| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/22/2011 | US20110226515 Textile-type electronic component package, method for manufacturing the same, and method for mounting the same on textile |
| 09/22/2011 | US20110226513 Electronic component package and method for producing electronic component package |
| 09/22/2011 | US20110226059 Sensor and method for manufacturing a sensor |
| 09/22/2011 | US20110225819 Processor installation and removal tool |
| 09/22/2011 | US20110225818 Method of manufacturing an led illuminator device |
| 09/22/2011 | US20110225817 Printed circuit board |
| 09/22/2011 | US20110225816 Method of manufacturing a multilayer printed circuit board with a built-in electronic device |
| 09/22/2011 | US20110225815 Electrode forming method and electrode forming apparatus |
| 09/22/2011 | DE10240415B4 Halbleiteranordnung mit einem in einem Hohlraum eingebetteten Modul und Verfahren zum Herstellen derselben A semiconductor device comprising an embedded in a cavity module and method for manufacturing the same |
| 09/22/2011 | DE102010011719A1 Verfahren zur Herstellung einer elektrisch leitenden Verbindung eines Kontaktes mit einem Gegenkontakt A process for producing an electrically conductive connection of contact with a mating contact |
| 09/22/2011 | DE102010011604A1 Foliensystem für LED-Anwendungen Film system for LED applications |
| 09/22/2011 | DE102010002943A1 Anordnung mit einem elektrischen und/oder elektronischen Modul und einem Schaltungsträger Arrangement with an electric and / or electronic module and a circuit carrier |
| 09/22/2011 | DE102005059360B4 Vorrichtung und Verfahren zum Verguss von Schaltungsanordnungen Apparatus and method for encapsulation of circuits |
| 09/21/2011 | EP2367407A1 Multilayer wiring substrate and method for producing same |
| 09/21/2011 | EP2367406A1 Surface mount electronic component |
| 09/21/2011 | EP2367405A1 Method for manufacturing circuit board, and circuit board obtained using the manufacturing method |
| 09/21/2011 | EP2366694A2 Copper electropating bath and method |
| 09/21/2011 | EP2366686A2 Copper electroplating bath and method |
| 09/21/2011 | EP2366487A1 Laser processing method and laser processing device |
| 09/21/2011 | EP2044821B1 Ball grid array (bga) connection system and related method and ball socket |
| 09/21/2011 | CN201986275U 一种自动取板的印刷电路板定位装置 A printed circuit board positioning device of an automatic plate taken |
| 09/21/2011 | CN201986274U 一种新型高温波峰焊接机 A new high-temperature wave soldering machine |
| 09/21/2011 | CN201986273U 端子折弯治具 Terminal Bend Fixture |
| 09/21/2011 | CN201986272U 薄基板印刷治具 Thin substrate printing Fixture |
| 09/21/2011 | CN201986271U 柔性线路板加工治具 Flexible circuit board processing Fixture |
| 09/21/2011 | CN201986270U Fpc贴合机 Fpc laminating machine |
| 09/21/2011 | CN201981280U 印制电路板沉铜用装置 Heavy copper printed circuit board with a device |
| 09/21/2011 | CN201979793U 一种用于印制电路板的丝印钉床 A printed circuit board silk nail bed |
| 09/21/2011 | CN201979185U 一种回流焊炉膛风帘装置 One kind of wind screen device reflow furnace |
| 09/21/2011 | CN1984533B Printed circuit board having embedded electronic components and manufacturing method thereof |
| 09/21/2011 | CN1892934B Embedded thin layer capacitor, layered structure, and fabrication method of the same |
| 09/21/2011 | CN1700453B Structure of forming pressure contact with power semiconductor module |
| 09/21/2011 | CN1649043B 电子元件 Electronic component |
| 09/21/2011 | CN1644297B Multiple beam micro-machining system and method |
| 09/21/2011 | CN102197715A Molded components |
| 09/21/2011 | CN102197541A Electrical connecting method and electrically connected connection structure |
| 09/21/2011 | CN102197088A Resin composition, resin sheet, prepreg, laminate board, multilayer printed wiring board, and semiconductor device |
| 09/21/2011 | CN102196904A Laminate and process for producing the same |
| 09/21/2011 | CN102196880A Laser processing method and laser processing device |
| 09/21/2011 | CN102196679A Method for manufacturing multilayer printed wiring board and multilayer printed wiring board |
| 09/21/2011 | CN102196678A Laminating process for high-copper thickness thick core plate of printed circuit board |
| 09/21/2011 | CN102196677A PCB (Printed Circuit Board) double-sided jack machining process |
| 09/21/2011 | CN102196676A Manufacturing method of multilayer circuit substrate, conductive material filling device and use method thereof |
| 09/21/2011 | CN102196675A Processed copper foil |
| 09/21/2011 | CN102196674A Electronic circuit board moistureproof process |
| 09/21/2011 | CN102196673A Method for manufacturing circuit structure |
| 09/21/2011 | CN102196672A Circuit board manufacturing method |
| 09/21/2011 | CN102196671A Processing method of circuit board and circuit board with contour tolerance of +/-0.05mm |
| 09/21/2011 | CN102196670A Method for laminating prepreg, method for producing printed wiring board and prepreg roll |
