023276 Polymeric material, method for its manufacture, and its utilization
09/19/2001EP1133989A2 Polymer compositions for use in therapy
09/19/2001CN1313872A Resin system
09/19/2001CN1313871A Epoxy resin composition and process for producing silane-modified epoxy resin
09/19/2001CN1313868A Preparation of water-soluble cross-linked cationic polymers
09/19/2001CN1313360A 环氧树脂组合物及半导体装置 Epoxy resin composition and a semiconductor device
09/18/2001US6291627 Epoxy resin rendered flame retardant by reaction with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide
09/18/2001US6291626 Phosphorus-containing dihydric phenol or naphthol-advanced epoxy resin or cured
09/18/2001US6291597 Reacting lactide monomer in presence of non-initiating reactant containing cyclic ester groups, to form a polylactide polymer
09/18/2001US6291557 Alkali-soluble adhesive agent
09/18/2001US6291554 Curable system of self-emulsified aqueous epoxy resin and its polymeric hybrids
09/18/2001US6291545 Fluorine-containing epoxy resin composition readily soluble in solvent
09/18/2001US6291540 Iodonium salt with low toxicity; e.g., (ch(ch3)2-c6h4)2-i+
09/18/2001US6291059 Foam core layer with surfaces and thermosetting seal layers of photopolymerization composition
09/13/2001WO2001066621A1 High strength polymers and aerospace sealants therefrom
09/13/2001US20010021753 Polymer compositions, their preparation and their use
09/13/2001US20010021726 Overcoating with hardenable resin
09/13/2001US20010021454 Phosphonium borate
09/13/2001CA2402112A1 High strength polymers and aerospace sealants therefrom
09/12/2001EP1132442A1 Thermosetting powder coating composition and method for forming a topcoat using the same
09/12/2001EP1131371A1 Curable epoxy resin compositions
09/12/2001EP1131370A1 Hydroxy-functionalized poly(amino ether) salts
09/12/2001CN1070890C Epoxidized monohydroxylated rubber toughening modifiers for epoxy resins
09/12/2001CN1070883C Thermosetting resin compositions
09/12/2001CN1070877C Method to manufacture liquid epoxy resins
09/11/2001US6288208 Highly branched oligomers, process for their preparation and applications thereof
09/11/2001US6288169 Butadiene rubber particles with secondary particle sizes for epoxy resin encapsulant
09/11/2001US6287992 Nanocomposite comprising an organophilic, intercalated, multilayered inorganic material dispersed within an epoxy vinyl ester resin
09/11/2001US6287748 Solid imaging compositions for preparing polyethylene-like articles
09/11/2001CA2020940C Imidazoline amine-epoxy adduct as a pigment dispersant
09/06/2001US20010020071 Thermosetting resins
09/06/2001US20010018880 Mortar composition, curable by frontal polymerization, and a method for fastening tie bars
09/05/2001EP1130041A1 Epoxy resin composition and semiconductor device
09/05/2001EP1129157A1 Preservation / lubricant / primer-composition for metallic surfaces
09/05/2001CN1311729A Rotary trowel for use in the molding of ceramics and method for production thereof
09/05/2001CN1311172A Hardened-able double component mortar and its application
09/04/2001US6284869 Prepregs and electrolaminates
09/04/2001US6284827 Having a reduced content of fluoride ions extractable with water; magnesium compound
09/04/2001US6284818 Epoxy resin, a curing agent, an inorganic filler, an adduct of triphenylphosphine with benzoquinone, and a hydrous bismuth nitrate oxide
09/04/2001CA2157468C Superabsorbent polymer foam
08/2001
08/30/2001US20010018498 Acetylide-form propargyl-containing resin composition for cationic electrocoating
08/30/2001US20010018122 Epoxy resin blend
08/30/2001DE10101305A1 Moisture-curable epoxy resin composition used as adhesive, sealant, capping agent, and coating composition, uses oxazolidine compound as latent curing agent
08/30/2001DE10009298A1 Phosphorus-modified epoxy resin mixture for electrical laminates contains the reaction product of a poly-epoxide with a phosphorus-containing ester-anhydride as the resin, with a phosphorus-modified novolak as hardener
08/29/2001EP1127094A1 Curable coating compositions containing blends of carbamate-functional compounds
08/29/2001EP1127093A1 Curable coating compositions containing blends of carbamate-functional compounds
08/29/2001EP0701690B1 Process for measurement of the degree of cure and percent resin of fiberglass-reinforced epoxy resin prepreg
08/29/2001CN1310750A Adhesive which hardens in several stages
