Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2011
07/28/2011DE102008042772B4 Verfahren zum elektrischen Verbinden eines LED-Feldes und LED-Verbindungsvorrichtung A method for electrically connecting a LED array and LED connecting device
07/28/2011DE102004025659B4 Optoelektrisches Übertragungsmodul und Verfahren zu dessen Herstellung An opto-electrical transmission module and process for its preparation
07/28/2011CA2786882A1 Flip-chip mounting structure and flip-chip mounting method
07/28/2011CA2786855A1 Method for the application of a conformal nanocoating by means of a low pressure plasma process
07/27/2011EP2348525A1 Wiring forming method
07/27/2011EP2348514A1 Method for producing substrate having patterned conductive polymer film and substrate having patterned conductive polymer film
07/27/2011EP2347901A1 Printing screen unit
07/27/2011EP2347640A1 Polymeric conductive donor and transfer method
07/27/2011EP2347639A1 Illumination device comprising two printed circuit boards
07/27/2011EP2347442A1 Solid state drive or other storage apparatus that includes a plurality of encapsulated semiconductor chips
07/27/2011EP2346680A1 Lead solder-free electronics
07/27/2011EP1876873B1 Process for producing double-sided flexible printed board and double-sided flexible printed board
07/27/2011EP1470207B1 Aqueous stripping and cleaning composition
07/27/2011EP1339271B1 Substrate and production method therefor
07/27/2011CN201910974U Improved welding pin
07/27/2011CN201910973U Full-series LED (Light-Emitting Diode) circuit board made of flat leads
07/27/2011CN201909945U Film alignment fixture
07/27/2011CN201908150U Automatic control equipment and production line for electroplating PCB
07/27/2011CN1886032B Multilayered structure forming method
07/27/2011CN1657279B Treated copper foil and circuit board
07/27/2011CN102138371A Elastic-cushioned capacitively-coupled connector
07/27/2011CN102138370A Electric appliance disassembling method, and electric appliance disassembling device
07/27/2011CN102138369A Use of hybrid PCB materials in printed circuit boards
07/27/2011CN102138368A Printed wiring board and method of manufacturing printed wiring board
07/27/2011CN102138104A Photosensitive resin composition for protective film of printed wiring board for semiconductor package
07/27/2011CN102137953A Surface treating agent for copper or copper alloy and use thereof
07/27/2011CN102137551A Production method of high-frequency four-layer circuit board
07/27/2011CN102137550A Method for producing build-up substrate
07/27/2011CN102137549A Electronic component layout method of circuit board with adhesive surfaces on both sides
07/27/2011CN102137548A Method of forming circuit interconnection, circuit board, and circuit interconnection film having film thickness larger than width thereof
07/27/2011CN102137547A Manufacturing method of circuit structure of circuit board
07/27/2011CN102137546A Manufacturing method of circuit structure of circuit board
07/27/2011CN102137545A Manufacturing method for connecting sheet circuit board
07/27/2011CN102137543A Flex-rigid wiring board and method for manufacturing the same
07/27/2011CN102137542A Flexible substrate and manufacturing method thereof
07/27/2011CN102137541A Flex-rigid wiring board and method for manufacturing the same
07/27/2011CN102136309A Circuit connecting material, connection structure for circuit member using the same and production method thereof
07/27/2011CN102135735A Microelectronic cleaning and arc remover compositions
07/27/2011CN102134735A Carrying tool for printed circuit board (PCB)
07/27/2011CN102134469A hBN (Hexagonal Boron Nitride)containing insulating thermal grease
07/27/2011CN101873766B Method for manufacturing conductor track structure
07/27/2011CN101861054B Method for removing goldplated plug lead wires
07/27/2011CN101858871B PCB board detecting method
07/27/2011CN101695218B Method for manufacturing printed circuit board with half-edge hole
07/27/2011CN101695217B Method for producing printed board combining rigidness and flexibleness
07/27/2011CN101657074B Circuit board and manufacturing method of circuit board
07/27/2011CN101652019B Circuit board prefabricated product and circuit board assembling method
07/27/2011CN101631432B Flexible-rigid compound circuit board and method for manufacturing same
07/27/2011CN101631427B Method for plating thick gold layer in circuit board manufacturing process
07/27/2011CN101612686B Hidden central support system of reflow oven
07/27/2011CN101612506B Nitrogen filtering recovery system of reflow oven
07/27/2011CN101611490B Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device
