Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
05/2001
05/22/2001US6235850 Epoxy/acrylic terpolymer self-fixturing adhesive
05/22/2001US6235846 Anhydride-functional addition polymer, epoxy compound and polyhydroxy compound
05/22/2001US6235811 Containing isophoronediamine hardener for epoxy resin; stability
05/22/2001US6235808 Radiation-curable cycloaliphatic epoxy compounds, uses thereof, and compositions containing them
05/22/2001US6235807 Curing process for cationically photocurable formulations
05/22/2001US6235358 Coating layers of epoxy resins and photocationic curing cataltst with cationic sulfur esters, sensitizers of thioxanthones and titanium dioxide pigments
05/22/2001CA2326462A1 Casting resin and process for the fabrication of resin molds
05/17/2001WO2001034676A1 Resin composition containing aromatic episulfide and optical material
05/17/2001WO2001034675A1 Glycidylester compositions and a process for their manufacture
05/16/2001EP1099730A1 Curable composition
05/16/2001EP1099542A1 Plastic-coated metal plate
05/16/2001EP1099138A1 Stereolithographic compositions for preparing polyethylene-like articles
05/16/2001CN1295455A Photopolymerizable dental compositions
05/16/2001CN1065893C Thermosetting powder coating systems
05/16/2001CN1065892C Method for electrophoretic coating by pigment formula
05/15/2001US6232426 Blend containing a thiol, compound, latent curing agent and borate eater
05/15/2001US6232411 Hydrogenated diglycidyl ethers of bipheny-4,4′-diol
05/15/2001US6232399 Flame retardant
05/15/2001US6232362 Photopolymers
05/15/2001US6232361 Derived by combining cycloaliphatic epoxy compound with water compatible epoxides or oxetanes, and water; useful in ink jet, gravure and flexographic printing
05/15/2001US6231959 Prepreg of epoxy resin, hardener, and organodialkyurea promotor
05/15/2001US6231800 Charging a curable epoxy resin containing epoxy resin,curing agent,curing metal mold,accelerator,inorganic filler;curing,injection molding in epoxy resin
05/10/2001WO2001032797A1 Pressure sensitive adhesive tape and silicone-free release coating used therein
05/10/2001WO2001032755A1 Storage-stable prepregs on the basis of duroplastic, oleochemical matrices
05/10/2001WO2001032740A1 Acid functional and epoxy functional polyester resins
05/10/2001WO2001032738A1 Poly(hydroxy ester ethers) as barrier resins
05/10/2001CA2389539A1 Storage-stable prepregs on the basis of duroplastic, oleochemical matrices
05/10/2001CA2325271A1 Curable composition
05/09/2001EP1097959A1 High relative-permittivity B-staged sheet, high relative-permittivity prepreg, its production process, and printed wiring board comprising any one of these
05/09/2001CN1294616A Thermosetting resinous binder compsns. their prepn. and use as coating materials
05/09/2001CN1294605A Antireflection film and nonglara article
05/09/2001CN1294318A Optical imaging compsns, contg. flexible low polymer
05/09/2001CN1294142A Composite solidifying agent of epoxy resin and its preparing process
05/08/2001US6228942 Dehydration to esterify or amidate surface of oxidized or aminated carbon powder or fiber suspended in solution containing a monomer or polymer having amine, hydroxy, and/or viny ether groups
05/08/2001US6228921 Process for the production of compounds based on silanes containing epoxy groups
05/08/2001US6228907 Polymerizing epoxy resins using amine curing agents
05/08/2001US6228474 Epoxy resin composition for a fiber-reinforced composite material, yarn prepreg, and process and apparatus for preparing the same
05/08/2001CA2036420C Nonionic surfactant as a pigment dispersant and film build additive
05/03/2001WO2001030930A1 Anti-adherent silicone/adhesive complex with stabilising additive in silicone
05/03/2001WO2001030881A1 Process for glycidation of carboxylic acids
05/03/2001WO2001030496A1 Multicomponent ion exchange resins
05/03/2001WO2001030495A1 Ion exchange resins and methods of making the same
05/03/2001CA2389015A1 Anti-adherent silicone/adhesive complex with stabilising additive in silicone
05/02/2001EP1095313A1 Photopolymerizable thermosetting resin compositions
05/02/2001EP1095089A1 Hardener for epoxy resins
05/02/2001EP1095088A1 Self-dispersing hardenable epoxy resins
05/02/2001EP1095087A1 Self-dispersing hardenable epoxy resins
05/02/2001EP1095086A1 Heat-curable can-coating lacquer
05/02/2001EP0888281B1 Reactive liquid crystal compounds
05/02/2001CN1293685A Curing agent for epoxy resin, epoxy resin composition, and process for producing silane-modified phenolic resin
05/02/2001CN1293218A Epoxy resin composition, adhesive film and preimpregnatel blank and multilayer printing circuit board
05/02/2001CN1065259C Epoxy resin molding material for sealing electronic parts and sealed semiconductor device using the same