08/29/2001CN1310666A Phenol-novolacs with improved optical properties
08/29/2001CN1070199C Oligomeric sterically hindered polyamide crosslinkers and coating composition containing the same
08/28/2001US6281307 Polymerizable composition, process for producing cross linked polymers, and cross-linkable polymers
08/28/2001US6281260 Expansion temperature tolerant dry expandable sealant and baffle product
08/23/2001WO2001060938A1 Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device
08/23/2001WO2001060914A1 Composite resin composition
08/23/2001WO2001060913A1 Thermosetting resin composition
08/23/2001WO2001060901A1 Branched polymeric surfactant reaction products, methods for their preparation, and uses therefor
08/23/2001WO2001060701A2 Gas barrier compositions having improved barrier properties
08/23/2001DE10006592A1 Latente Kombinationsverbindungen und latente Ammoniumsalze aus Epoxidharzhärter und Flammschutzmittel sowie daraus hergestellte Epoxidharz-Systeme und -Produkte Deferred combination compounds and latent ammonium salts of epoxy resin curing and flame retardants, and from epoxy resin systems and products produced
08/23/2001CA2400780A1 Branched polymeric surfactant reaction products, methods for their preparation, and uses therefor
08/22/2001EP1125960A2 A latent combination compound and a latent ammonium salt from an epoxy resin curing agent and a flame retardant, epoxy resin systems or -products made therefrom
08/22/2001EP1124909A1 Curable coating compositions containing blends of carbamate-functional compounds
08/22/2001EP1124876A1 Curable coating compositions
08/22/2001EP1124862A1 Preparation of water-soluble cross-linked cationic polymers
08/22/2001EP0827974B1 Epoxy resin composition and optical information recording medium made by using the same
08/22/2001CN1309680A Heat curable epoxy compositions
08/21/2001US6277944 Reacting polyhydroxy aromatic compound with an alkene or aralkene compound in presence of mixture of oxalic acid and boric acid to form alkylated or aralkylated polyhydroxy aromatic compound
08/21/2001US6277930 Epoxy resin composition containing unsaturated monomer, curing agent, photoinitiator and epoxy (meth) acrylate
08/21/2001US6277928 Epoxy-functional amidoamine reacted with excess polyamine and monoepoxy as epoxy curative
08/21/2001US6277903 Sound damping coating of flexible and rigid epoxy resins
08/21/2001US6277898 Curable sealant composition
08/21/2001CA2056982C Powder compositions for primer coatings suitable for pvdf-based top coatings
08/21/2001CA2039748C Thermosetting resin composition
08/16/2001WO2001059524A1 Liquid, radiation-curable composition, especially for stereolithography
08/16/2001WO2001058979A1 Photocurable composition, process for producing photocurable composition, photocurable pressure-sensitive adhesive sheet, process for producing photocurable pressure-sensitive adhesive sheet, and method of bonding
08/16/2001WO2001058977A1 Photocurable/thermosetting composition for forming matte film
08/16/2001US20010014706 Heat curing; adhesives
08/16/2001US20010014399 Solvent-free
08/16/2001EP1123944A1 Glycidyl ether group-containing partial alkoxysilane condensate, silane-modified resin, compositions of these, and processes for producing these
08/16/2001EP1123348A2 Impact-resistant epoxide resin compositions
08/16/2001CA2398160A1 Liquid, radiation-curable composition, especially for stereolithography
08/15/2001CN1308570A 涂敷磨料制品 Coated abrasive article
08/15/2001CN1069658C Epoxy resin compositions containing cure inhibiting agent and laminates prepared from the compositions
08/15/2001CN1069657C Gelled reactive resin compositions
08/14/2001US6274682 Epoxy resin system
08/14/2001US6274673 Hardeners for epoxy resins
08/14/2001US6274650 Epoxy resin compositions for liquid encapsulation
08/14/2001US6274649 Aqueous binding agent dispersion for cationic electro-dipcoat paint
08/14/2001US6274251 Semiconductor encapsulating epoxy resin composition and semiconductor device
08/09/2001WO2001057110A1 Epoxy resin composition
08/09/2001US20010012564 For forming a corrosion resistant coating film on steel, comprising a polyol-modified, amino group-containing epoxy resin modified with caprolactone
08/09/2001DE10002605A1 Härtbare Zwei-Komponenten-Nörtelmasse und deren Verwendung A curable two-component Nörtelmasse and their use
08/08/2001EP1121386A1 Highly branched oligomers, process for their preparation and applications thereof