Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2011
06/08/2011EP2328692A2 Metal and electronic device coating process for marine use and other environments
06/08/2011EP1453988B1 Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
06/08/2011CN201860518U Jack device of circuit board
06/08/2011CN201860517U Circuit board tin soldering fixing device
06/08/2011CN201860516U Tool soaking container
06/08/2011CN201860515U Two-sided LED circuit board component for welding, connecting and conducting
06/08/2011CN201860509U Semi-finished PCB (printed circuit board)
06/08/2011CN201860508U Electrical appliance component welded structure
06/08/2011CN201856016U Automatic power amplifier welding equipment
06/08/2011CN1930683B Conductive material compositions, apparatus, systems, and methods
06/08/2011CN1898434B Electric interface for water-bearing household devices
06/08/2011CN1575103B Filling equipment and method for filling fluidized material
06/08/2011CN102090159A Flex-rigid wiring board and electronic device
06/08/2011CN102090158A Wiring board and method for manufacturing the same
06/08/2011CN102090157A Device for the heat treatment of workpieces
06/08/2011CN102090156A Electronic assembly and method for the production thereof
06/08/2011CN102089832A Conductive particle, anisotropic conductive film, joined body, and connecting method
06/08/2011CN102089398A Anisotropic conductive adhesive
06/08/2011CN102088825A Multilayered circuit board, method for manufacturing the same, and electronic apparatus
06/08/2011CN102088824A Method and system for repairing miniature passive element on printed circuit board (PCB)
06/08/2011CN102088823A Printed wiring board and method for producing the same
06/08/2011CN102088822A PCB (printed circuit board) substrate with welding spot self-protection function and manufacturing process of pad of PCB substrate
06/08/2011CN102088819A Novel electronic circuit substrate and manufacturing process thereof
06/08/2011CN102086516A Solution for inhibiting palladium activity including halogenic acid and method for preventing defect of plating using thereof
06/08/2011CN102086365A Adhesive, preparation method and application in integrated circuit board embedment thereof
06/08/2011CN101790278B Full photophobic copper-clad laminate and preparation method thereof
06/08/2011CN101698260B Full-automatic ball attachment machine
06/08/2011CN101674721B Miniature array electromagnet mounting assembly
06/08/2011CN101668390B Production technology of PCB (Printed Circuit Board) solder mask
06/08/2011CN101652022B Positioning structure of photosensitive element
06/08/2011CN101631451B Substrate transfer system and transfer method
06/08/2011CN101594753B Printed wiring board
06/08/2011CN101583237B Multi-layer printed wiring board, electronic device and manufacture method thereof
06/08/2011CN101472394B Contraposition device
06/08/2011CN101442885B Method for preparing circuit board guide hole
06/08/2011CN101370617B 钻孔装置 Drilling equipment
06/08/2011CN101018478B Device possessing guide device and guiding and conveying components at a component mounting machine
06/07/2011US7955906 Methods and systems for thermal-based laser processing a multi-material device
06/07/2011US7955905 Methods and systems for thermal-based laser processing a multi-material device
06/07/2011US7955697 Adhesive bond and method for the production thereof
06/07/2011US7955689 Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof
06/07/2011US7955487 Device; two conveying paths parallel to each other, an assembly between the conveyors of a first rotatable contacting electrode and a second rotatable contacting electrode; electrolytically treating electrically conductive structures that are electrically insulated against each other on the surfaces
06/07/2011US7955090 Optical transceiver, connector, substrate unit, optical transmitter, optical receiver, and semiconductor device
06/07/2011US7954233 Method for component mounting
06/07/2011CA2481301C Photocurable compositions containing reactive particles
06/07/2011CA2354753C Formation of an embedded capacitor plane using a thin dielectric
06/03/2011WO2011066128A1 Bondable printed wiring with improved wear resistance
06/03/2011WO2011066055A2 Formation of electrically conductive pattern by surface energy modification
06/03/2011WO2011065788A2 Printed circuit board and method of manufacturing the same
06/03/2011WO2011065757A2 Printed circuit board and manufacturing method thereof
06/03/2011WO2011065568A1 Insulating resin, composition for forming insulating resin layer, laminate, method for producing surface metal film material, method for producing metal pattern material, method for producing wiring board, electronic part and semiconductor device
06/03/2011WO2011065396A1 Conductive paste, printed circuit board, and manufacturing method thereof
