Patents
Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662)
03/2014
03/26/2014CN103681294A Lamination ceramic substrate breaking method
03/26/2014CN103676770A Wire bow monitoring system for a wire saw
03/26/2014CN103660054A Mortar-saving efficiency-retaining mortar control device of square cutting machine
03/26/2014CN103660053A Forming saw wire capable of stretching downward-pulling residual stress on surface
03/26/2014CN103660052A Numerical-control wire cutting machine
03/26/2014CN103660051A Diamond line for cutting crisp rigid material including crystalline silicon and cutting system thereof
03/26/2014CN103660050A Silicon wafer multi-wire cutting machine diamond wire cutting liquid system
03/26/2014CN103660049A Cutting device
03/26/2014CN103660048A Knife flywheel retaining tool and knife flywheel retaining tool unit
03/26/2014CN103660044A Combined tool with cooling structure
03/26/2014CN103658976A Laser processing device
03/26/2014CN102167924B Coating for a microelectronic device, treatment structure comprising same, and method of managing a thermal profile of a microelectronic die
03/20/2014WO2014021606A3 Method and apparatus for processing edge of glass by using high-frequency induction heater
03/20/2014US20140080288 Laser processing method
03/20/2014US20140076299 Multi-step cutting process
03/20/2014CA2790467A1 Shape memory alloy mounting collet with grooved gemstone
03/19/2014EP2708355A1 Laminate, method for cutting laminate, method for processing laminate, and device and method for cutting brittle plate-like object
03/19/2014EP2708342A1 Wire bow monitoring system for a wire saw
03/19/2014CN203485322U Tray assembly for squarer and squarer with same
03/19/2014CN203485319U Guide pulley device preventing outer sleeve from disengaging
03/19/2014CN203485318U Crystal holder of squaring machine
03/19/2014CN203485317U Metal wire used for dissociated abrasive cutting and manufacturing device thereof
03/19/2014CN203485316U Master roll of silicon wafer slicer
03/19/2014CN103650304A Device for producing field-pole magnet and method for producing same
03/19/2014CN103648739A Method and device for producing edge cutouts in sheet glass
03/19/2014CN103647005A Pattern-segmented sapphire substrate used for AlGaInN material system film growth
03/19/2014CN103640098A Transfer cylinder and wire saw machine with same
03/19/2014CN103640097A Diamond-wire slicing method for sapphire sheets
03/19/2014CN103640096A Machining method for sapphire slices
03/19/2014CN102496602B Chip cutting method
03/18/2014US8673745 Method of cutting object to be processed
03/13/2014WO2014036714A1 A shaped sawing wire with subsurface tensile residual stresses
03/13/2014WO2014017878A3 Scribing wheel having fine structure groove
03/12/2014EP2704886A1 Method for fixing a single-crystal workpiece to be treated on a processing device
03/12/2014CN203481196U Splitting tool for silicon chip
03/12/2014CN203471980U Jewel cutting assisting device and horizontal rotation mechanism thereof
03/12/2014CN203471979U Swing mechanism of jewel cutting assisting device
03/12/2014CN203471978U Slurry regeneration device
03/12/2014CN203471977U Break line connecting jig for jigsaw
03/12/2014CN203471976U Slurry regeneration device
03/12/2014CN203471061U Metal wire with different structures and manufacturing device thereof
03/12/2014CN103624887A Preparation device for diamond wire
03/12/2014CN103624886A Solar silicon wafer cutting steel wire
03/12/2014CN103624885A Modification method of main roller of slicing machine in order to increase cutting rod length
03/12/2014CN103118839B Wire saw
03/12/2014CN102329075B 分断装置 Cutting device
03/12/2014CN102264659B Method and device for cutting brittle-material plate, and window glass for vehicle
03/12/2014CN102166792B Diamond fret saw and manufacture method thereof
03/12/2014CN102079113B Equipment and method for solving squaring quality problem of silicon ingot
03/12/2014CN101882578B Integral solid laser lift-off and cutting equipment
