| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/10/2011 | EP2354629A1 LED lamp for wide area lighting |
| 08/10/2011 | EP2353348A2 Method and kit for manufacturing metal nanoparticles and metal-containing nanostructured composite materials |
| 08/10/2011 | EP2353187A2 Solar cell and method of manufacturing the same |
| 08/10/2011 | EP2352428A2 Diagnostic device with display module and leveraged component connections background |
| 08/10/2011 | EP1849548B1 Baffle device, hot air blower for solder treatment, and nozzle for the same |
| 08/10/2011 | EP1681321B1 Inkjet ink composition |
| 08/10/2011 | EP1200968B1 Aqueous carbon composition and method for coating a non conductive substrate |
| 08/10/2011 | EP1193755B1 Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them |
| 08/10/2011 | CN201928530U 电路软板组配装置 Soft circuit board group with device |
| 08/10/2011 | CN201928529U 印刷红胶装置 Printing red plastic device |
| 08/10/2011 | CN201928528U 一种pcb选择性波峰焊接设备 One kind pcb selective wave soldering equipment |
| 08/10/2011 | CN201928527U 具过滤件的贴片机定位吸嘴夹持器及过滤件加工治具 A filter element placement machine positioning nozzle holder and filter parts processing fixture |
| 08/10/2011 | CN201928526U 插件机用扣板机构 Plug-machine pinch agency |
| 08/10/2011 | CN201928525U 一种提拉式挡门 One kind of pull-up door |
| 08/10/2011 | CN201928524U 用于电路板盲捞加工转换成型加工的制程设备的成型治具 Circuit boards for molding jig fishing blind processing and conversion of molding process equipment |
| 08/10/2011 | CN201928523U 线路板贴膜设备 PCB film equipment |
| 08/10/2011 | CN201928522U 软性电路板线路结构 Flexible circuit board wiring structure |
| 08/10/2011 | CN201928521U 采用两面带胶的绝缘层粘附扁平导线制作的双面线路板 Using both sides with a rubber insulating layer adhered flat sided circuit board conductors made |
| 08/10/2011 | CN201928520U 用绝缘层和阻焊层粘附的并置扁平导线制作的双面线路板 Insulating layer and the solder layer adhesion juxtaposed flat wire making double-sided circuit boards |
| 08/10/2011 | CN201928519U 用热固胶膜粘附并置扁平导线制作的双面线路板 With a thermosetting film adhesion and set the flat wire making double-sided circuit boards |
| 08/10/2011 | CN201928518U 采用间接粘附或吸附并置扁平导线制作的双面线路板 Indirect adhesion or adsorption juxtaposed flat wire making double-sided circuit boards |
| 08/10/2011 | CN201928517U 一种带凹坑的电路板 A circuit board with pits |
| 08/10/2011 | CN201928516U 带有蚀刻凹坑的电路板 Circuit board with etch pits |
| 08/10/2011 | CN201928507U 一种双面电路板 A double-sided circuit boards |
| 08/10/2011 | CN201928506U 一种带导通孔的陶瓷基刚挠结合多层电路板 A ceramic substrate vias with rigid-flex multilayer circuit board |
| 08/10/2011 | CN201924097U 电镀装置 Plating apparatus |
| 08/10/2011 | CN201924078U 蚀刻液自动添加装置 Etching solution automatically add devices |
| 08/10/2011 | CN201923696U 双列单传动的卷对卷连续水平式生产设备 Double row single drive continuous roll-to-roll production equipment horizontal |
| 08/10/2011 | CN201922613U 印制电路板用熔胶机 Printed circuit boards melt glue machine |
| 08/10/2011 | CN201922432U Pcb首件存储柜 Pcb first pieces of storage cabinets |
| 08/10/2011 | CN201922145U 一种用于台式回流焊机上的散热风扇 A cooling fan on a desktop reflow machine |
| 08/10/2011 | CN201922144U 助焊剂自动化喷雾系统 Flux automated spray systems |
| 08/10/2011 | CN1753601B Method for mfg. part with printed circuit |
| 08/10/2011 | CN102150482A Wiring board with built-in electronic component and method for manufacturing the wiring board |
| 08/10/2011 | CN102150481A Multilayer flexible printed wiring board and electronic device |
| 08/10/2011 | CN102150480A Halo-hydrocarbon polymer coating |
| 08/10/2011 | CN102150246A Through electrode substrate, method for manufacturing the through electrode substrate, and semiconductor device using the through electrode substrate |
| 08/10/2011 | CN102149255A Forming method of multiple-lead through hole |
| 08/10/2011 | CN102149254A Manufacture method of flexible and rigid composite circuit board |
| 08/10/2011 | CN102149253A Method for making PCB (Printed Circuit Board) by laminating high-frequency materials and common FR4 materials in one step |
| 08/10/2011 | CN102149252A Preparation method for aluminum-base copper-clad plate |
| 08/10/2011 | CN102149251A Flex-rigid wiring board and method for manufacturing the same |
| 08/10/2011 | CN102146558A Pretreatment liquid for electroless plating |
| 08/10/2011 | CN102145566A Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film |
| 08/10/2011 | CN101784158B Circuit board with heat dissipation structures and method for manufacturing same |
| 08/10/2011 | CN101707854B Circuit board processing method and circuit board |
| 08/10/2011 | CN101697660B Method for processing stepped groove bottom patterned circuit board |
| 08/10/2011 | CN101686599B Circuit structure of circuit board and manufacture method thereof |
| 08/10/2011 | CN101635489B Technology for producing commutator plate of rigid double-face vibration motor |
| 08/10/2011 | CN101616551B Circuit board and process thereof |
| 08/10/2011 | CN101520607B Double-faced exposure architecture and double-faced exposure method of printed circuit board |
| 08/10/2011 | CN101454114B Bonding material, electronic component, bonding structure and electronic device |
