| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/04/2011 | DE102010001473A1 Vorrichtung zum Herstellen von mit einer Kunststoffmasse umspritzten Bauteilen und umspritztes Bauteil Apparatus for producing molded with a plastic material components and overmolded component |
| 08/04/2011 | DE102009057260A1 Relief-Steckverbinder und Multilayerplatine Relief Connectors and multilayer board |
| 08/03/2011 | EP2351872A1 Treatment method using plasma |
| 08/03/2011 | EP2351472A1 Improvements relating to additive manufacturing processes |
| 08/03/2011 | EP2351471A1 Kit for preparing a conductive pattern |
| 08/03/2011 | EP2351470A2 Screen printing apparatus and method |
| 08/03/2011 | EP1894454B1 Transmission line |
| 08/03/2011 | EP1706789B1 Photographic materials having improved keeping properties |
| 08/03/2011 | EP1671182B1 Spin-printing of electronic and display components |
| 08/03/2011 | CN201919271U 可快速组装定位的扣接装置 Can be quickly assembled positioning fastening device |
| 08/03/2011 | CN201919248U 拼阴阳板夹具 Fight yin and yang board fixture |
| 08/03/2011 | CN201919247U Non-destructive welding device for miniature PCB (printed circuit board) devices |
| 08/03/2011 | CN201919246U 过孔塞油装置 Through-hole plug oil installations |
| 08/03/2011 | CN201919245U 一种触摸屏fpc引线丝印导电胶治具 A touch-screen printing conductive plastic fpc lead jigs |
| 08/03/2011 | CN201919244U 线路板支持装置 Board support devices |
| 08/03/2011 | CN201919243U 挂钉对位装置 Pegs alignment device |
| 08/03/2011 | CN201919241U 供检测锡膏扩散程度的焊垫及钢板的配合结构 Paste mating structure for detecting the degree of diffusion of pads and steel |
| 08/03/2011 | CN201918371U Bga返修台光学对位贴装装置 Bga rework station Optical alignment mount devices |
| 08/03/2011 | CN201918103U 一种敷铜板腐蚀设备 One kind of Bonded Copper corrosion of equipment |
| 08/03/2011 | CN201917777U PCB (Printed circuit board) turn board developing machine adopted by high-density interconnection circuit board technology |
| 08/03/2011 | CN201913344U 喷流焊槽 Jet solder bath |
| 08/03/2011 | CN1937909B Installation system and installation method |
| 08/03/2011 | CN1861842B Immersion method |
| 08/03/2011 | CN1768558B Surface treating method for wiring board and method for manufacturing electrical device |
| 08/03/2011 | CN1753600B Method for forming multi-layered structure, method for manufacturing wiring substrate, and method for manufacturing electronic apparatus |
| 08/03/2011 | CN102144435A Electronic part mounting device and work method using electronic part mounting device |
| 08/03/2011 | CN102144432A Electroconductive connecting material, method for connecting terminals to each other using the electroconductive connecting material, and method for manufacturing connecting terminal |
| 08/03/2011 | CN102144431A Device and connecting method |
| 08/03/2011 | CN102144189A Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern, conductive pattern, printed wiring board, lead frame, base, and method for manufacturing semiconductor package |
| 08/03/2011 | CN102144046A 2-benzyl-4-(3,4-dichlorophenyl)-5-methylimidazole compound |
| 08/03/2011 | CN102143815A Entry sheet for printed circuit board hole boring, water-soluble lubricating resin composition used with same and production method for same |
| 08/03/2011 | CN102143680A Component installation system |
| 08/03/2011 | CN102143662A Manufacturing method of multilayer printed circuit board and substrate holding piece and shield plate |
| 08/03/2011 | CN102143661A Multi-layered circuit board and manufacturing method thereof |
| 08/03/2011 | CN102143660A Half-hole machining process for printed circuit board |
| 08/03/2011 | CN102143659A Electromechanical or electronic element for surface mounting |
| 08/03/2011 | CN102143658A Mounting component, electronic device and mounting method |
| 08/03/2011 | CN102143657A Method for processing wireless gold-plating printed plate |
| 08/03/2011 | CN102143656A Manufacturing method of circuit board made of high-dielectric composite material |
| 08/03/2011 | CN102143654A Substrate for mounting element and process for its production |
| 08/03/2011 | CN102143652A Circuit board |
| 08/03/2011 | CN102143651A Inner layer buried hole structure for multi-layer high density interconnected printed circuit board |
| 08/03/2011 | CN102143649A PCB board with heat radiation structure and processing method thereof |
| 08/03/2011 | CN102143648A Flexible printed circuit sheet with shielding layer, manufacturing method and electronic device thereof |
| 08/03/2011 | CN102143647A Circuit board and manufacturing method thereof |
| 08/03/2011 | CN102139412A Laser welding method |
| 08/03/2011 | CN101689716B Anisotropic conductive film, joined structure and method for producing the same |
| 08/03/2011 | CN101669410B Conductive paste composition for via hole filling, printed board using the same, and method for manufacturing the printed board |
| 08/03/2011 | CN101646300B Printed wiring board and printed circuit board |
