| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 04/11/2001 | CN1291219A Resin compositions for powdery coatings |
| 04/11/2001 | CN1290683A Use of bisphenol in preparing polycarbonic ester and opoxy resin |
| 04/10/2001 | US6214906 Blend of epoxy resin and hardener |
| 04/10/2001 | US6214905 Encapsulating semiconductors |
| 04/10/2001 | US6214904 Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device |
| 04/10/2001 | US6214468 Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same |
| 04/10/2001 | US6214455 Bisphenol a epoxy resin, novolak epoxy resin, reactive phosphoric acid ester, curing agent of nitrogen-containing phenolic resin prepared by the co-condensation of a phenolic compound, a guanamine compound, and an aldehyde compound |
| 04/10/2001 | US6214418 Thermosetting, high-solids coating composition and method of forming topcoat by using the same |
| 04/10/2001 | US6214159 Curable epoxide composition and its use |
| 04/05/2001 | WO2001023466A1 Electrically conductive adhesive containing epoxide-modified polyurethane |
| 04/05/2001 | WO2001023461A1 Expansion temperature tolerant dry expandable sealant and baffle product and method of preparing same |
| 04/05/2001 | WO2001023439A1 Resins containing carbamate groups, method for their production and use of the same |
| 04/05/2001 | WO2001023012A1 Binding superabsorbent polymers to substrates |
| 04/04/2001 | EP1088813A2 Urethane group containing photoinitiators for cationic curing |
| 04/04/2001 | EP1088042A1 Adhesive which hardens in several stages |
| 04/04/2001 | EP1088024A1 Polymer composite and a method for its preparation |
| 04/04/2001 | EP1042404A4 Low voc coating composition |
| 04/04/2001 | EP0960159A4 Primer for plastic films |
| 04/04/2001 | CN1064062C Epoxy resin composition used for formation and press molt articles of high voltage apparatus and manufacture thereof |
| 04/04/2001 | CN1064057C Purifying method for epoxy ethane-epoxy propane random copolymer |
| 04/04/2001 | CN1064055C Epoxy acrylates |
| 04/04/2001 | CN1063984C Improved double metal cyanide complex catalysts |
| 04/03/2001 | US6211277 Lead on chip structure semiconductor with epoxy resin |
| 04/03/2001 | US6211261 Thermosetting pressure-sensitive adhesive and adhesive sheet thereof |
| 04/03/2001 | US6210862 Solder mask having cationically polymerizable non-brominated epoxy resin system, |
| 04/03/2001 | US6210811 Improved heat resistance, improved moisture resistance, low stress property |
| 04/03/2001 | US6210790 Transparency, hardness, abrasion-resistance |
| 04/03/2001 | CA2021016C Acoustic vibrational material from fiber-reinforced polybutadiene-modified epoxy resin |
| 04/03/2001 | CA2020165C Adhesion promoter compositions for polyolefin substrates |
| 03/29/2001 | WO2001022133A1 Photonic crystal materials |
| 03/29/2001 | WO2001021697A1 Epoxy resin composition and resin encapsulation type semiconductor device |
| 03/29/2001 | WO2001021687A1 Solvent composition |
| 03/29/2001 | WO2001021679A1 Alkyldipropylenentriamines and their adducts as hardeners for expoxy resins |
| 03/29/2001 | WO2001021666A1 Cationic polymerization reaction, polymerization catalyst, curable composition, and cured product obtained therefrom |
| 03/28/2001 | EP1087262A2 Energy-ray curing resin composition |
| 03/28/2001 | EP1086972A1 Hardener for epoxy resin, epoxy resin composition, and process for producing silane-modified phenolic resin |
| 03/28/2001 | EP1086971A1 Antireflection film and nonglare article |
| 03/28/2001 | EP1086743A1 Catalyst for production of epoxides and methods for production thereof and epoxides |
| 03/28/2001 | EP1086403A1 Liquid, radiation-curable composition, especially for stereolithography |
| 03/28/2001 | EP1086190A1 Adhesive and coating formulations for flexible packaging |
| 03/28/2001 | CN1289348A Thiol-cured epoxy composition |
| 03/27/2001 | US6207733 Capped amines as hardeners for monocomponent (1c) epoxy resin systems which can be diluted with water |
| 03/27/2001 | US6207732 Heat-setting single-component LVA (low-viscosity adhesive) system for bonding in the micro-range |
| 03/27/2001 | US6207730 Epoxy and microsphere adhesive composition |
| 03/22/2001 | WO2001019895A1 Uv-curable compositions |
| 03/22/2001 | WO2001019888A1 Coating composition and method of coating substrates |
| 03/22/2001 | WO2001019606A1 Treated copper foil and process for making treated copper foil |
| 03/21/2001 | EP1085044A2 Method for recycling thermosetting resin materials |
| 03/21/2001 | EP1085031A2 Alkylsiloxane-containing epoxy resin composition, surface modifying method using the same, ink-jet recording head and liquid-jet recording apparatus |
| 03/21/2001 | EP1084456A1 Heavy metal-free coating formulations |
| 03/21/2001 | EP1084169A1 Low viscosity compositions of epoxy functional polyester resins |
| 03/21/2001 | EP1083859A1 Photopolymerizable dental compositions |
| 03/21/2001 | EP0799257B1 Crosslinkable composition for coating substrates and coating method using the same |
