Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
06/2001
06/28/2001WO2001046495A2 Coated metal substrates and methods for preparing and inhibiting corrosion of the same
06/28/2001WO2001046305A2 Recycling of articles comprising hydroxy-phenoxyether polymers
06/28/2001WO2001046303A2 Hydroxy-phenoxyether polymer/fiber composites and foams
06/28/2001WO2001046290A1 Ambient-temperature-stable, one-part curable epoxy adhesive
06/28/2001WO2001046289A1 Electrochemical curable resin compositions
06/28/2001WO2001046287A1 Integrated continuous process for upstaging epoxy resins
06/28/2001WO2001046285A1 Substance mixture which can be cured thermally and by using actinic radiation, and the use thereof
06/28/2001WO2001045941A2 Laminates and coated materials comprising hydroxy-phenoxyether polymers
06/28/2001WO1998002478A3 Water-thinnable, single-component epoxy resin systems with latent hardening
06/28/2001CA2394617A1 Substance mixture which can be cured thermally and by using actinic radiation, and the use thereof
06/27/2001EP1111013A1 Cationic coating composition
06/27/2001EP1109869A1 Aqueous powder lacquer dispersion
06/27/2001EP1109862A1 Thermosetting compositions containing carboxylic acid functional polymers prepared by atom transfer radical polymerization
06/27/2001EP1109850A1 Primerless substrate repair composition and method
06/27/2001EP1109849A1 Thermosetting compositions containing carboxylic acid functional polymers and epoxy functional polymers prepared by atom transfer radical polymerisation
06/27/2001EP0787161B1 Low voc laminating formulations
06/26/2001US6251999 Tin carboxylate catalysts for epoxy-acid coating compositions
06/26/2001US6251980 Nanocomposites formed by onium ion-intercalated clay and rigid anhydride-cured epoxy resins
06/26/2001US6251557 Photosensitive resin composition for rapid prototyping and a process for the manufacture of 3-dimensional objects
06/26/2001US6251483 Accumulation; filtration
06/21/2001WO2001044873A1 Photoinitiator system with acylphosphine oxide initiators
06/21/2001WO2001044382A1 Method for the anodic electrophoretic enamelling and electrophoretic paints
06/21/2001WO2001044344A1 Curable resin composition, process for producing the same, and coated object made with the same
06/21/2001WO2001044343A1 Photoinitiator system with titanocene initiators
06/21/2001WO2001044342A1 Sealing agent for liquid-crystal display cell, composition for sealing agent for liquid-crystal display cell, and liquid-crystal display element
06/21/2001DE19961355A1 Photoinitiatorsystem mit Titanocen-Initiatoren Photoinitiator system with titanocene initiators
06/21/2001DE19961347A1 Photoinitiatorsystem mit Acylphosphinoxid-Initiatoren Photoinitiator system with acyl phosphine oxide initiators
06/21/2001CA2392771A1 Photoinitiator system with acylphosphine oxide initiators
06/20/2001EP1107938A2 Recycling of thermosetting materials
06/20/2001EP0890176B1 Proton conductor in liquid form
06/20/2001EP0858472B1 Photosensitive resin composition
06/20/2001CN1300301A Reworkable thermosetting resin composition
06/19/2001US6248854 Modified epoxysiloxane condensate, process for producing the same and its use as low-stress casting resins in the electronic and electrotechnical industry
06/19/2001US6248810 Waterborne dispersions of epoxidized polydiene block copolymers and amino resins
06/19/2001US6248454 Composition for semiconductor encapsulation, which comprises epoxy resin, phenolic resin, cure accelerator, cure accelerator-containing microcapsules having core/shell structure with accelerator encapsulated in thermoplastic resin
06/19/2001US6248405 Material containing polyreaction products for the coating layer of planar structures
06/19/2001US6248204 Structural reinforcement component that includes a hydrophobic fumed silica in an amount of about 5 to about 20 weight percent, based on the epoxy resin component
06/19/2001US6248182 Contacting the surface of rubber or plastic with these resins to improve corrosion resistance and paint adhesion properties
06/14/2001WO2001042360A1 Flame-retardant epoxy resin composition and laminate made with the same
06/14/2001WO2001042359A1 Flame retardant phosphorus element-containing epoxy resin compositions
06/14/2001WO2001042330A1 Epoxy resin composition and fiber-reinforced composite material formed with the epoxy resin composition
06/14/2001WO2001042253A2 Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
06/14/2001WO2001042230A1 Process for the elimination of materials containing hydrolyzable halides and other high molecular weight materials from epihalohydrin derived epoxy resins
06/14/2001US20010003771 Cured polyepoxides or epoxidized novolaks containing 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide group; high elastic modulus, and decomposition temperature, use in printed circuit and semiconductor encapsulant applications
06/14/2001US20010003759 A photocurable resin consists of an acid modified vinyl group containing epoxy resin, an elastomer, a photopolymerization initiator, a diluent and a curing agent, can give high performance cured film
