| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 09/28/2011 | CN201995215U 印刷线路板的烤板架 Printed circuit board rack baking sheet |
| 09/28/2011 | CN201995214U 印刷线路板的放板架 Printed circuit boards discharge plate rack |
| 09/28/2011 | CN201995213U 运输轨道车 Transport rail cars |
| 09/28/2011 | CN201994158U 电感器 Inductor |
| 09/28/2011 | CN201993579U 一种用于制作线路板的对位台 A bit units for the production of circuit boards |
| 09/28/2011 | CN201993578U 行辘清洁装置 OK reel cleaning device |
| 09/28/2011 | CN201990751U 一种改良的柔性电路板电镀铜挂具 An improved flexible circuit board copper plating hanging |
| 09/28/2011 | CN201990743U 整流线连接结构以及印刷电路板电镀装置 The rectified line connection structure and a printed circuit board plating apparatus |
| 09/28/2011 | CN201989404U 电路板网印治具 Circuit board screen printing Fixture |
| 09/28/2011 | CN201988824U 一种pcb板喷锡专用夹具 One kind of special fixtures HASL pcb board |
| 09/28/2011 | CN201988821U 一种焊线机的推料杆 A pusher rod wire bonders |
| 09/28/2011 | CN1879060B Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed circuit board |
| 09/28/2011 | CN102204421A Multilayer wiring substrate and method for producing same |
| 09/28/2011 | CN102204420A Electronic device manufacturing method and electronic device |
| 09/28/2011 | CN102204419A Method and apparatus for bonding electronic component and flexible film substrate |
| 09/28/2011 | CN102204418A Method for integrating an electronic component into a printed circuit board |
| 09/28/2011 | CN102203326A Ultrathin copper foil with carrier, and copper laminated board or printed wiring board |
| 09/28/2011 | CN102203318A Metal nanowire thin-films |
| 09/28/2011 | CN102202891A Screen printer and method for cleaning screen printer |
| 09/28/2011 | CN102202470A Multilayer circuit board and making method |
| 09/28/2011 | CN102202469A Circuit board wet-processing system |
| 09/28/2011 | CN102202468A Methods of patterning a deposit metal on a substrate |
| 09/28/2011 | CN102202467A Method of fabricating wiring board |
| 09/28/2011 | CN102202466A Copper-clad laminate-based method for micro-removing copper film from selected area by assistance of laser |
| 09/28/2011 | CN102202465A Automatic reinforcement laminating machine for flexible printed circuit |
| 09/28/2011 | CN102202464A Device for producing ceramic green sheet |
| 09/28/2011 | CN102202462A Printing wiring board and method for manufacturing the same |
| 09/28/2011 | CN102202461A Wiring substrate and method of manufacturing the same |
| 09/28/2011 | CN102202458A Flexible printed circuit board with reinforced plate and manufacture method thereof |
| 09/28/2011 | CN102201390A Chip on film (COF) packaging substrate for high-pixel camera module and manufacturing method thereof |
| 09/28/2011 | CN102201349A Circuit component built-in module and manufacturing method therefor |
| 09/28/2011 | CN102199771A Copper etching solution and producing method of substrate |
| 09/28/2011 | CN102199405A Production technology for polytetrafluoroethylene adhesive sheet |
| 09/28/2011 | CN102199404A Film-like circuit connecting material and connection structure for circuit member |
| 09/28/2011 | CN102198670A Board cutting system |
| 09/28/2011 | CN102198550A Welding device |
| 09/28/2011 | CN101853789B Method for manufacturing golden finger of soldering-pan of flexible package carrying board |
| 09/28/2011 | CN101808466B Manufacturing method of copper-clad plate and glue solution for copper-clad plate |
| 09/28/2011 | CN101733438B Robot for punching positioning holes on circuit board |
| 09/28/2011 | CN101674711B Aligning method of double-faced flexible printed circuit board |
| 09/28/2011 | CN101641007B Chip mounter suction nozzle |
| 09/28/2011 | CN101640982B Terminal table for substrate installation and printed circuit board for the same |
| 09/28/2011 | CN101621896B Printed wiring board and method for manufacturing the same |
| 09/28/2011 | CN101583241B Method for assembling heat sink on circuit board and radiating circuit substrate manufactured by method |
| 09/28/2011 | CN101568227B Circuit board, manufacturing method thereof, and joint box using circuit board |
| 09/28/2011 | CN101513143B Couple structure and joining method, wiring board and making method thereof |
| 09/28/2011 | CN101491166B Method for producing electrically conductive surfaces on a carrier |
| 09/28/2011 | CN101490831B Mounting method using thermocompression head |
| 09/28/2011 | CN101472408B Multilayer wiring board and method of manufacturing the same |
| 09/28/2011 | CN101346041B Configurable printed circuit board |
| 09/28/2011 | CN101160632B Process for producing metal conductive film |
| 09/28/2011 | CN101136503B Ring satellite navigation antenna for improving low elevation gain and method for making same |
| 09/28/2011 | CN101106898B Substrate supporting device, device and method for manufacturing the same |