| 08/10/2011 | CN101093916B Resin molded parts equipped with metal plate and moulding method therefor |
| 08/09/2011 | US7995353 Circuit board and electronic device using the same |
| 08/09/2011 | US7995352 Printed circuit board |
| 08/09/2011 | US7994709 OLED device employing a metal thin-film connected to a high-current cable |
| 08/09/2011 | US7994636 Flip chip interconnection structure |
| 08/09/2011 | US7994433 Printed wiring board and method for producing the same |
| 08/09/2011 | US7994345 Process for the purification of thiophenes |
| 08/09/2011 | US7993979 Leadless package system having external contacts |
| 08/09/2011 | US7993510 plating solutions comprising a mixture of copper sulfate, sulfuric acid, chlorine ions and adjuvants comprising a leveling agent and a brighteners, capable of forming the upper face of via-hole and conductor circuit in the same layer in approximately the same plane at the time of manufacturing circuits |
| 08/09/2011 | US7993509 Manufacturing method of double-sided wiring glass substrate |
| 08/09/2011 | US7993486 Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces |
| 08/09/2011 | US7992968 Fluid ejection device with overlapping firing chamber and drive FET |
| 08/09/2011 | US7992958 Method for the printing of homogeneous electronic material with a multi-ejector print head |
| 08/09/2011 | US7992294 Method of manufacturing an interconnect device which forms a heat sink and electrical connections between a heat generating device and a power source |
| 08/09/2011 | US7992293 Method of manufacturing a patterned conductive layer |
| 08/09/2011 | US7992292 Method for manufacturing a touch panel |
| 08/09/2011 | US7992291 Method of manufacturing a circuit board |
| 08/09/2011 | US7992290 Method of making a flexible printed circuit board |
| 08/04/2011 | WO2011094303A2 hBN INSULATOR LAYERS AND ASSOCIATED METHODS |
| 08/04/2011 | WO2011093713A2 Assembly, component for an assembly and method of manufacturing an assembly |
| 08/04/2011 | WO2011093712A1 Tile, assembly of tiles with a carrier, method of manufacturing an assembly |
| 08/04/2011 | WO2011093515A1 Method for forming patterned conductive film |
| 08/04/2011 | WO2011093448A1 Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board |
| 08/04/2011 | WO2011093437A1 Screen stretch frame |
| 08/04/2011 | WO2011093427A1 Method for manufacturing a laminate with one metal-plated side |
| 08/04/2011 | WO2011093162A1 Conductive connection sheet, method for connecting terminals, method for forming connection terminal, semiconductor device, and electronic device |
| 08/04/2011 | WO2011093068A1 Method for producing substrate with built-in components, and substrate with built-in components |
| 08/04/2011 | WO2011093023A1 Plating method and electrolytic plating device |
| 08/04/2011 | WO2011093019A1 Method of manufacturing circuit board with metal base, and circuit board with metal base |
| 08/04/2011 | WO2011092809A1 Ultrasonic bonding method and ultrasonic bonding device |
| 08/04/2011 | WO2011056977A3 Multi-layer circuit member and assembly therefor |
| 08/04/2011 | US20110189868 Differential pair inversion for reduction of crosstalk in a backplane system |
| 08/04/2011 | US20110189848 Method to form solder deposits on substrates |
| 08/04/2011 | US20110188214 Method for connection of flexible circuit boards to rigid circuit board, device for connection thereof, printed circuit board assembly, and electronic apparatus |
| 08/04/2011 | US20110188110 Microelectromechanical device with restoring electrode |
| 08/04/2011 | US20110187673 Capacitive touch sensor and fabrication method thereof and capacitive touch panel |
| 08/04/2011 | US20110187666 Touch-sensing panel including electrode-integrated window, and manufacturing method thereof |
| 08/04/2011 | US20110187396 Quiescent current (iddq) indication and testing apparatus and methods |
| 08/04/2011 | US20110186542 Slurry containing multi-oxidizer and mixed nano-abrasives for tungsten cmp |
| 08/04/2011 | US20110186342 Single-layered printed circuit board and manufacturing method thereof |
| 08/04/2011 | US20110186338 Polymeric positive temperature coefficient liquid composition |
| 08/04/2011 | US20110186336 Substrate for mounting element and process for its production |
| 08/04/2011 | US20110186335 Circuit board with heat dissipating structure and manufacturing method thereof |
| 08/04/2011 | US20110186333 Printed Compatible Designs and Layout Schemes for Printed Electronics |
| 08/04/2011 | US20110185812 Method for fixing a component in a casing and assembly hereof |
| 08/04/2011 | US20110185566 Method for forming pattern and a wired board |
| 08/04/2011 | DE102010001573A1 Device for bending and holding area of semiflex printed circuit board utilized as multiflex printed circuit board in electronic device, has closure part whose transverse web is designed such that web exhibits predetermined rolling radius |
| 08/04/2011 | DE102010001505A1 Bonding wire protecting device, has bonding sites provided on circuitry carrier e.g. circuit board, and plug connector, where bend protection units are provided on regions of bonding wire |