| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/21/2011 | DE102008027461B4 Vorrichtung und Verfahren zur mikrostrukturierten Plasmabehandlung Apparatus and method for microstructured plasma treatment |
| 07/20/2011 | EP2346310A2 Multilayer wiring circuit board |
| 07/20/2011 | EP2346309A2 Light emitting module, backlight unit, and display apparatus |
| 07/20/2011 | EP2346308A1 Apparatus and method for treating a substance at a substrate |
| 07/20/2011 | EP1618770B1 Electronic control module for a removable connector and methods of assembling same |
| 07/20/2011 | CN201904977U Blue glue printing device for PCB print |
| 07/20/2011 | CN201904976U Quick locking device |
| 07/20/2011 | CN201904975U Production device of bonding sheets for copper-clad plate |
| 07/20/2011 | CN201904974U De-static product combination chamber |
| 07/20/2011 | CN201903598U Production test device |
| 07/20/2011 | CN201900352U Novel backflow welding machine |
| 07/20/2011 | CN1906983B On-chip system |
| 07/20/2011 | CN1842250B Light source device and method for manufacturing same |
| 07/20/2011 | CN102132641A 电子元件安装系统 An electronic component mounting system |
| 07/20/2011 | CN102132639A Wiring board with built-in electronic component and method for manufacturing the wiring board |
| 07/20/2011 | CN102132638A Mitigation of whiskers in sn-films |
| 07/20/2011 | CN102132637A Method for hot-embossing of at least one circuit path on a substrate and a substrate with at least one circuit path |
| 07/20/2011 | CN102132636A Electrode structure, wiring body, adhesive connection structure, electronic device, and method for fabricating same |
| 07/20/2011 | CN102132635A Collective ceramic substrate, manufacturing method for substrate, ceramic substrate, and ceramic circuit substrate |
| 07/20/2011 | CN102131959A Surface treating agent for copper or copper alloy and use thereof |
| 07/20/2011 | CN102131958A Method of forming a microstructure |
| 07/20/2011 | CN102131910A Cleaning composition for removing lead-free solder flux and system for removing lead-free solder flux |
| 07/20/2011 | CN102131375A Method for assembling elements on circuit board and automatic assembling machine |
| 07/20/2011 | CN102131353A Method of joining components, composite of components of an electrical circuit and electrical circuit |
| 07/20/2011 | CN102131352A Method for manufacturing printed circuit board (PCB) |
| 07/20/2011 | CN102131351A Processing device or acf adhibition state checking method or substrate module assembly line |
| 07/20/2011 | CN102131350A Circuit board and manufacturing process thereof |
| 07/20/2011 | CN102131349A Rolling device and method for rolling circuit board |
| 07/20/2011 | CN102131348A Method for manufacturing rigid-flexible printed circuit board |
| 07/20/2011 | CN102131347A Circuit substrate and manufacturing method thereof |
| 07/20/2011 | CN102131346A Circuit board and manufacturing process thereof |
| 07/20/2011 | CN102131340A Flexible printed wiring board, method of manufacturing the same, and electronic equipment with the same |
| 07/20/2011 | CN102131337A Circuit board and manufacturing process thereof |
| 07/20/2011 | CN102131336A Circuit board and manufacture procedure thereof |
| 07/20/2011 | CN102130018A Chip radiation method, and related device and system |
| 07/20/2011 | CN102130016A Integrated circuit chip package substrate, device including the same and electronic device |
| 07/20/2011 | CN102127375A Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
| 07/20/2011 | CN102127374A Method for repairing DAD-40 conductive adhesive bonding product |
| 07/20/2011 | CN102126040A Milling method and device |
| 07/20/2011 | CN101772994B Multilayer ceramic substrate and method for manufacturing the same |
| 07/20/2011 | CN101772266B Pin shearing device of flat reed pipe |
| 07/20/2011 | CN101765333B 线路板焊接工装 PCB welding equipment |
| 07/20/2011 | CN101685027B Dial module and meter employing the same |
| 07/20/2011 | CN101633770B Halogen-free flame retardant epoxy resin composite and flexible copper clad laminate prepared with same |
| 07/20/2011 | CN101581757B Test system and test method |
| 07/20/2011 | CN101472400B Printed wiring board unit and method of making the same |
| 07/20/2011 | CN101409984B Circuit board and production method thereof |
| 07/20/2011 | CN101400221B Circuit board |
| 07/20/2011 | CN101336461B Method for regulating capacitance value of built-in capacitor in multilayered ceramic substrate, and multilayered ceramic substrate and process for producing the same |
| 07/20/2011 | CN101320624B Multi-layered ceramic electronic component |
| 07/20/2011 | CN101309553B Electronic circuit device and production method of the same |
| 07/20/2011 | CN101295580B Capacitor devices and its manufacturing method |