06/13/2001EP1106639A1 Photocurable composition containing iodonium salt compound
06/13/2001EP1105431A2 Heat curable epoxy compositions
06/13/2001DE10063066A1 Iodoniumsalze als latente Säurespender Iodonium salts as latent acid donors
06/13/2001CN1067096C Structural adhesive composition having high temp. resistance
06/12/2001US6245836 Lubricating coating compound, sliding structure combining two sliding members in which lubricating coating compound is applied to one of the sliding members, and slide bearing apparatus using the same
06/12/2001US6245835 Polymeric amines and reactive epoxy polymer compositions
06/12/2001US6245828 Dental adhesive
06/12/2001US6245827 Ultraviolet curable resin compositions having enhanced shadow cure properties
06/07/2001WO2001040865A1 Non-aromatic chromophores for use in polymer anti-reflective coatings
06/07/2001WO2001040396A2 Urethane modified epoxy adhesive composition
06/07/2001WO2001040368A1 Formaldehyde free 1,3,5-triazine carbamate crosslinkers and curable compositions containing same
06/06/2001EP1104792A1 Rosin-modified epoxy acrylates
06/06/2001CN1298424A Polymer composite and a method for its preparation
06/06/2001CN1298377A Preparation of polyindanebisphenols and polymers derived therefrom
06/06/2001CN1297960A Epoxy resin composition and semi-solidified sheet and multilayer printed circuit board produced therewith
06/06/2001CN1066705C Process for purification of bisphenol
06/05/2001US6242513 Method of applying a die attach adhesive
06/05/2001US6242110 Epoxy resin composition and semiconductor device using the same
06/05/2001US6242083 Shapes; epoxy resin and rubber blends
05/2001
05/31/2001WO2001038446A1 Rosin-modified epoxy acrylates
05/31/2001WO2001037991A1 Metal salts of phosphoric acid esters as cross linking catalysts
05/31/2001US20010002413 Polymerizable composition
05/31/2001DE19956779A1 Vinylester mit hoher Vernetzungsdichte Verfahren zu ihrer Herstellung und Verwendung Vinyl esters having a high crosslinking density to processes for their preparation and use
05/30/2001EP1103586A2 Coating powders for heat-sensitive substrates
05/30/2001EP1103575A1 Epoxy resin composition, prepreg and multilayer printed-wiring board
05/30/2001EP1103540A1 Vinylesters having high cross-linking density, process for their preparation and their use
05/30/2001EP1102803A1 Hardener for epoxy resins
05/30/2001EP1102802A1 Hardener for epoxide resins
05/30/2001EP1102801A1 Method for producing vinyl compounds
05/30/2001CN1297461A Curable composition and cured article thereof
05/30/2001CN1297168A Light image-forming composition contg. light polymerizable adhesive oligomer
05/30/2001CN1296994A Resin for moulding and method for making resin mould
05/30/2001CN1066466C Modified epoxy resin and cathodic electrodeposition paints contg. same
05/30/2001CN1066465C Modified epoxy resins having blocked isocyanate moiety and cationic group and their use in cathodic electrodeposition paints
05/30/2001CN1066464C Process for preparing allyl ether, thioether and amine compounds
05/29/2001US6239248 Phenol-novolacs with improved optical properties
05/29/2001US6239232 Polyetherimide or polysulphone with polyepoxide partially reacted with aromatic polyamine
05/29/2001US6239189 Combining curable oligomer from alkoxylated polyol, unsaturated carboxylic acid and polycarboxylic acid and acrylate of diepoxide in the presence of a polyamide based on polymerized fatty acid.
05/29/2001CA2204609C Planar structure made of renewable materials
05/29/2001CA2053439C Epoxy resin blend for resin transfer molding and filament winding
05/25/2001WO2001036514A1 Continuous process for the production of polyether polyols
05/25/2001CA2391862A1 Continuous process for the production of polyether polyols
05/24/2001US20010001793 A flame retardant comprising hexabromocyclodecane and atleast one halogenated epoxy resin selected from halogenated bisphenolic epoxy resin halogenated phenol or cresol novolac, halogenated resorcinol epoxy hvaing 150-800 epoxy equivalent
05/23/2001EP1101783A2 Casting resin and process for the fabrication of resin molds
05/23/2001EP1100836A1 Radiation-hardening and/or heat-hardening substances and preparations
05/23/2001EP1100833A1 High powered radiation and/or thermal hardening coating powder with a functionalized base structure
05/23/2001EP1100661A1 Rotary trowel for use in the molding of ceramics and method for production thereof
05/23/2001EP0789720B1 Stable, low cure-temperature semi-structural pressure sensitive adhesive
05/23/2001CN1296578A Liquid, radiation-curable composition, especially for stereolithography
05/23/2001CN1296577A Liquid, radiation-curable composition, especially for producing fiexible cured articles by stereolithography
05/23/2001CN1296504A Low viscosity compositions of epoxy functions polyester resins
05/23/2001CN1296047A Solidifiable compositions
05/22/2001US6235931 Partial oxidation of polyoxyalkylene polyol compositions to polycarboxylic acid compositions
05/22/2001US6235870 Dehydrohalogenation of poly (phenylhalo-b-hydroxypropyl ether) to form polyepoxide
05/22/2001US6235865 Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition