| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/22/2011 | CN201878429U Manual exposure machine for high-density interconnection circuit board technology |
| 06/22/2011 | CN201878428U Vacuumizing device |
| 06/22/2011 | CN201878427U Hand-operated printing machine for printing circuit board with ultra-high specifications |
| 06/22/2011 | CN201878425U Printed circuit board (PCB) bare board capable of being provided with surface mounted parts and PCB provided with surface mounted parts |
| 06/22/2011 | CN201873755U System for etching printed circuit board (PCB) |
| 06/22/2011 | CN201873754U Plating through hole thin board basket |
| 06/22/2011 | CN201871846U Anti-oxidation structure of crest tin soldering machine |
| 06/22/2011 | CN201871838U Wave-crest soldering machine |
| 06/22/2011 | CN1765161B Rigid-flex wiring board |
| 06/22/2011 | CN1589980B Cleaning sheet, carrying member with a cleaning function and method of cleaning substrate processing equipment |
| 06/22/2011 | CN102106200A Sealing frame and method for covering a component |
| 06/22/2011 | CN102106198A Semiconductor device and method for manufacturing same |
| 06/22/2011 | CN102106197A Flex-rigid wiring board and method for manufacturing the same |
| 06/22/2011 | CN102106196A Capacitively coupled connector for flexible printed circuit applications |
| 06/22/2011 | CN102106195A Electroless copper plating method, printed wiring board, method for manufacturing printed wiring board and semiconductor device |
| 06/22/2011 | CN102105024A Soft pin support jig |
| 06/22/2011 | CN102105023A Printed circuit board (PCB) support cushion block jig |
| 06/22/2011 | CN102105022A Manufacturing method of nail bed for PCB solder-mask printing |
| 06/22/2011 | CN102105021A Bearing fixture |
| 06/22/2011 | CN102105020A Making method for printed-circuit boards and palladium removing device for printed-circuit boards |
| 06/22/2011 | CN102103027A Novel platinum film resistance test clip |
| 06/22/2011 | CN102101215A Laser machining device with laser beam analyzer |
| 06/22/2011 | CN101686606B Circuit board |
| 06/22/2011 | CN101617575B Flexible multilayer wiring board |
| 06/22/2011 | CN101605427B One-way separation type extensible interconnection mother board |
| 06/22/2011 | CN101582384B Semiconductor through-electrode forming method |
| 06/22/2011 | CN101513141B Manufacturing method of soldered circuit board |
| 06/22/2011 | CN101498002B Surface-treating method for metal, treated metal surface and printed wiring substrate |
| 06/22/2011 | CN101436548B Method for making non-core layer multi-layer encapsulation substrate |
| 06/22/2011 | CN101436547B Method of manufacturing high radiation package substrate |
| 06/22/2011 | CN101410973B Wafer-level chip scale package and method for fabricating and using the same |
| 06/22/2011 | CN101370659B Multilayer imageable element containing sulfonamido resin |
| 06/22/2011 | CN101346042B Rolled copper foil |
| 06/22/2011 | CN101312620B Manufacturing process for metal circuit of multi-layer substrate and construction thereof |
| 06/22/2011 | CN101262738B Printed circuit boards |
| 06/22/2011 | CN101257770B Manufacturing method for embedding heat radiating fin on printed circuit board |
| 06/21/2011 | US7966206 Environmental compliance certification |
| 06/21/2011 | US7964950 Electronic parts packaging structure and method of manufacturing the same |
| 06/21/2011 | US7964336 Metal or metal compound pattern and forming method of pattern, and electron emitting device, electron source, and image-forming apparatus using the pattern |
| 06/21/2011 | US7964289 Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
| 06/21/2011 | US7964237 Fluid flow of electroconductive paste onto sheet; positioning punch exterior to bore; contactors surface with paste; retraction of punch to clean |
| 06/21/2011 | US7964085 Electrochemical removal of tantalum-containing materials |
| 06/21/2011 | US7963646 Ink-jet inks containing metal nanoparticles |
| 06/21/2011 | US7963628 Method for the printing of homogeneous electronic material with a multi-ejector print head |
| 06/21/2011 | US7963030 Multilayer printed circuit board and method for manufacturing same |
| 06/21/2011 | US7963029 Holding/convey jig and holding/convey method |
| 06/16/2011 | WO2011071111A1 Resin substrate with built-in electronic component and electronic circuit module |
| 06/16/2011 | WO2011071041A1 Reflow furnace |
| 06/16/2011 | WO2011071005A1 Solder paste |
| 06/16/2011 | WO2011070015A2 Circuit module and method for producing such a circuit module |
| 06/16/2011 | WO2011069485A1 Relief plug-in connector and multilayer circuit board |
| 06/16/2011 | WO2011025229A3 Conductive metal ink composition and method for forming a conductive pattern |
| 06/16/2011 | WO2011025228A3 Conductive metal ink composition and method for forming a conductive pattern |
| 06/16/2011 | WO2011013922A9 Surface treating agent composition, method for preparing same, copper foil for a printed circuit board, and flexible copper clad laminate |