| 07/20/2011 | CN101272663B Method for manufacturing multi-layer wiring substrate |
| 07/20/2011 | CN101267712B A processing method for alleviating Galvanic corrosion of PCB board |
| 07/20/2011 | CN101250318B Epoxy radical material for printing circuit copper clad laminate and preparation method thereof |
| 07/20/2011 | CN101203090B Arrangement for surface mounting an electrical component by soldering, and electrical component for such an arrangement |
| 07/19/2011 | US7983024 Fuse card system for automotive circuit protection |
| 07/19/2011 | US7982139 Multilayer printed wiring board |
| 07/19/2011 | US7981792 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 07/19/2011 | US7981730 Integrated conformal shielding method and process using redistributed chip packaging |
| 07/19/2011 | US7981269 Method of electrochemical fabrication |
| 07/19/2011 | US7981245 Forming plated through hole; surface roughness facilitates deposition of conductive metal; shrinkage inhibition |
| 07/19/2011 | US7979982 Imaging device, and method for manufacturing the same |
| 07/14/2011 | WO2011084216A2 Substrate for integrated circuit devices including multi-layer glass core and methods of making the same |
| 07/14/2011 | WO2011083824A1 Circuit connecting adhesion film and circuit connecting structure |
| 07/14/2011 | WO2011083792A1 Circuit module |
| 07/14/2011 | WO2011083765A1 Screen printing machine |
| 07/14/2011 | WO2011083764A1 Screen printing machine |
| 07/14/2011 | WO2011083753A1 Electronic component |
| 07/14/2011 | WO2011083554A1 Polyamide or polyimide resin compositions that contain phosphine oxide, and cured products thereof |
| 07/14/2011 | WO2011054432A4 Method and apparatus for printing a substrate, in particular a printed circuit board, with a printing paste |
| 07/14/2011 | WO2011028004A3 Copper foil for an embedded pattern for forming a microcircuit |
| 07/14/2011 | US20110171472 Adhesive With a High Resistance |
| 07/14/2011 | US20110170831 Optical module and manufacturing method of the module |
| 07/14/2011 | US20110170301 Thermal Transfer in Solid State Light Emitting Apparatus and Methods of Manufacturing |
| 07/14/2011 | US20110170268 Electromagnetic band gap structure, element, substrate, module, and semiconductor device including electromagnetic band gap structure, and production methods thereof |
| 07/14/2011 | US20110170167 Method for modulating light with multiple electrodes |
| 07/14/2011 | US20110169892 Inkjet nozzle incorporating actuator with magnetic poles |
| 07/14/2011 | US20110169596 System and Method for Integrated Inductor |
| 07/14/2011 | US20110169554 Integrated solar powered device |
| 07/14/2011 | US20110169404 Traveling wave electron device with membrane-supported slow wave circuit |
| 07/14/2011 | US20110169164 Wiring substrate, manufacturing method thereof, and semiconductor package |
| 07/14/2011 | US20110169150 Semiconductor Package with Single Sided Substrate Design and Manufacturing Methods Thereof |
| 07/14/2011 | US20110169037 Wiring Board for Light-Emitting Element |
| 07/14/2011 | US20110167628 Component bonding using a capillary effect |
| 07/14/2011 | US20110167627 Method of mounting electronic components on printed circuit boards |
| 07/14/2011 | DE10309188B4 Steif-flexible Leiterplatte und Verfahren zu deren Herstellung Rigid-flexible printed circuit board and process for their preparation |
| 07/14/2011 | DE102010004193A1 Device for thermal connecting of electronic and/or mechanical components on a first side of a substrate, comprises a substrate holding device and/or a substrate transport unit and/or an energy source for transmitting and aligning radiation |
| 07/13/2011 | EP2343957A1 Electrical interconnect |
| 07/13/2011 | EP2343956A1 Copper paste and wiring board using the same |
| 07/13/2011 | EP2342959A1 Method for integrating an electronic component into a printed circuit board |
| 07/13/2011 | EP2342958A2 Method for integrating an electronic component into a printed circuit board |
| 07/13/2011 | EP2342372A1 Method for enhancing the solderability of a surface |
| 07/13/2011 | EP1514459B1 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate |
| 07/13/2011 | CN201898670U Simple jig for flexible printed circuit board (FPCB) multilayer lamination |
| 07/13/2011 | CN201898669U Subsidiary bar connecting structure of rigid-flexible printed circuit board |
| 07/13/2011 | CN201898668U Support structure of transmission rail connecting part |
| 07/13/2011 | CN201898667U Clamp for controlling welding height of printed circuit board (PCB) and base of crystal oscillator |
| 07/13/2011 | CN201898666U Horizontal line leveling guide frame for flexible printed circuit board |
| 07/13/2011 | CN201898665U Leveling machine structure module of printed circuit board (PCB) |