06/03/2011WO2011065271A1 Conductive substrate and process for producing same
06/03/2011WO2011065228A1 Curable composition, cured material therefrom, and use thereof
06/03/2011WO2011065115A1 Thermosetting white ink composition with excellent color fastness, and thermoset product thereof
06/03/2011WO2011065093A1 Electronic component mounting structure and method for producing same
06/03/2011WO2011065062A1 Flexible circuit board and manufacturing method thereof
06/03/2011WO2011064105A1 Method for contacting a printed circuit board with a ribbon cable and printed circuit board
06/03/2011WO2011063933A1 Metal-contacted substrate and method for the production thereof
06/03/2011WO2011063886A1 Method for producing a plastically deformed plastics body, arrangement and electrical device
06/03/2011WO2011063778A1 Method for applying carbon/tin mixtures to metal or alloy layers
06/03/2011WO2008099940A9 Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device
06/02/2011US20110129615 Apparatuses and Methods for Maskless Mesoscale Material Deposition
06/02/2011US20110128712 Compact media player
06/02/2011US20110128709 Display array substrate and method of manufacturing display substrate
06/02/2011US20110128608 Electro-phoretic display device and fabricating method thereof
06/02/2011US20110128260 Stacked Display With A Bended Substrate, An Electronic Apparatus And A Method For Manufacturing The Same
06/02/2011US20110128114 Touch panel and method of manufacturing the same
06/02/2011US20110128033 Connection structure of electronic component and wired circuit board, wired circuit board assembly, and method for testing electronic component
06/02/2011US20110127878 Micro movable device and method for manufacturing micro movable device
06/02/2011US20110127562 Electronic Substrate Having Low Current Leakage and High Thermal Conductivity and Associated Methods
06/02/2011US20110127153 illuminatable switch
06/02/2011US20110127080 Electronic Assemblies without Solder and Methods for their Manufacture
06/02/2011US20110127077 Block copolymerized polyimide ink composition for printing
06/02/2011US20110127076 Electronic component-embedded printed circuit board and method of manufacturing the same
06/02/2011US20110127075 Interlayer insulating film, wiring structure, and methods of manufacturing the same
06/02/2011US20110127073 Printed circuit board and manufacturing method thereof
06/02/2011US20110127070 Embedded printed circuit board, multi-layer printed circuit board and manufacturing method thereof
06/02/2011US20110126409 Method of manufacturing printed circuit board
06/02/2011US20110126408 Method of making high density interposer and electronic package utilizing same
06/01/2011EP2328210A1 A protection circuit module for a secondary battery
06/01/2011EP2327284A1 Sensor device and method for manufacture
06/01/2011EP2327283A2 Halo-hydrocarbon polymer coating
06/01/2011EP2326751A1 Direct metallization process
06/01/2011EP2326746A2 Anchor group for monolayers of organic compounds on metal and component produced therewith by means of organic electronics
06/01/2011EP2326744A1 Metal compositions and methods of making same
06/01/2011EP2326457A1 Solder material comprising a reactive filler material, carrier element or component comprising said type of solder material and use of a fluxing agent
06/01/2011EP1676471B1 Electronic device and method of manufacturing thereof
06/01/2011EP1523869B1 Process for creating vias for circuit assemblies
06/01/2011EP1082765B2 Opto-electronic element
06/01/2011DE202011003311U1 Isolationskanalbelichter für eine Fräse zum Erzeugen von isolierten Leiterbahnen auf photosensiven Oberflächen von Leiterplatten Isolationskanalbelichter for a milling machine for producing insulated conductors on photosensiven surface of printed circuit boards
06/01/2011DE102010033870A1 Verfahren zur Herstellung eines keramischen Substrats A method for producing a ceramic substrate
06/01/2011DE102009055859A1 Verfahren zum Kontaktieren einer beidseitig mit elektrischen Kontakten versehenen Leiterplatte und solche Leiterplatte Method of contacting a both sides with electrical contacts PCB and PCB such
06/01/2011DE102009044690A1 Jet-type solder system useful as a beam solder application device that is provided with a jet nozzle, where a size of a soldered place of a workpiece to be soldered is changed related to a beam width
06/01/2011CN201854548U Board receiving sending suction machine
06/01/2011CN201854507U Synthetic production line for machining of PCB (printed circuit board) manual inserting piece and mounting sheet
06/01/2011CN201854502U Flexible circuit board with reinforcing structure
06/01/2011CN201854501U Circuit board
06/01/2011CN201854498U High utilization efficiency circuit board
06/01/2011CN201848621U Improved anti-oxidation sheath