| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/15/2011 | WO2011111318A1 Module |
| 09/15/2011 | WO2011111314A1 Wiring substrate, electronic device, and noise shielding method |
| 09/15/2011 | WO2011111313A1 Electronic device, wiring substrate, and noise shielding method |
| 09/15/2011 | WO2011111312A1 Structure and wiring substrate |
| 09/15/2011 | WO2011111311A1 Structure, wiring substrate, and wiring substrate manufacturing method |
| 09/15/2011 | WO2011111297A1 Structure, wiring substrate, and method for producing wiring substrate |
| 09/15/2011 | WO2011111291A1 Frame unit, mounting board unit, and method for manufacturing the mounting board unit |
| 09/15/2011 | WO2011111029A1 Method for the treatment of a metal contact formed on a substrate |
| 09/15/2011 | WO2011110795A2 Screen printing |
| 09/15/2011 | WO2011109896A1 Circuit board with anchored underfill |
| 09/15/2011 | WO2011053093A3 Printing plate for liquid crystal display and manufacturing method thereof, method for printing using same, and method for manufacturing replication master mold and printing plate using same |
| 09/15/2011 | US20110222815 Optical transmission module, electronic device, and method for manufacturing optical transmission module |
| 09/15/2011 | US20110222282 Illumination device comprising two printed circuit boards |
| 09/15/2011 | US20110222256 Circuit board with anchored underfill |
| 09/15/2011 | US20110222228 Electronic card containing a display window and method for manufacturing an electronic card containing a display window |
| 09/15/2011 | US20110221535 Surface mount crystal oscillator and manufacturing method of the same |
| 09/15/2011 | US20110221455 Micromechanical component and method for its production |
| 09/15/2011 | US20110220610 Flexible substrate with electronic devices and traces |
| 09/15/2011 | US20110220474 Electronic communication device and method |
| 09/15/2011 | US20110220405 Method for manufacturing multilayer printed wiring board and multilayer printed wiring board |
| 09/15/2011 | US20110220404 Wiring substrate and method of manufacturing the same |
| 09/15/2011 | US20110220402 Multi-layer semiconductor element package structure with surge protection function and method for manufacturing the same |
| 09/15/2011 | US20110220397 Electronic component and method of manufacturing the same |
| 09/15/2011 | US20110220396 Wiring substrate and manufacturing method thereof |
| 09/15/2011 | US20110219967 Printing screens, frames therefor and printing screen units |
| 09/15/2011 | US20110219593 Pattern forming method, pattern forming apparatus, piezoelectric vibrator, method of manufacturing piezoelectric vibrator, oscillator, electronic apparatus, and radio-controlled timepiec |
| 09/14/2011 | EP2365743A2 Interconnection structure including blind via holes intended for being metallised |
| 09/14/2011 | EP2365742A1 Electrode portion structure |
| 09/14/2011 | EP2365741A1 Method for metallizing blind vias |
| 09/14/2011 | EP2364225A1 Vertically separated pass through conveyor system and method in surface mount technology process equipment |
| 09/14/2011 | EP2231803B1 Conductive adhesive precursor, method of using the same, and article |
| 09/14/2011 | EP2095698B1 Method for the production of vias and conductor tracks |
| 09/14/2011 | EP2046103B1 Flexible printed board, electronic device equipped with it, and flexible printed board folding method |
| 09/14/2011 | EP2022590B1 Wave soldering tank |
| 09/14/2011 | EP1621054B1 A method for processing a thin film substrate |
| 09/14/2011 | EP1597947B1 Method for manufacturing an electronic module |
| 09/14/2011 | EP1562755B1 Method for producing a partially metallised film-type element |
| 09/14/2011 | EP1276799B1 Flame retardant epoxy molding compositions |
| 09/14/2011 | CN201976356U 用于印刷线路板塞孔的治具 For printed circuit board plug hole jig |
| 09/14/2011 | CN201976355U 印刷线路板的塞孔垫板 Printed circuit board plug hole plate |
| 09/14/2011 | CN201976354U 印刷电路板波峰、回流焊硬质托盘 PCB peaks reflow rigid tray |
| 09/14/2011 | CN201976353U 一种印刷电路板pcb和基板组合 A printed circuit board and the substrate composition pcb |
| 09/14/2011 | CN201976352U 一种棕化方盒水刀装置 One kind of box-brown water jet device |
| 09/14/2011 | CN201976351U 印刷线路芯板的棕化收板放置装置 Brown of the core printed circuit board received a placement device |
| 09/14/2011 | CN201976350U 适用于修复电路的施体基板总成 Applicable to fix the circuit board assembly, the donor |
| 09/14/2011 | CN201976349U 一种pcb封装结构 One kind pcb package structure |
| 09/14/2011 | CN201974630U 一种印制线路板的内层曝光用胶片 One kind of inner layer printed circuit board exposure film |
| 09/14/2011 | CN201971915U 可节约成本的用于印刷线路板电厚金生产的挂具 Linked to a cost savings for the printed circuit board electrical thick gold production |
| 09/14/2011 | CN201971913U 一种柔性板沉铜用固定装置 A flexible board sink with copper fixtures |