| 09/27/2011 | US8027171 Feeding structure of electrostatic chuck, method for producing the same, and method for regenerating feeding structure of electrostatic chuck |
| 09/27/2011 | US8026613 Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
| 09/27/2011 | US8026587 Semiconductor package including top-surface terminals for mounting another semiconductor package |
| 09/27/2011 | US8026450 Multi-dielectric material circuit board supporting high-speed and low-speed signaling |
| 09/27/2011 | US8025953 Method for preparing conductive pattern and conductive pattern prepared by the method |
| 09/27/2011 | US8024857 Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same |
| 09/27/2011 | US8024856 Method for manufacturing printed circuit board |
| 09/27/2011 | CA2466611C Heat-curable resin composition |
| 09/27/2011 | CA2447758C Potting material for electronic components |
| 09/22/2011 | WO2011116093A2 Solder return for wave solder nozzle |
| 09/22/2011 | WO2011115371A2 Etchant for metal wiring and method for manufacturing metal wiring using the same |
| 09/22/2011 | WO2011115100A1 Photocurable/thermosetting resin composition, dry film thereof and cured substance therefrom, and printed circuit board using same |
| 09/22/2011 | WO2011114997A1 Two-layer flexible substrate and process for producing same |
| 09/22/2011 | WO2011114945A1 Method and apparatus for determining acceptance/rejection of fine diameter wire bonding |
| 09/22/2011 | WO2011114774A1 Substrate having integrated semiconductor element, and manufacturing method for same |
| 09/22/2011 | WO2011114766A1 Substrate with built-in functional element |
| 09/22/2011 | WO2011114759A1 Method for mounting electronic components, and electronic device |
| 09/22/2011 | WO2011114696A1 Method for disposing a component |
| 09/22/2011 | WO2011114695A1 Method for disposing a component |
| 09/22/2011 | WO2011114543A1 Bonding material and bonding method using same |
| 09/22/2011 | WO2011114104A1 Improved carrier for electronic components |
| 09/22/2011 | WO2011113863A1 Arrangement comprising an electric and/or electronic module and a circuit carrier |
| 09/22/2011 | WO2011113772A1 Electronic module having side contacts, device comprising same and method for manufacturing such a module |
| 09/22/2011 | WO2011113770A1 Circuit arrangement and associated controller for a motor vehicle |
| 09/22/2011 | WO2011113767A1 Circuit arrangement and associated controller for a motor vehicle |
| 09/22/2011 | WO2011113762A1 Film system for led applications |
| 09/22/2011 | WO2011113682A1 Method and apparatus for alignment optimization with respect to plurality of layers |
| 09/22/2011 | WO2011113645A1 Control device |
| 09/22/2011 | WO2011113074A1 Method and composite assembly for processing or treating a plurality of printed circuit boards and use therefor |
| 09/22/2011 | WO2011113073A1 Method and composite assembly for processing or treating a plurality of printed circuit boards and use therefor |
| 09/22/2011 | WO2011066055A3 Formation of electrically conductive pattern by surface energy modification |
| 09/22/2011 | US20110229709 Circuit laminates, and method of manufacture thereof |
| 09/22/2011 | US20110229702 Reducing thermal expansion effects in semiconductor packages |
| 09/22/2011 | US20110229377 Apparatus for Removal of Surface Oxides via Fluxless Technique Involving Electron Attachment and Remote Ion Generation |
| 09/22/2011 | US20110228492 Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom |
| 09/22/2011 | US20110228489 Devices with pneumatic, hydraulic and electrical components |
| 09/22/2011 | US20110228484 Electrical component thermal management |
| 09/22/2011 | US20110227842 Touch panel and the manufacturing method thereof |
| 09/22/2011 | US20110227214 Wiring board and method of manufacturing the same, and semiconductor device and method of manufacturing the same |
| 09/22/2011 | US20110227208 Structure and Manufacture Method For Multi-Row Lead Frame and Semiconductor Package |
| 09/22/2011 | US20110226860 Printed circuit board with antenna for rfid chip and method for manufacturing the same |
| 09/22/2011 | US20110226729 Method of manufacturing a double sided flex circuit for a disk drive wherein a first side lead provides an etching mask for a second side lead |
| 09/22/2011 | US20110226727 Etchant for metal wiring and method for manufacturing metal wiring using the same |
| 09/22/2011 | US20110226726 Dry etching apparatus and method for manufacturing touch screen panels using the same |
| 09/22/2011 | US20110226520 Integrated circuit carrier assembly |
| 09/22/2011 | US20110226519 Electric Connection Structure And Method For Fabricating The Same |
| 09/22/2011 | US20110226518 Substrate of circuit module and manufacturing method therefor |