Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2011
08/17/2011CN201937969U 用于印刷线路板挂镀上板的新型防错装置 For printed circuit boards hanging on the board of the new plating error protection device
08/17/2011CN201937968U 可提高质量的半固化片预排台新型装置 Can improve the quality of the prepreg walkthrough new type device
08/17/2011CN201937967U 可提高效率的线路板孔金属化后养板槽 Can improve the efficiency of the circuit board holes after metallization raising board slot
08/17/2011CN201937966U 一种提高效率和质量的返工放置架 A way to improve the efficiency and quality of rework Storage Racks
08/17/2011CN201937965U 用于印刷线路板烤板的抽屉架 Grilling plate for the printed circuit board rack drawer
08/17/2011CN201937964U 具有防错作用的印刷线路板生产模具 Printed circuit board production molds with anti-wrong action
08/17/2011CN201937963U 一种铝基板预贴合装置 One kind of aluminum plate pre-bonding device
08/17/2011CN201937962U 印刷线路板的夹板工具 Printed circuit board plywood tool
08/17/2011CN201937961U 超薄板显影磨板辅助装置 Developing thin plate mill plate auxiliary device
08/17/2011CN201937960U 实验室pcb快速制作的装置 Pcb rapid production of laboratory equipment
08/17/2011CN201937959U 一种线路板字符印刷的检查装置 A circuit board inspection apparatus printing characters
08/17/2011CN201933182U 可提高效率的印刷线路板电镀用新型夹具 Can improve the efficiency of the new printed circuit board plating jig
08/17/2011CN201933181U 用于提高印刷线路板沉金生产效率的挂具 Linked to a printed circuit board immersion gold used to improve production efficiency
08/17/2011CN201933180U 可节约成本的pcb沉金生产用倾斜挂板装置 Cost savings immersion gold pcb production means siding with tilt
08/17/2011CN1989274B Electrolytically recoverable etching solution
08/17/2011CN1977574B Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device and electronic device using multilayer wiring board
08/17/2011CN1963665B Film peeling off device
08/17/2011CN1765160B Method for electrically and mechanically connecting two printed boards
08/17/2011CN102160472A Modulating polarization voltage of amperometric sensors
08/17/2011CN102160240A Terminal mounting structure and method
08/17/2011CN102160237A Electric component, structure for mounting the electric component, and method for mounting the electric component
08/17/2011CN102159061A Electronic component manufacturing method and electronic component manufactured by using same
08/17/2011CN102159041A Method for once pressure-forming of inner and outer layers of multi-layer flexible circuit board
08/17/2011CN102159040A Method for drilling hole on four-layered circuit board
08/17/2011CN102159039A Printed circuit board copper-coating method and copper-coated printed circuit board
08/17/2011CN102159038A Plug-in board head of fully-automatic terminal plug-in board machine
08/17/2011CN102159037A Core burying method for high-current magnetic device and printed circuit board manufacturing method
08/17/2011CN102159036A Improvement in rigid double-layer printed circuit board process flow
08/17/2011CN102159035A Printed circuit board and method for manufacturing the same
08/17/2011CN102159034A Method for making printed circuit board (PCB)
08/17/2011CN102159033A Method for making flared hole on circuit board
08/17/2011CN102159032A Process for manufacturing flexible printed circuit board by adopting die cutting machine
08/17/2011CN102159031A Method for making super-long microwave high-frequency circuit board
08/17/2011CN102159030A Making method of high-frequency ultrathin circuit board
08/17/2011CN102159029A Method for making high-frequency aluminium-based circuit board
08/17/2011CN102159028A Manufacturing method of flexible printed circuit board for manufacturing bank card patterns
08/17/2011CN102159027A Method for manufacturing high frequency microwave printed circuit boards with Rogers ceramic wafer laminated copper foils
08/17/2011CN102159026A Flex-rigid wiring board and method for manufacturing the same
08/17/2011CN102159025A 电子组件及其制造方法 Electronic components and its manufacturing method
08/17/2011CN102159024A Aluminum base printed circuit board and preparation method thereof
08/17/2011CN102159021A Flex-rigid wiring board and method for manufacturing the same
08/17/2011CN102159020A Counterpoint structure of circuit board and manufacturing method thereof
08/17/2011CN102158051A Power supply device and manufacturing method of printed circuit board winding
08/17/2011CN102157499A Hybrid integrated circuit module based on low temperature co-fired ceramic technology and manufacturing method thereof
08/17/2011CN102154669A Method for plating thick soft gold by utilizing plating thin golden cylinder
08/17/2011CN102153964A Adhesive composition, circuit connecting material and connecting structure of circuit member
08/17/2011CN102153957A Adhesive film, and connection structure and connecting method for circuit member
08/17/2011CN102151935A Pushing rod of wire welding machine