| 09/14/2011 | CN201969977U 波峰焊接装置 Wave soldering equipment |
| 09/14/2011 | CN1959954B Film pattern forming method, device, electro-optical apparatus, and electronic appliance |
| 09/14/2011 | CN1941339B Semiconductor IC-embedded substrate and method for manufacturing same |
| 09/14/2011 | CN1917994B Process for producing synthetic resin film having molecular orientation controlled in MD direction |
| 09/14/2011 | CN1898555B Substrate inspection device |
| 09/14/2011 | CN1842254B Double-sided wiring board fabrication method and double-sided wiring board |
| 09/14/2011 | CN1767921B Phase change lead-free super plastic solders and welding method therefor |
| 09/14/2011 | CN102187749A Method to form solder deposits on substrates |
| 09/14/2011 | CN102187748A Apparatus for adhering anisotropic conductive film |
| 09/14/2011 | CN102187747A Polymeric conductive donor and transfer method |
| 09/14/2011 | CN102187445A Apparatus for adhering adhesive tape, and pressure bonding apparatus |
| 09/14/2011 | CN102186324A Interposer frame assembly for mating a circuit board with an interposer assembly |
| 09/14/2011 | CN102186316A Method for manufacturing any-layer printed circuit board |
| 09/14/2011 | CN102186315A Manufacturing process of soft-type printed circuit board with different appearances at upper and lower layers |
| 09/14/2011 | CN102186314A Novel LED (light emitting diode) light strip circuit board and manufacturing method thereof |
| 09/14/2011 | CN102186313A SMT (Surface Mounted Technology) circuit board quality monitoring method |
| 09/14/2011 | CN102186312A Through-hole reflow soldering method and formwork for printing circuit board |
| 09/14/2011 | CN102186311A Circuit board and processing method thereof |
| 09/14/2011 | CN102186310A Locating method and device |
| 09/14/2011 | CN102186309A Laser direct imaging full printing circuit |
| 09/14/2011 | CN102186308A Fabricating method for micro-slice and vacuuming device for fabricating micro-slice |
| 09/14/2011 | CN102186307A Optical inspection during PCB production process |
| 09/14/2011 | CN102186306A Metal base circuit board and manufacturing method thereof |
| 09/14/2011 | CN102186305A Printed wiring board, multilayer printed wiring board and manufacturing method thereof |
| 09/14/2011 | CN102186304A Layered FPC (flexible printed circuit) used for flip/slider phone and manufacturing method |
| 09/14/2011 | CN102184049A Glue-overflow-preventing stitching structure and method for flexible circuit board for touch screen |
| 09/14/2011 | CN101873764B Production method of special circuit board assembly for automobile taillight |
| 09/14/2011 | CN101699932B Method for producing high thermal conductivity ceramic circuit board |
| 09/14/2011 | CN101662885B Method for performing gold backing on printed circuit board of Ku waveband microstrip type switch circuit |
| 09/14/2011 | CN101636035B Fault detection of a printed dot-pattern bitmap |
| 09/14/2011 | CN101617574B Capacitively coupling layers of a multilayer device |
| 09/14/2011 | CN101613875B Electroplating correction system of circuit board and method |
| 09/14/2011 | CN101584259B Multilayer body, method for producing substrate, substrate and semiconductor device |
| 09/14/2011 | CN101546740B Embedded printed circuit board and manufacturing method thereof |
| 09/14/2011 | CN101393394B Photo-cured and heat-cured resin composition and pcondensate thereof |
| 09/14/2011 | CN101361182B Interposer with built-in passive part |
| 09/14/2011 | CN101351083B Line board and technique |
| 09/14/2011 | CN101339935B Connection structure between printed circuit board and electronic component |
| 09/13/2011 | US8018046 Printed wiring board with notched conductive traces |
| 09/13/2011 | US8018045 Printed circuit board |
| 09/13/2011 | US8017255 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function, and method of manufacturing the same |
| 09/13/2011 | US8016399 Printing machine |
| 09/13/2011 | US8015703 Method of manufacturing a wired circuit board |
| 09/13/2011 | US8015702 Metal substrate having electronic devices formed thereon |
| 09/13/2011 | US8015701 Method of manufacturing a flexible printed circuit assembly |
| 09/13/2011 | US8015700 Method of fabricating wiring board and method of fabricating semiconductor device |
| 09/13/2011 | CA2586855C Multi-functional structural circuits |
| 09/13/2011 | CA2507663C Method for soldering miniaturized components to a baseplate |
| 09/09/2011 | WO2011109396A1 Automated twist pin assembling machine and method for interconnecting stacked circuit boards in a module |
| 09/09/2011 | WO2011108388A1 Method for manufacturing a metallized ceramic substrate |
| 09/09/2011 | WO2011108308A1 Wiring board with built-in semiconductor element |