| 06/16/2011 | US20110144471 Flexible probe structure and method for fabricating the same |
| 06/16/2011 | US20110143021 Conformal coating system and method |
| 06/16/2011 | US20110141711 Electronic component embedded printed circuit board and method of manufacturing the same |
| 06/16/2011 | US20110141699 Apparatus and method for attaching selected components to a printed circuit board |
| 06/16/2011 | US20110141681 External storage device and method of manufacturing external storage device |
| 06/16/2011 | US20110141546 Tunable nanowire resonant cavity for optical modulation |
| 06/16/2011 | US20110140590 Light emitting device and manufacturing method therefor |
| 06/16/2011 | US20110139500 Electrical connecting method and electrically connected connection structure |
| 06/16/2011 | US20110139498 Printed wiring board and method for manufacturing the same |
| 06/16/2011 | US20110138622 Drill and method of producing printed wiring board |
| 06/16/2011 | US20110138621 Carrier for manufacturing substrate and method of manufacturing substrate using the same |
| 06/16/2011 | US20110138620 Method for manufacturing an electronic assembly |
| 06/16/2011 | US20110138619 Methods for Constructing Millimeter-Wave Laminate Structures and Chip Interfaces |
| 06/16/2011 | US20110138618 Thin-type keycap structure, keypad structure including the same, and method of making the same |
| 06/16/2011 | US20110138617 Thin multi-chip flex module |
| 06/16/2011 | US20110138616 Printed circuit board manufacturing system |
| 06/16/2011 | US20110138615 Carrier for manufacturing printed circuit board and method of manufacturing the same and method of manufacturing printed circuit board using the same |
| 06/16/2011 | DE19900599B4 Wellenlötverfahren und dazu verwendete Anlage Wave soldering and used for this plant |
| 06/16/2011 | DE112009001448T5 Verfahren zum Herstellen eines Keramikformkörpers A method of manufacturing a ceramic formed body |
| 06/16/2011 | DE102010011747A1 Träger für die Herstellung eines Substrats und Verfahren zur Herstellung eines Substrats unter Verwendung dieses Trägers Carriers for the production of a substrate and methods for producing a substrate using this carrier |
| 06/16/2011 | DE102009059042A1 Verfahren und Vorrichtung zur Übertragung von Drucksubstanz von einem Drucksubstanzträger auf ein Substrat Method and apparatus for transmitting print substance from a printing substance carrier onto a substrate |
| 06/16/2011 | DE102009055857A1 Verfahren zum Kontaktieren einer Leiterplatte mit einem Flachbandkabel und Leiterplatte Method of contacting a circuit board with a ribbon cable and PCB |
| 06/16/2011 | DE102009054511A1 Verfahren zum Kontaktieren einer Leuchtvorrichtung, Werkzeug zum Durchführen des Verfahrens und Anschlusselement zum Aufsatz auf eine Leuchtvorrichtung Method of contacting a lighting device, tool for carrying out the method and connection member for attachment to a lighting device |
| 06/16/2011 | DE10136078B4 Wässrige Lösung zum kontinuierlichen Mikroätzen von Kupfer oder Kupferlegierung Aqueous solution for continuously microetching of copper or copper alloy |
| 06/16/2011 | DE10044077B4 Drucktastenanordnung Push-button assembly |
| 06/16/2011 | DE10019888B4 Transparente elektronische Bauelementanordnung und Verfahren zu ihrer Herstellung Transparent electronic component assembly and process for their preparation |
| 06/16/2011 | CA2782482A1 Relief plug-in connector and multilayer circuit board |
| 06/16/2011 | CA2781956A1 Solder paste |
| 06/15/2011 | EP2334159A1 Coupling modules of an electronic device |
| 06/15/2011 | EP2334158A1 Bridge coupling of modules in an electronic device |
| 06/15/2011 | EP2334156A1 Flexible cable and methods of manufacturing same |
| 06/15/2011 | EP2333787A1 Conductive paste and method for manufacturing multilayer printed wiring board using the same |
| 06/15/2011 | EP2333015A2 Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition |
| 06/15/2011 | EP2332396A1 Housing for an electrical circuit |
| 06/15/2011 | EP2331733A2 Device and method for electroplating substrates in process chambers |
| 06/15/2011 | EP2331727A2 Metal nanowire thin-films |
| 06/15/2011 | EP1793658B1 Wiring board and wiring board module |
| 06/15/2011 | EP1715996B1 Hot pressing ceramic distortion control |
| 06/15/2011 | EP1634342B1 Method of fabricating electronic interconnect devices using direct imaging of dielectric material |
| 06/15/2011 | EP1477048B1 Method for embedding a component in a base |
| 06/15/2011 | EP0840676B2 Adhesiveless flexible laminate and process for making adhesiveless flexible laminate |
| 06/15/2011 | CN201869450U Tin furnace carrier |
| 06/15/2011 | CN201869449U Device for tin wetting of pins of electronic components |
| 06/15/2011 | CN201869448U Modified rotary table and welding device of hot press |
| 06/15/2011 | CN201869447U PCB (Printed Circuit Board) plug-in platform |
| 06/15/2011 | CN201869446U Spray nozzle structure |