08/17/2011CN102151928A Device for thermal connecting of components on substrate, automatic assembly machine and method
08/17/2011CN101888740B Convex metal printed circuit board and manufacturing method thereof
08/17/2011CN101808499B Temporary storage system and access device thereof
08/17/2011CN101778543B Multi-layer printed circuit board machining process
08/17/2011CN101772275B Method for fixing magnetic core in PCB (Printed Circuit Board) taphole
08/17/2011CN101720168B Method for routing vacant sites for prepregs of circuit board
08/17/2011CN101695219B Selective immersion process of PCB
08/17/2011CN101690434B Method for manufacturing substrate having built-in components
08/17/2011CN101683008B Composite multilayer wiring board
08/17/2011CN101640971B Circuit board and manufacturing method thereof
08/17/2011CN101601129B Mounting board and electronic device
08/17/2011CN101541142B Surface disposed copper foil and circuit foundation plate
08/17/2011CN101410755B Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, and method for producing printed wiring board
08/17/2011CN101306490B Laser drilling method for metal foil
08/17/2011CN101281872B Wiring substrate and wiring substrate manufacturing method
08/17/2011CN101137680B Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit
08/17/2011CN101058344B Method of manufacturing electronic and electric product of plane displaying device and band-shaped package used for the same
08/17/2011CN101045360B Silk-screen printing device
08/16/2011US7999387 Semiconductor element connected to printed circuit board
08/16/2011US7999194 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
08/16/2011US7998553 Copper-clad laminate
08/16/2011US7998331 Method for electrochemical fabrication
08/16/2011US7998305 Anisotropic; semiconductors
08/16/2011US7997680 Method for the printing of homogeneous electronic material with a multi-ejector print head
08/16/2011US7996988 Method of making a plurality of calibration-adjusted sensors
08/16/2011US7996987 Single footprint family of integrated power modules
08/16/2011US7996969 Method for adjusting capacitance value of built-in capacitor in multilayer ceramic substrate, and method for manufacturing a multilayer ceramic substrate
08/11/2011WO2011096695A2 Process for creating an inspection program
08/11/2011WO2011096539A1 Wiring board and manufacturing method for same
08/11/2011WO2011096385A1 Layered structure and light-sensitive dry film used in same
08/11/2011WO2011096384A1 Layered structure and light-sensitive dry film used in same
08/11/2011WO2011096295A1 Thermosetting composition
08/11/2011WO2011096293A1 Method of manufacturing multi-layered printed circuit board
08/11/2011WO2011096206A1 Photocurable resin composition, dry film, cured article, and printed wiring board
08/11/2011WO2011096110A1 Wiring circuit board and method for manufacturing same
08/11/2011WO2002039794A9 System and method for fabricating printed circuit boards
08/11/2011US20110194265 Embedded Component Substrate and Manufacturing Methods Thereof
08/11/2011US20110194260 Semiconductor package module having self-assembled insulation thin film and method of manufacturing the semiconductor package module
08/11/2011US20110193792 Methods and apparatus for a touch panel display with integrated keys
08/11/2011US20110193672 Magnetic element and method for manufacturing the same
08/11/2011US20110193671 Electronic component and manufacturing method of the same
08/11/2011US20110193649 Integrated circulators sharing a continuous circuit
08/11/2011US20110192641 Mounting board and method of manufacture
08/11/2011US20110192638 Silver immersion plated printed circuit board
08/11/2011US20110192637 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
08/11/2011DE19711350B4 Lötflussmittel Soldering flux
08/11/2011DE102011003715A1 Verfahren zum Bereitstellen einer Solarzellenelektrode durch stromloses Abscheiden und ein darin verwendeter Aktivator A method of providing a solar cell electrode by electroless plating and an activator used therein
08/11/2011DE102011003713A1 Lösung zum stromlosen Abscheiden zum Bereitstellen einer Solarzellenelektrode Solution for the electroless deposition to provide a solar cell electrode
08/11/2011DE102010007006A1 Method for soldering components comprising conductor plate and surface mount device-components, involves providing conductor plate that has pad areas for contacting components
08/10/2011EP2355634A1 Method for connection of flexible circuit boards to rigid circuit board, device for connection thereof, printed circuit board assembly, and electronic apparatus
08/10/2011EP2355633A1 Surface mountable electromagnetic or electronic device
08/10/2011EP2355144A1 Component placement on flexible and/or stretchable substrates