Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2011
07/13/2011CN201898664U Preprocessor for circuit board
07/13/2011CN201895156U Inlet plate anti-error device for reflow soldering
07/13/2011CN1920587B Multilayer wiring substrate and BVH broken wire detection method
07/13/2011CN1808701B Manufacturing method of package base plate
07/13/2011CN102124826A Method for manufacturing printed wiring board and printed wiring board
07/13/2011CN102124825A Method of forming a patterned substrate
07/13/2011CN102124822A A wireless telemetry electronic circuit board for high temperature environments
07/13/2011CN102124563A Substrate on which element is to be mounted, semiconductor module, semiconductor device, method for producing substrate on which element is to be mounted, method for manufacturing semiconductor device, and portable device
07/13/2011CN102124145A Method for surface treatment of copper and copper
07/13/2011CN102123567A Processing method for improving heat conductivity of printed circuit board
07/13/2011CN102123566A Embedded circuit board and manufacturing method thereof
07/13/2011CN102123565A Manufacturing method of high-alignment interlayer conducting structure of embedded type circuit
07/13/2011CN102123564A Conformal coating shielding method of circuit board
07/13/2011CN102123563A Method for manufacturing ceramic PCB (Printed Circuit Board)
07/13/2011CN102123562A Method for manufacturing metal substrate by adopting reflow soldering
07/13/2011CN102123561A Electronic sub-component used for electronic device
07/13/2011CN102123560A Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof
07/13/2011CN102122770A Flexible cable for connector connection and manufacturing method thereof
07/13/2011CN102121126A Printed circuit board (PCB) electroplating device with guide wheel frame
07/13/2011CN102121108A Compound OSP treating agent for lead-free printed circuit board
07/13/2011CN102120376A Mold release film
07/13/2011CN101699940B Manufacture method of golden finger printed board
07/13/2011CN101657068B Method for preparing coaxial cable
07/13/2011CN101636046B Method for processing multilayer flexible circuit board
07/13/2011CN101636044B Embedded type circuit structure and manufacturing method thereof
07/13/2011CN101542706B Electronic component mounting body and electronic component with solder bump and method for manufacturing them
07/13/2011CN101522955B Process for producing metal clad laminate
07/13/2011CN101521982B PCB board, mould, LED display device and preparing methods thereof
07/13/2011CN101393871B Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
07/13/2011CN101281368B Black solder resist compound and cured product thereof
07/12/2011USRE42542 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
07/12/2011US7978478 Printed circuit board
07/12/2011US7977698 System and method for surface mountable display
07/12/2011US7977598 Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation
07/12/2011US7977034 Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner
07/12/2011US7976892 Equipping electrically insulating substrate with a coating of an electrically highly conductive first metal; cleaning coated surface; seeding the coating with seeds of a second metal;depositing a layer of the second metal; firing
07/12/2011US7975380 Method of fabricating a probe card
07/12/2011US7975378 Method of manufacturing high speed printed circuit board interconnects
07/12/2011US7975377 Wafer scale heat slug system
07/12/2011US7975371 Apparatus for manufacturing a multilayer chip capacitor
07/07/2011WO2011081213A1 Method for soldering surface-mount component and surface-mount component
07/07/2011WO2011081153A1 Die and manufacturing method therefor
07/07/2011WO2011081131A1 Photosensitive resin composition, photosensitive dry film, and pattern forming method
07/07/2011WO2011081129A1 Method for manufacturing printed circuit substrate and method for manufacturing probe substrate using the same
07/07/2011WO2011081127A1 Photosensitive resin composition, photosensitive dry film, and pattern forming method
07/07/2011WO2011081055A1 Curable resin composition and printed wiring board comprising same
07/07/2011WO2011080990A1 Solder paste and flux
07/07/2011WO2011080965A1 Wiring board and method for producing wiring board
07/07/2011WO2011080827A1 Wiring structure and method for forming same
07/07/2011WO2011079950A1 Method and device for the wet chemical treatment of material feedstock
07/07/2011WO2011079918A2 Conductor structural element and method for producing a conductor structural element