05/01/2001US6225439 For optical materials, such as plastic lenses, prisms, substrates of information recording materials and filters
05/01/2001US6225418 Thermosetting resin composition
05/01/2001US6225417 One-pack type epoxy resin composition
05/01/2001US6225378 Triazine hardener and epoxy composition containing the same
05/01/2001US6225377 Producing latently reactive prepolymer epoxy resin mixture powder
05/01/2001US6225376 Reacting polyoxyalkylenediamine or polyamine with amine, polyepoxide, polyoxyalkylene diglycidyl ether, polyhydroxy hydrocarbon, and advancement catalyst to produce epoxy terminated reaction product, and emulsifying in water
05/01/2001US6225373 Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin
05/01/2001US6224710 Curing epoxy resin in contact with hot melt adhesive using cycloaliphatic amine and polyamide amine curing agents
04/2001
04/26/2001WO2001029109A1 Hardener for epoxy resin and epoxy resin composition
04/26/2001US20010000518 Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof
04/25/2001EP1094365A1 Photoimageable composition containing flexible oligomer
04/25/2001EP1094364A1 Photoimageable composition having photopolymerizeable binder oligomer
04/25/2001EP1094087A1 Epoxy resin composition, epoxy resin composition for fiber-reinforced composite, and fiber-reinforced composite containing the same
04/25/2001EP1093538A1 Polycationic polymers, their production and use
04/25/2001EP0809682B1 Polymeric film
04/25/2001CN1292401A Resin composition for sealing semiconductor, and semiconductor using it and manufacturing method
04/25/2001CN1064983C Silicone rubber/epoxy resin integral composite and method for making
04/25/2001CN1064976C Process for making solid epoxy resin
04/24/2001US6222054 Method for producing epoxy resin
04/24/2001US6221972 Sulfonium group containing epoxy resin
04/24/2001US6221536 Material exhibiting compensation for polymerization-induced shrinkage and recording medium formed therefrom
04/24/2001US6221510 Blend of epoxy resin, hardener, coupler and release agent
04/24/2001US6221497 Coating a substrate with blend of resin and silicone release agent
04/24/2001CA2055833C Preparation of unsaturated epoxy ester resin and carboxylated unsaturated epoxy ester resin and photosensitive composition comprising the same
04/19/2001WO2001027184A2 Method of preparation of a curing agent for epoxy compositions, the curing agent for epoxy compositions and the epoxy composition
04/19/2001WO2001027183A1 Preparation of acrylic compounds containing resins with vinyl functionality
04/18/2001EP1092740A1 Ultraviolet curable resin compositions having enhanced shadow cure properties
04/18/2001EP1092739A1 Epoxy resin composition and uses thereof
04/18/2001EP1091992A1 Resin system
04/18/2001EP1091926A1 Phenalkylamine derivatives, their use as curing agents in epoxy resin compositions and curable epoxy resin compositions containing them
04/18/2001EP0679165B1 Substituted resorcinol-based epoxy resins
04/18/2001CN1292008A Water dispersible curing agents for epoxy resin
04/17/2001US6218578 Polymeric film
04/17/2001US6218483 Powder coating of epoxy resin, imidazole-epoxy resin catalyst or polyamine, polyamine powder and amine scavenger
04/17/2001US6218482 Epoxy resin, process for preparing the resin and photo-curable resin composition and resin composition for powder coatings containing the epoxy resin
04/17/2001US6218481 Acetylide-form propargyl-containing epoxy resin composition for cationic electrocoating
04/17/2001US6218480 Both cyclocarbonate and epoxy groups are used to combine with the different diamine molecules by making use of the different reactivities of aliphatic, cycloaliphatic, and aromatic amine groups.
04/17/2001US6217955 Reflective polarizer for generation circular polarized light
04/17/2001CA2004131C A high performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism
04/12/2001WO2001025347A1 Coating with optical taggent
04/12/2001WO2001025319A1 Adhesive primer for polyamide materials
04/12/2001WO2001025314A1 Self-dispersible epoxide/surfactant coating compositions
04/11/2001EP1090965A2 Rust preventive composition and method of preventing zinc or zinc alloys from rusting
04/11/2001EP1090960A1 Two-pack type curable composition and hardener therefor
04/11/2001EP1090942A1 Resin composition for semiconductor encapsulation, semiconductor device comprising the same and process for the production of semiconductor device using the same
04/11/2001EP1090813A1 Expandable sealant composition containing a grafted olefinic polymer
04/11/2001EP1090057A1 Reworkable thermosetting resin compositions
04/11/2001EP0646138B1 Randomly epoxidized small star polymers