Patents
Sitemap › B28 - Working cement, clay, or stone › B28D - Working stone or stone-like materials › B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662)
04/2014
04/30/2014CN103753720A Method for manufacturing resin diamond line by non-plating diamond
04/30/2014CN103753719A Combined wire saw
04/30/2014CN103753718A Multi-wire sawing machine
04/30/2014CN103753717A Cutting table mechanism for noncircular crystalline lenses
04/30/2014CN103753716A Diamond fretsaw device for cutting single crystal silicon rod
04/30/2014CN103753715A Processing method for reusing unqualified chamfered silicon briquette
04/30/2014CN102693941B Wafer cutting process
04/30/2014CN102225598B Solar silicon wafer wire cutting guide roller and manufacturing method and special film coating machine and electroplating machine
04/24/2014WO2014061053A1 Wire saw apparatus, and cut-machining method
04/23/2014CN203557560U Tool for cutting coordinate inserts
04/23/2014CN203557559U Slurry flow guide rod mechanism for wire sawing machine for solar silicon wafers
04/23/2014CN203557558U Multi-station drilling machine
04/23/2014CN203557557U Ultramicroscopic drill bit
04/23/2014CN203557556U Ultramicroscopic drill bit
04/23/2014CN203557555U Ultramicroscopic drill bit
04/23/2014CN203557554U Ultramicroscopic drill bit
04/23/2014CN203557553U Ultramicroscopic drill bit
04/23/2014CN203557552U Ultramicroscopic drill bit
04/23/2014CN203557551U Ultramicroscopic drill bit
04/23/2014CN203557550U Ultramicroscopic drill bit
04/23/2014CN203556925U Microbit
04/23/2014CN203556924U Microbit
04/23/2014CN203556923U Microbit
04/23/2014CN103737731A Liquid accumulating box guide wheel mechanism for diamond cutting line production
04/23/2014CN103737730A Magnet positioning mechanism for diamond cutting line production equipment
04/23/2014CN102642254B Crystal face directional detection bonding table
04/16/2014CN203542882U Wireless control automatic mortar metering device
04/16/2014CN203542881U Fretsaw cutting machine coated with dissociating abrasive
04/16/2014CN203542880U Fretsaw cutting machine
04/16/2014CN203542879U Silicon wafer cutting device
04/16/2014CN203542878U Guide wheel structure used for cutting silicon wafer
04/16/2014CN203542877U Diamond multi-wire cutting routing system
04/16/2014CN203542876U Metal wire for multi-line cutting and manufacturing device of metal wire
04/16/2014CN203542875U Silicon rod adhesion positioning device
04/16/2014CN203542874U Solar silicon wafer processing device
04/16/2014CN103732332A Methods and systems for removing contamination from a wire of a saw
04/16/2014CN103728989A Adjustment method and device for central position of rotating shaft of wafer scriber and wafer scriber
04/16/2014CN103722628A Novel guiding wheel for silicon wafer cutting
04/16/2014CN103722627A Edge trimmer for multiple pieces of crystalline silicon
04/16/2014CN103722626A Silicon wafer cutting steel wire
04/16/2014CN103722625A Method and equipment for cutting large-diameter silicon carbide single crystals by aid of diamond wires
04/16/2014CN103722624A Diamond wire cutting process for squaring machine
04/16/2014CN103722623A Jig for cracking of brittle material base board and cracking method
04/16/2014CN102300688B Substrate breaking apparatus
04/16/2014CN102268616B Cutting steel wire modified by amorphous alloy
04/16/2014CN102248610B Zirconium-based amorphous alloy modified cutting steel wire
04/16/2014CN101531035B A method for manufacturing electroplating diamond wire saw
04/09/2014CN203530494U Ingot silicon rod with process protective end
04/09/2014CN203527678U Silicon rotating device, silicon feeding device and silicon wafer cutting device
04/09/2014CN203527675U Locating frame for slicing machine
04/09/2014CN203527674U Crystal swinging device on single-wire cutting machine
04/09/2014CN203527673U Silicon block slicer
04/09/2014CN203527672U Cutting slurry guiding device and silicon ingot cutting device
04/09/2014CN203527671U Silicon ingot cutting device
04/09/2014CN203527670U Polycrystalline silicon cutting device
04/09/2014CN203527669U Monocrystal silicon slicer with heat dissipation device
04/09/2014CN203527668U Monocrystal silicon slicer
04/09/2014CN103710705A Additive for acidic texturing liquid of polycrystalline silicon wafers and application thereof
04/09/2014CN103707428A Monitoring device of silicon wafer collection equipment
04/09/2014CN103707427A Novel silicon wafer collecting device
04/09/2014CN103707426A Silicon wafer cutting machine
04/09/2014CN103707425A Multi-linear magnet cutting machine
04/09/2014CN103707424A Cutting coordinate insertion sheet tool
04/09/2014CN103707423A Magnet boring machine tool
04/09/2014CN102544240B Method and device for integrating slicing and flocking of crystalline silicon wafer
04/09/2014CN102097371B Substrate dividing device
04/09/2014CN102046346B Method for chamfering brittle material substrate
04/03/2014WO2014052445A1 Method for dicing a substrate with back metal
04/03/2014WO2014052296A1 Method for creating atomically sharp edges on objects made of crystal material
04/03/2014US20140090592 Continuous sapphire growth
04/02/2014CN203510499U Device for adjusting crystal orientation deviation degree of silicon rod
04/02/2014CN203510497U Steel wire coil feeding device
04/02/2014CN203510496U Silicon material cutting device
04/02/2014CN203510495U Guide wheel device used for solar silicon rod butting
04/02/2014CN203510494U Multi-tooth cutter for machining LED surface strengthening light-emitting structure
04/02/2014CN203510493U Auxiliary tool discharging broken line connecting joints of cutting steel wire for silicon block
04/02/2014CN103692567A Sawtooth-shaped cutting steel wire with flat section
04/02/2014CN103692566A Threaded metal wire
04/02/2014CN103692565A Special steel wire guide wheel for cutting ultrathin polycrystalline silicon chips
04/02/2014CN103692564A Method for reducing cutting thickness of solar polycrystalline silicon chip
04/02/2014CN103692563A Polycrystalline silicon chip cutting method capable of saving steel wire
04/02/2014CN103692562A Super-thin diamond saw blade and manufacturing process thereof
04/02/2014CN103692561A Surface microdefect fast search and micro-milling repair device for large-diameter KDP crystal elements
04/02/2014CN101596720B Substrate-cutting system
04/01/2014US8685838 Laser beam machining method
03/2014
03/27/2014WO2014045108A1 Method of making wafers
03/27/2014WO2014045106A1 Wafer cutting system
03/27/2014US20140087209 Method of growing group iii nitride crystals
03/27/2014US20140083407 Wafer sawing system
03/27/2014US20140083353 Plane orientation of crystalline structures
03/27/2014US20140083270 Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces
03/26/2014EP2711979A1 Wafer cutting system
03/26/2014EP2711978A1 Method of making wafers
03/26/2014EP2711151A1 Method of making wafers
03/26/2014CN203496143U Multi-line cutting guide wheel with customized groove shapes
03/26/2014CN103687823A Glass substrate cutting device, glass substrate cutting method, and glass substrate manufacturing method
03/26/2014CN103687697A Method for resuming operation of wire saw and wire saw
03/26/2014CN103681492A Machining method
03/26/2014CN103681491A Processing method
03/26/2014CN103681295A Lamination ceramic substrate breaking method and groove processing tool
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