| 08/03/2011 | CN101570873B System and method for electrolytic plating |
| 08/03/2011 | CN101488466B Fabrication method of semiconductor integrated circuit device |
| 08/03/2011 | CN101471323B Multilayer printed wiring board |
| 08/03/2011 | CN101183217B Photosensitive composition |
| 08/03/2011 | CN101160026B Primer, conductor foil with resin, laminate and process for producing the laminate |
| 08/03/2011 | CN101142252B (meth)acryloyl group-containing aromatic isocyanate compound and production process thereof |
| 08/03/2011 | CN101027948B Electronics module and method for manufacturing the same |
| 08/02/2011 | US7989945 Spring connector for making electrical contact at semiconductor scales |
| 08/02/2011 | US7989929 Direct-connect signaling system |
| 08/02/2011 | US7989708 Multi-layer wiring board |
| 08/02/2011 | US7989706 Circuit board with embedded component and method of manufacturing same |
| 08/02/2011 | US7989272 Composition of carbon nitride, thin film transistor with the composition of carbon nitride, display device with the thin film transistor, and manufacturing method thereof |
| 08/02/2011 | US7989080 Method and apparatus for providing hermetic electrical feedthrough |
| 08/02/2011 | US7987590 Method for manufacturing an electronic part |
| 08/02/2011 | US7987589 Multilayer three-dimensional circuit structure and manufacturing method thereof |
| 08/02/2011 | US7987588 Interposer for connecting plurality of chips and method for manufacturing the same |
| 08/02/2011 | US7987587 Method of forming solid vias in a printed circuit board |
| 08/02/2011 | US7987586 Method for manufacturing printed circuit board having different thicknesses in different areas |
| 08/02/2011 | CA2511147C Spark gap apparatus and method for electrostatic discharge protection |
| 08/02/2011 | CA2397984C Composite copper foil and manufacturing method thereof |
| 07/28/2011 | WO2011090153A1 Copper surface treatment agent |
| 07/28/2011 | WO2011090103A1 Electron-beam-curable electrically conductive paste and process for production of circuit board using same |
| 07/28/2011 | WO2011090049A1 Flip-chip mounting structure and flip-chip mounting method |
| 07/28/2011 | WO2011090031A1 Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board |
| 07/28/2011 | WO2011089936A1 Substrate with built-in functional element, and wiring substrate |
| 07/28/2011 | WO2011089930A1 Method for producing copper clad laminate, copper foil used therein, and laminating apparatus for copper clad laminate |
| 07/28/2011 | WO2011089863A1 Heating device and production method for mounted body |
| 07/28/2011 | WO2011089862A1 Mounted body production method and mounting device |
| 07/28/2011 | WO2011089795A1 Wiring board and manufacturing method for same |
| 07/28/2011 | WO2011089770A1 Processing method and processing device for semiconductor element |
| 07/28/2011 | WO2011089747A1 Electronic module and communication equipment |
| 07/28/2011 | WO2011089657A1 Inspection device |
| 07/28/2011 | WO2011089009A1 Method for the application of a conformal nanocoating by means of a low pressure plasma process |
| 07/28/2011 | WO2011088955A1 Method and device for structuring a layer arranged on a substrate |
| 07/28/2011 | WO2011088950A1 Epoxy resin composition and surface mounting device coated with said composition |
| 07/28/2011 | WO2011088812A1 Method for producing flexible electronics, flexible printed circuit boards, self‑healing lithium‑polymer rechargeable batteries and flexible antennas |
| 07/28/2011 | WO2011088489A1 Method for producing a rigid-flexible circuit board |
| 07/28/2011 | US20110184569 Viscous material noncontact jetting system |
| 07/28/2011 | US20110183162 Surface Mountable PPTC Device with Integral Weld Plate |
| 07/28/2011 | US20110182046 Electronic circuit device, method for manufacturing the same, and display device |
| 07/28/2011 | US20110182043 Control unit for personal protection device for a vehicle and method for assembling such a control unit |
| 07/28/2011 | US20110181550 Pet-based touch pad |
| 07/28/2011 | US20110180930 Wiring board, manufacturing method of the wiring board, and semiconductor package |
| 07/28/2011 | US20110180309 INTERCONNECT STRUCTURE EMPLOYING A Mn-GROUP VIIIB ALLOY LINER |
| 07/28/2011 | US20110180307 Flex-rigid wiring board and method for manufacturing the same |
| 07/28/2011 | US20110180306 Flex-rigid wiring board and method for manufacturing the same |
| 07/28/2011 | US20110180208 Method for laminating prepreg, method for producing printed wiring board and prepreg roll |
| 07/28/2011 | US20110179642 Chip capacitor embedment method |
| 07/28/2011 | US20110179641 Printed article |
| 07/28/2011 | DE10228058B4 Hochfrequenzmodul RF module |
| 07/28/2011 | DE102010005340A1 Verfahren und Vorrichtung zur Strukturierung einer auf einem Substrat angeordneten Lage Method and apparatus for patterning a substrate layer disposed on a |