07/07/2011WO2011043537A3 Printed circuit board and manufacturing method thereof
07/07/2011US20110165719 Methods of forming an embedded cavity for sensors
07/07/2011US20110164849 Hybrid Integrated Optical Elements
07/07/2011US20110164391 Electronic component-embedded printed circuit board and method of manufacturing the same
07/07/2011US20110164386 Heat-release configuration, bracket for supporting heat-release plate and method of assembling heat-release configuration
07/07/2011US20110164371 Printed circuit board
07/07/2011US20110164083 Liquid Droplet Ejection System and Control Program of Ejection Condition of Compositions
07/07/2011US20110163983 Touch screen device and production method thereof
07/07/2011US20110163772 Micro contact probe coated with nanostructure and method for manufacturing the same
07/07/2011US20110163430 Leadframe Structure, Advanced Quad Flat No Lead Package Structure Using the Same, and Manufacturing Methods Thereof
07/07/2011US20110163062 Self-aligned barrier and capping layers for interconnects
07/07/2011US20110162203 Multi-layer ground plane structures for integrated lead suspensions
07/07/2011US20110162202 Electronic component mounting device and work method of electronic component mounting device
07/07/2011DE112009002134T5 Elektronikteil-Einbauvorrichtung und Arbeitsverfahren unter Verwendung der Elektronikteil-Einbauvorrichtung Electronics installing device and working method using the electronic installing device
07/07/2011DE102010035388A1 Induktor und DC-DC Konverter Inductor and DC-DC Converter
07/07/2011DE102009041952A1 Method for producing multi-layered ceramic substrates, comprises providing a first ceramic green sheet and a second ceramic green sheet, and applying an electronic functional layer on the first ceramic green sheet
07/06/2011EP2341583A1 Female connector, male connector assembled thereto, and electric/electronic apparatus using the connectors
07/06/2011EP2341582A1 Anisotropic electroconductive film
07/06/2011EP2341463A2 Data carrier/transmission device and method for manufacturing it
07/06/2011EP2341167A1 Method for surface treatment of copper and copper
07/06/2011EP2340694A1 Printed circuit board for harsh environments
07/06/2011EP2340513A2 Transferring assembly and method for transferring a radiofrequency identification device onto an object
07/06/2011EP2240318B1 Method for making a heating element by depositing thin layers onto an insulating substrate, the resulting element and use thereof
07/06/2011CN201894004U Wave soldering fixture for circuit board of double-sided device
07/06/2011CN201894003U Back washing rack
07/06/2011CN201894002U Rinsing bath
07/06/2011CN201894001U Process unit for flexible circuit board
07/06/2011CN201894000U Reinforcement fitting device of circuit board
07/06/2011CN201893999U Stop block jig for holding circuit board
07/06/2011CN201893998U Special hanger for PCB (printed circuit board)
07/06/2011CN201893997U Welding structure for plug-in components of LED driver on circuit board
07/06/2011CN201892380U Technique utilizing ultrasonic waves to dry printed circuit boards
07/06/2011CN201890930U Flexible board fixture for immersion gold process
07/06/2011CN201889826U Automatic stamping device
07/06/2011CN201889570U Novel integrated circuit welding tray
07/06/2011CN1824484B Molded part and electronic device comprising said molded part
07/06/2011CN1780526B Electronic assembly with a heat sink
07/06/2011CN102119588A Method for manufacturing module with built-in component, and module with built-in component
07/06/2011CN102119587A Method of manufacturing printed wiring board with surface-mount component mounted thereon
07/06/2011CN102119427A Conductive adhesive and LED substrate using the same
07/06/2011CN102119333A Electronic sensor or sensor device, in particular acceleration sensor, comprising a chip module mounted in a sensor housing
07/06/2011CN102119240A Surface treating agent for copper or copper alloy and use thereof
07/06/2011CN102119074A Entry sheet for drilling
07/06/2011CN102118957A Collinear production method for printed circuit board and SMT production line
07/06/2011CN102118923A New method for manufacturing interconnected copper pillars among plurality of layers of circuit boards
07/06/2011CN102118922A 印制电路板 Printed circuit board
07/06/2011CN102118921A Pin-bending-and-fixing device for component inserter
07/06/2011CN102118920A Patching and assessing system of circuit boards and method
07/06/2011CN102118919A Electronic device and method of manufacturing the same