Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2011
06/29/2011CN102113422A 用于非接触性材料沉积的方法及系统 For non-contact method and system for material deposition
06/29/2011CN102113420A 电路构造体 Circuit structure
06/29/2011CN102112921A Flame-retardant photocurable resin composition, dry film and cured product of same, and printed circuit board using composition thereof
06/29/2011CN102112920A Flame-retardant photocurable resin composition, dry film and cured product of same, and printed circuit board using composition thereof
06/29/2011CN102112544A Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate
06/29/2011CN102111991A Method for soldering through-hole reflow device and printed circuit board
06/29/2011CN102111968A Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
06/29/2011CN102111967A Method and system for controlling thickness of circuit board insulating layer
06/29/2011CN102111966A High-temperature reflow soldering process for printed circuit board (PCB)
06/29/2011CN102111965A Method for fabricating circuit board
06/29/2011CN102111964A Method for manufacturing circuit board
06/29/2011CN102111963A Manufacturing process of high-heat conducting environmental-friendly metal circuit board
06/29/2011CN102111962A Method and device for manufacturing semi-circular thin line
06/29/2011CN102111961A Method for detecting process capability of inner and outer layers of circuit board
06/29/2011CN102111960A Solder paste printing vehicle
06/29/2011CN102111956A Base material for printed circuit board
06/29/2011CN102111955A Connecting structure and connecting method for PCB
06/29/2011CN102111954A Circuit board and manufacturing process thereof
06/29/2011CN102111953A Printed circuit board (PCB) and manufacturing method thereof
06/29/2011CN102111951A Multilayered wiring substrate
06/29/2011CN102110616A Method for realizing thin film multilayer wiring on low temperature cofired ceramic (LTCC) substrate
06/29/2011CN102109779A Counterpoint jig
06/29/2011CN102107387A Structural improvement of automatic cutting and grinding line
06/29/2011CN102107309A Device for wave welding
06/29/2011CN101815407B Sheet immersing treatment method and device
06/29/2011CN101790284B PCB (printed circuit board) punch forming method and composite punch die
06/29/2011CN101668386B Pin wiring structure of card insertion end of flexible printed circuit board
06/29/2011CN101646309B Circuit board processing method
06/29/2011CN101610641B Wet process system and wet processing method
06/29/2011CN101562944B Circuit board and manufacturing technology thereof
06/29/2011CN101553081B Hollow-out double-sided flexible printed circuit board with ACP conductive adhesive being printed thereon
06/29/2011CN101553079B Hollow-out flexible printed circuit board
06/29/2011CN101546745B Chip interconnect swizzle mechanism
06/29/2011CN101366326B Method of connecting electrical components
06/29/2011CN101244650B Method and apparatus for forming patterns, and liquid dryer
06/29/2011CN101203092B Difference pair identifying method
06/28/2011US7968196 Circuit-connecting material and circuit terminal connected structure and connecting method
06/28/2011US7968141 Method for producing contact terminal with textured surface and use thereof
06/28/2011US7967943 Circuit-connecting material and circuit terminal connected structure and connecting method
06/28/2011US7967213 Flat transponder and method for the production thereof
06/28/2011US7966722 Planarization method in the fabrication of a circuit
06/28/2011US7966721 Electronic component mounting method and electronic component mounting device
06/28/2011US7966720 Method of manufacturing an element substrate
06/28/2011CA2725309A1 Method of manufacturing electronic cards
06/23/2011WO2011074528A1 Photosensitive resin composition, dry film thereof, and printed wiring board formed using same
06/23/2011WO2011074503A1 Polymerizable compound and curable composition containing same
06/23/2011WO2011074469A1 Solder resist ink composition, and cured product thereof
06/23/2011WO2011074351A1 Mounting structure of electronic component
06/23/2011WO2011074283A1 Capacitor-equipped wiring substrate and component-equipped wiring substrate
06/23/2011WO2011074240A1 Screen printing system and method for cleaning masks of screen printing system
06/23/2011WO2011074239A1 Screen printing system and method for cleaning masks of screen printing system
06/23/2011WO2011073090A1 Method and device for producing an interconnect device and interconnect device
06/23/2011WO2011072643A1 Contact device for fastening to a circuit board, method for fastening a contact device to a circuit board, and circuit board
06/23/2011WO2011072372A1 Method and electrostatic transfer stamp for transferring semiconductor dice using electrostatic transfer printing techniques
06/23/2011WO2011020946A3 Cover comprising a flexible connecting element for an electronic device