| 03/21/2001 | CN1288481A Curable epoxy-based compositions |
| 03/21/2001 | CA2317391A1 Photoinitiators containing urethane groups for cationic curing |
| 03/20/2001 | US6204311 Polymerizable composition |
| 03/15/2001 | WO2000079582A9 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent |
| 03/14/2001 | EP1083198A2 Curable epoxy resin compositions with brominated triazine flame retardants |
| 03/14/2001 | EP1082391A1 Thermosetting resinous binder compositions, their preparation and use as coating materials |
| 03/14/2001 | EP1042080A4 Method for treatment of metal substrates using mannich-derived polyethers |
| 03/14/2001 | EP0646845B1 Color filter, material thereof and resin |
| 03/13/2001 | US6201094 Phenol-novolacs with improved optical properties |
| 03/13/2001 | US6201074 Phosphorous diepoxides for epoxy resins |
| 03/13/2001 | US6201073 Cyclohexanedicarboxylic acid, dimethylolpropionic acid, hydrogenated diphenylolpropane and hydroxypivalic acid for polyesters |
| 03/13/2001 | US6201070 Protective coatings with cyclohexylepoxidecarboxylic esters |
| 03/13/2001 | US6200408 Method for cementing a component to a surface |
| 03/08/2001 | WO2001016425A1 Method of producing paper, paperboard and cardboard |
| 03/08/2001 | WO2001016204A1 Process for upstaging epoxy resins |
| 03/08/2001 | CA2382672A1 Method of producing paper, paperboard and cardboard |
| 03/07/2001 | EP1080392A1 Liquid, radiation-curable composition, especially for producing flexible cured articles by stereolithography |
| 03/07/2001 | EP1080084A2 Process for epoxidation of aryl allyl ethers |
| 03/07/2001 | CN1286701A Phenol-novolacs with improved optical properties |
| 03/07/2001 | CN1062876C Method for preparing reduced monomer amission polyester resin |
| 03/07/2001 | CN1062874C Allyl-contg. epoxy resin composition comprising copolymer of ethylenically unsaturated anhydride and vinyl compound |
| 03/06/2001 | US6197898 Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent |
| 03/06/2001 | US6197882 Curable resin composition and adhesive |
| 03/06/2001 | US6197873 Aromatic polycarbonate, aromatic polyester, epoxidized conjugated diene-vinylaromatic block polymer that may be hydrogenated, reaction accelerator for epoxy groups |
| 03/06/2001 | US6197122 Compounds with substituted cyclic hydrocarbon moieties linked by secondary or tertiary oxycarbonyl containing moiety providing reworkable cured thermosets |
| 03/06/2001 | CA2078239C Absorbent members containing interparticle crosslinked aggregates |
| 03/01/2001 | WO2001014470A1 Process for producing tyres, tyres thus obtained and elastomeric compositions used therein |
| 03/01/2001 | WO2001014445A1 Leach-protective coatings for water meter components |
| 03/01/2001 | DE19940955A1 Verfahren zur Herstellung von Papier, Pappe und Karton Process for the manufacture of paper and cardboard |
| 03/01/2001 | DE10039385A1 A coating composition useful for coating iron, steel, Al, Zn, wood, plastics, stone, concrete and as an anti-rust coating for steel surfaces contains liquid epoxy resin and ketimine and forms a film of excellent corrosion resistance |
| 02/28/2001 | EP0789721B1 Visible-light curable epoxy system with enhanced depth of cure |
| 02/28/2001 | CN1285854A Process of repulping wet strenlgth paper |
| 02/28/2001 | CN1062488C Process for reducing halogen content in aqueous solution of nitrogen-containing epihalogenohydrine resin and the use thereof |
| 02/27/2001 | US6194523 Comprising polyesterpolyurethane and an epoxy resin |
| 02/27/2001 | US6194491 Biphenyl epoxy resin, naphthalene-containing phenolic resin and accelerator triphenylphosphine/p-benzoquinone |
| 02/27/2001 | US6194490 Curable composition comprising epoxidized natural oils |
| 02/27/2001 | US6194482 Casting resin of epoxy resin, isocyanurate siloxane, fillers, photo initiators and thermal initiators |
| 02/27/2001 | CA2099605C Two-component epoxy resin/zinc dust priming coat for steel surfaces |
| 02/27/2001 | CA2005086C Concurrent addition process for preparing high purity epoxy resins |
| 02/22/2001 | WO2001012720A1 Onium gallates cationic initiators |
| 02/22/2001 | WO2001012695A1 Phenolic resin, epoxy resin, and processes for producing these |
| 02/22/2001 | WO2001012694A1 Adhesive composition |
| 02/22/2001 | WO2001012689A1 Semi-interpenetrating networks comprising polyepoxides |
| 02/22/2001 | WO2001012679A1 Composition that hardens with visible light and use thereof |
| 02/22/2001 | DE19955379A1 Self-emulsified aqueous epoxy resin dispersion, e.g. for coating or adhesive uses, obtained by half-esterification of dicarboxylic anhydride with hydroxyl groups in the resin, followed by neutralization with tert. amine |
| 02/22/2001 | DE19939738A1 Production of stable, modified, unsaturated cycloaliphatic epoxy resin for use e.g. in coating materials, involves reacting liquid cycloaliphatic diepoxide with special unsaturated half-ester compounds |
| 02/22/2001 | DE19937091A1 Adhäsivsysteme II Adhesive systems II |