07/27/2011CN101604675B Circuit board and method of manufacturing the same, and circuit device and method of manufacturing the same
07/27/2011CN101600290B Hollowed double-sided flexible printed circuit board
07/27/2011CN101597440B Printing ink, method using printing ink to manufacture electric conduction line and circuit board therewith
07/27/2011CN101547552B Printed circuit board
07/27/2011CN101473387B Multilayered ceramic electronic part
07/27/2011CN101426336B Method of manufacturing resistance-embedded printed wiring board
07/27/2011CN101290890B Circuit board with internally embedded conductive wire and manufacturing method therefor
07/27/2011CN101288152B Bonding apparatus
07/27/2011CN101276153B Exposure drawing device
07/27/2011CN101259576B Method for maintaining circuit board positioning device of stencil printer
07/27/2011CN101233795B Multilayered circuit board and electronic equipment
07/27/2011CN101156214B Conductive paste composition, and printed wiring board
07/27/2011CN101117043B 丝网印刷装置 Screen printing apparatus
07/26/2011US7985942 Method of providing consistent quality of target material removal by lasers having different output performance characteristics
07/26/2011US7985930 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
07/26/2011US7985299 Solvent compositions containing chlorofloroolefins or fluoroolefins
07/26/2011US7985081 Transferable micro spring structure
07/26/2011US7985078 Electrode junction structure and manufacturing method thereof
07/21/2011WO2011088366A1 Passive coupler between package substrate and system board
07/21/2011WO2011088310A1 Contact pin holder
07/21/2011WO2011087362A1 Apparatus and method for treating a substance at a substrate
07/21/2011WO2011086972A1 Electronic circuit, method for forming same, and copper clad laminate for electronic circuit formation
07/21/2011WO2011086797A1 Method of manufacturing substrate with built-in capacitor
07/21/2011WO2011086796A1 Method of manufacturing substrate with built-in capacitor
07/21/2011WO2011086795A1 Capacitor element and substrate with built-in capacitor
07/21/2011WO2011086768A1 Substrate and method of manufacturing substrate
07/21/2011WO2011086680A1 Anisotropic electrically-conductive adhesive agent
07/21/2011WO2011086596A1 Coil device
07/21/2011WO2011085584A1 Surface metalizing method, method for preparing plastic article and plastic article made therefrom
07/21/2011WO2010142271A3 Screen printing frame
07/21/2011US20110177719 Electrical connector module assembly
07/21/2011US20110176288 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
07/21/2011US20110176279 Electromagnetic interference shield with integrated heat sink
07/21/2011US20110176264 Electronic component and method for manufacturing electronic component
07/21/2011US20110175749 Planar distributed element antenna isolation board
07/21/2011US20110175700 Conductive polymer electronic devices with surface mountable configuration and methods for manufacturing same
07/21/2011US20110175637 Method for manufacturing probe card, probe card, method for manufacturing semiconductor device, and method for forming probe
07/21/2011US20110174999 Galvanic isolation that incorporates a transformer with an optical link and that can be integrated onto a single semiconductor substrate
07/21/2011US20110174533 Electronic apparatus, method of manufacturing substrate, and method of manufacturing electronic apparatus
07/21/2011US20110174528 Method of forming circuit interconnection, circuit board, and circuit interconnection film having film thickness larger than width thereof
07/21/2011US20110174527 Element mounting board, semiconductor module, semiconductor device, method for fabricating the element mounting board, and method for fabricating semiconductor device
07/21/2011US20110173809 Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner
07/21/2011US20110173808 Layout Method For Electronic Components Of Double-Sided Surface Mount Circuit Board
07/21/2011US20110173807 Dispersion for disposing fine particle at predetermined point on substrate by ink-jet printing
07/21/2011US20110173806 Substrates having voltage switchable dielectric materials
07/21/2011DE19963290B4 Planare Induktivität Planar inductor
07/21/2011DE10222670B4 Elektrische Vorrichtung, welche eine Mehrzahl von Metallkontaktstellen besitzt,auf die eine Metallverdrahtung gebondet ist, und ein Herstellungsverfahren davon Electrical device having a plurality of metal pads to which a metal wiring is bonded, and a manufacturing method thereof
07/21/2011DE102010055705A1 Heißlaminierbarer Schichtkörper mit mindestens einem elektrischen Schaltelement Heißlaminierbarer layer body with at least one electrical switching element