06/23/2011WO2011019523A3 Roll mechanics for enabling printed electronics
06/23/2011US20110150701 Chemical sensor using metal nano-particles and method for manufacturing chemical sensor using metal nano-particles
06/23/2011US20110150462 Lens module and assembly method thereof
06/23/2011US20110149539 Base plate for use in a multi-chip module
06/23/2011US20110149522 Electronic control unit and method for producing component of same
06/23/2011US20110149519 Apparatus and method for embedding components in small-form-factor, system-on-packages
06/23/2011US20110149506 Adjustable mounting bracket for a computer component
06/23/2011US20110149452 Surface mount spark gap
06/23/2011US20110148780 Touch panel and fabricating method thereof
06/23/2011US20110148550 Metamaterial transmission line apparatus and method of implementing the same
06/23/2011US20110147921 Flange for Semiconductor Die
06/23/2011US20110147896 Cluster jet processing method, semiconductor element, microelectromechanical element, and optical component
06/23/2011US20110147338 Release Accumulative Charges on Wafers Using O2 Neutralization
06/23/2011US20110147071 Apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof
06/23/2011US20110147070 Method and Apparatus for Reducing Signal Noise
06/23/2011US20110147069 Multi-tiered Circuit Board and Method of Manufacture
06/23/2011US20110147061 Circuit Board with Via Trace Connection and Method of Making the Same
06/23/2011US20110147058 Electronic device and method of manufacturing electronic device
06/23/2011US20110147057 Printed wiring board and method for manufacturing printed wiring board
06/23/2011US20110147055 Glass core substrate for integrated circuit devices and methods of making the same
06/23/2011US20110147050 Printed wiring board and method for manufacturing printed wiring board
06/23/2011US20110146070 Method of fabricating multi-level metallic parts by the liga-uv technique
06/23/2011US20110146069 Electric component and component and method for the production thereof
06/23/2011US20110146068 Electrical device having boardless electrical component mounting arrangement
06/23/2011US20110146067 Assembling method of a liquid crystal display apparatus and a chip mounted wiring substrate suitable for the method
06/23/2011US20110146065 Cleaning device of board and cleaning method, flat display panel, mounting equipment of electronic parts and mounting method
06/22/2011EP2337434A1 Assembling method of a liquid crystal display apparatus and a chip mounted wiring substrate suitable for the method
06/22/2011EP2337225A1 Icon illumination for capacitive touch switch
06/22/2011EP2336952A2 Automatic RFID circuit tuning
06/22/2011EP2336395A1 Ultrathin copper foil with carrier, and copper laminated board or printed wiring board
06/22/2011EP2335936A1 Aromatic polycarbonate composition
06/22/2011EP2208237B1 Positioning device to position one or more electronic circuit boards, in particular for photovoltaic cells, in a metal-deposition unit
06/22/2011EP2005487B1 System and method for producing a solar cell array
06/22/2011EP1845761B1 Multilayer printed wiring board
06/22/2011EP1459611B1 Housing system for an electric device
06/22/2011EP1032030B1 Flip chip bump bonding
06/22/2011DE102010055436A1 Steckverbinder und Verfahren zur Herstellung eines Steckverbinders Connector and method for manufacturing a connector
06/22/2011DE102009060480A1 Leiterstrukturelement und Verfahren zum Herstellen eines Leiterstrukturelements Conductor structure element and method for manufacturing a conductor structure element
06/22/2011DE102009054899A1 Electrical contacting element for use in electric power unit of active steering system in motor vehicle, has U-shaped double termination clamp arranged in bending region, and press-in pin arranged at end of leadframe
06/22/2011DE102009054764A1 Verfahren und Vorrichtung zum Herstellen eines Schaltungsträgers und Schaltungsträger Method and apparatus for producing a circuit carrier and circuit carrier
06/22/2011DE102004053336B4 Wässrige Ätzmittellösung für Nickel, Chrom, Nickel-Chrom-Legierungen und/oder Palladium sowie Verwendung zur Herstellung von Leiterplatten Aqueous etchant for nickel, chromium, nickel-chromium alloys, and / or palladium as well as use for the preparation of printed circuit boards
06/22/2011DE102004006312B4 Mehrschichtige Leiterplatte, ein Verfahren zu deren Herstellung und einen isolierenden Film Multilayer printed wiring board, a process for their preparation and an insulating film
06/22/2011DE10064629B4 Verfahren zum Verbinden von Leiterplatten A method for connecting printed circuit boards
06/22/2011CN201878431U Anisotropic conductive film (ACF) stripping device
06/22/2011CN201878430U Flexible printed circuit board (FPCB) aligning jig for touch screen