03/06/2014WO2014035481A1 Group iii nitride wafer and its production method
03/06/2014WO2014034841A1 Method for cutting high-hardness material by multi-wire saw
03/06/2014WO2014034805A1 Bonded substrate and method for manufacturing same
03/05/2014CN203460333U Mortar spraying nozzle device used for multi-wire sawing machine
03/05/2014CN203460332U Polycrystalline ingot cutting and fixing device
03/05/2014CN203460331U Polycrystalline ingot cubing device
03/05/2014CN103612341A Diamond cutting line
03/05/2014CN103612340A Method for secondary application of take-up pay-off spindle device in NTC442 slicers
03/05/2014CN103612339A CsI crystal cutting machine
03/05/2014CN103612338A Machining method
03/05/2014CN102225593B Diamond wire saw device
03/04/2014CA2569376C Method and apparatus for cleaving brittle materials
02/2014
02/27/2014WO2014029671A1 Method of cutting super-hard materials using an electron beam and a range of beam scanning velocities
02/27/2014US20140054589 Bismuth-doped semi-insulating group iii nitride wafer and its production method
02/27/2014US20140053382 Methods and apparatus for separating a substrate
02/26/2014CN203449485U Silicon block squarer calibration device
02/26/2014CN203449484U Wire winding tool
02/26/2014CN103600428A Bamboo joint metal wire
02/26/2014CN103600427A Multi-wire saw for cutting high-hardness materials
02/26/2014CN103600426A Numerically controlled diamond wire saw slicing machine
02/26/2014CN102501165B Processing method of gem with 102 cutting surfaces
02/20/2014DE102006015142B4 Vorrichtung zum Brechen von Halbleiterscheiben A device for breaking semiconductor wafers
02/19/2014CN103597585A Water-soluble cutting fluid for fixed abrasive grain wire saw, cutting method using same, and recycling method therefor
02/19/2014CN103588389A Glass plate scratching method and scratching apparatus
02/19/2014CN103586989A Scroll saw cutting machine coated with dissociating abrasives
02/19/2014CN103586988A Scroll saw cutting machine
02/19/2014CN103586987A Temperature control shaft roller
02/19/2014CN103586986A Ultra-precise three-axis association micro-milling device with micro-tool monitoring capacity
02/19/2014CN103586985A Method and system for processing fragile material
02/19/2014CN102254863B Breaking apparatus and breaking method for substrate made of brittle materials
02/19/2014CN102130238B Method for cutting sapphire substrate LED chip
02/13/2014DE102004053329B4 Bearbeitungsvorrichtung unter Verwendung eines Laserstrahls Machining apparatus using a laser beam
02/12/2014CN203427203U Slicing machine wire bow and wire breaking double-function detection system
02/12/2014CN203427202U Silicon wafer collecting device for wire cutting machine
02/12/2014CN203427201U Wireless operating handle of slicing machine
02/12/2014CN103579411A Method for manufacturing improved solar silicon wafer and solar silicon wafer
02/12/2014CN103579410A Scribing apparatus and scribing method
02/12/2014CN103579105A Package substrate processing method
02/12/2014CN103568142A Aluminum alloy wire leading-in end device for multi-wire sawing machine
02/12/2014CN103568141A Large-diameter ultra-long highly-pure silicon crystal cutting method and device
02/12/2014CN103568140A Multi-station drilling machine
02/12/2014CN103568139A Semiconductor chip dicing method
02/12/2014CN102152421B Device and method for preparing linear cutting steel wires for solar silicon wafers
02/12/2014CN102107463B Method for cutting wafers
02/12/2014CN101772398B Laser working method, laser working apparatus, and its manufacturing method
02/06/2014WO2014021606A2 Method and apparatus for processing edge of glass by using high-frequency induction heater
02/05/2014EP2692441A2 Apparatus and method for comminuting a polycrystalline silicon rod
02/05/2014CN203418659U Orienting cutting and fixing device for sapphire crystal
02/05/2014CN203418658U Crystal orienting device
02/05/2014CN203418657U Sapphire crystalline column machining clamp
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