| 09/21/2011 | CN102196669A Printed circuit board and manufacturing method thereof |
| 09/21/2011 | CN102196668A Method for manufacturing circuit board |
| 09/21/2011 | CN102196667A Combined type multilayer circuit board with embedded electronic component and manufacturing method of circuit |
| 09/21/2011 | CN102196666A Multi-layer printed circuit board |
| 09/21/2011 | CN102196665A Blind hole structure of printed circuit board and processing technology of blind hole structure |
| 09/21/2011 | CN102196662A Test point design for a high speed bus |
| 09/21/2011 | CN102196659A Circuit board film and circuit board manufacture method |
| 09/21/2011 | CN102196658A Printed circuit board and method for laminating same and flexible circuit board |
| 09/21/2011 | CN102194780A Electronic device and its manufacture method |
| 09/21/2011 | CN102194702A Method for forming micro-spacing circuit tracing line |
| 09/21/2011 | CN102194615A Embedded type circuit lamination protection element and manufacturing method thereof |
| 09/21/2011 | CN102192912A Solder printing inspection apparatus and solder printing system |
| 09/21/2011 | CN102192905A Circuit board detection apparatus and detection method thereof |
| 09/21/2011 | CN102191004A Thermosetting adhesive for flexible basic material and preparation method thereof |
| 09/21/2011 | CN102189282A System and method for making short slot hole of circuit board |
| 09/21/2011 | CN101816221B Circuit connecting material, circuit connection structure, and method for producing the same |
| 09/21/2011 | CN101754585B Method for manufacturing conductive circuit |
| 09/21/2011 | CN101685028B Connector assembly and meter employing the same |
| 09/21/2011 | CN101662894B Encapsulating base plate and encapsulating structure |
| 09/21/2011 | CN101646308B Circuit compensation system of circuit board and method for circuit compensation thereby |
| 09/21/2011 | CN101600294B Anisotropic conducting film and circuit board using same |
| 09/21/2011 | CN101557682B Method for manufacturing electronic component supporting plate |
| 09/21/2011 | CN101505576B Manufacturing method for multilayered rigidity and flexibility combined printed circuit board |
| 09/21/2011 | CN101496457B Inspection method, inspection processing system, processing device therein, and inspection device therein |
| 09/21/2011 | CN101472399B Inner buried type circuit board and method for producing the same |
| 09/21/2011 | CN101360397B Manufacturing method of hollowed-out PCB |
| 09/21/2011 | CN101312136B Solder ball printing device |
| 09/21/2011 | CN101310977B Screen printing device and screen printing method |
| 09/21/2011 | CN101296569B 印刷电路板及其制造方法 The method of manufacturing a printed circuit board and |
| 09/21/2011 | CN101230241B Adhesive for electrode connection and connecting method using it |
| 09/20/2011 | US8023284 Display modules and methods of fixing flexible circuit boards therein |
| 09/20/2011 | US8022551 Solder composition for electronic devices |
| 09/20/2011 | US8022533 Circuit apparatus provided with asperities on substrate surface |
| 09/20/2011 | US8021920 Method for producing a metal-ceramic substrate for electric circuits on modules |
| 09/20/2011 | US8021748 Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same |
| 09/20/2011 | US8021712 Wafer and manufacturing method of electronic component |
| 09/20/2011 | US8020599 Common carrier |
| 09/20/2011 | US8020291 Method of manufacturing a printed wiring board |
| 09/20/2011 | US8020289 Method of producing electronic device |
| 09/20/2011 | US8020288 Method for producing an electronic subassembly |
| 09/20/2011 | US8020287 Changing method for separation facilitation head in chip mounting apparatus |
| 09/20/2011 | US8020286 Electronic component mounting system and electronic component mounting method |
| 09/20/2011 | US8020285 Method of adjusting at least one optional setting of a process characteristic of a component placement device, as well as a component placement device and an electronic key |
| 09/20/2011 | US8020264 Method of manufacturing a piezoelectric vibrator |
| 09/15/2011 | WO2011112707A2 Attachment of a device to a substrate for operation under variable conditions |
| 09/15/2011 | WO2011112409A2 Wiring substrate with customization layers |
| 09/15/2011 | WO2011111847A1 Resin composition |
| 09/15/2011 | WO2011111826A1 Mold release film and method for manufacturing mold release film |
| 09/15/2011 | WO2011111737A1 Multilayer wiring substrate structure equipped with power source and ground pair lines |
| 09/15/2011 | WO2011111605A1 Inductive coupling structure, multi-layer transmission-line plate, method of manufacturing inductive coupling structure, and method of manufacturing multi-layer transmission-line plate |
| 09/15/2011 | WO2011111471A1 Composition for film, and adhesive film and cover lay film formed therefrom |