Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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08/31/2011 | EP2362449A2 Electrode structure for a light emitting device and corresponding light emitting device package |
08/31/2011 | EP2362416A2 Multi-die module and method thereof |
08/31/2011 | EP2361762A1 Method for producing laminate, and laminate |
08/31/2011 | CN201957347U 一种刚挠结合的多层印刷电路板的层压用模具 One kind of multilayer rigid-flex printed circuit board laminate mold |
08/31/2011 | CN201957346U 带同步加热装置的pcb芯片返修设备 Pcb chip rework equipment with a heating device synchronization |
08/31/2011 | CN201957345U Smt印刷贴片过炉载具 Smt printed patch over the stove carrier |
08/31/2011 | CN201957344U Automatic pressing device for fixing circuit board cooling fin |
08/31/2011 | CN201957343U 一种软性线路板弹片安装定位模具 A soft board shrapnel installation jig |
08/31/2011 | CN201957342U 一种新型的印制线路板打字码机 A new printed circuit board type code machine |
08/31/2011 | CN201955690U 一种回流焊机温度控制系统 One kind reflow temperature control system |
08/31/2011 | CN201952517U 柔性电路板的电镀挂具 Flexible circuit board plating rack |
08/31/2011 | CN201950328U Pcb焊线治具 Pcb wire bonders Fixture |
08/31/2011 | CN201950327U 波峰焊接载具 Carrier wave soldering |
08/31/2011 | CN201950324U 热能循环利用回流焊机 Thermal recycling reflow machine |
08/31/2011 | CN201950318U 可调波峰宽度的波峰发生器 Adjustable peak width of peak generator |
08/31/2011 | CN1836295B Insulation-coated electroconductive particles, its preparation method and anisotropic conductive adhesive |
08/31/2011 | CN1806476B Production method for electronic component and electronic component |
08/31/2011 | CN102172113A Electronic component mounting system and electronic component mounting method |
08/31/2011 | CN102172112A 电子元件安装系统 An electronic component mounting system |
08/31/2011 | CN102172111A Electronic component mounting system and electronic component mounting method |
08/31/2011 | CN102172108A Method for treating the surface of a planar object, planar object and use |
08/31/2011 | CN102171382A 2-benzyl-4-(2,4-dichlorophenyl)-5-methylimidazole compound |
08/31/2011 | CN102171306A Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive |
08/31/2011 | CN102170994A Flux composition and soldering paste composition |
08/31/2011 | CN102170759A Method for processing blind buried hole on multilayer circuit board |
08/31/2011 | CN102170758A Circuit board double window resistance welding hole filling processing method and resistance welding exposure film |
08/31/2011 | CN102170757A Method of forming circuit interconnection, circuit board, and circuit interconnection film having film thickness larger than width thereof |
08/31/2011 | CN102170756A Circuit board resin film evener and using method thereof |
08/31/2011 | CN102170755A Process for producing ceramic mobile phone circuit board |
08/31/2011 | CN102170754A Method for manufacturing circuit board with superouter fitting |
08/31/2011 | CN102170752A Printed wiring board |
08/31/2011 | CN102170748A Attaching type flexible circuit board, manufacturing method thereof and strip light with attaching type flexible circuit board |
08/31/2011 | CN102170747A Extruded-type flexible circuit board, manufacturing method thereof and strip lamp with extruded-type flexible circuit board |
08/31/2011 | CN102170745A Multilayered wiring board and method of manufacturing the same |
08/31/2011 | CN102168844A LED lamp panel using printed circuit and production method thereof |
08/31/2011 | CN102167964A Circuit connecting material, connecting structure for circuit parts and connecting method for circuit parts |
08/31/2011 | CN102166573A Device for immersion tin wire post-treatment of circuit board |
08/31/2011 | CN101632199B Circuit-connecting material, and connection structure for circuit member |
08/31/2011 | CN101604636B Method for manufacturng multi-layer ceramic substrate and electronic device using the same |
08/31/2011 | CN101587996B Surface pasting connection needle, surface pasting connector, circuit board and making method thereof |
08/31/2011 | CN101573022B Heat-dissipation structure in closed box body and machining method thereof |
08/31/2011 | CN101553086B Circuit board device and method of interconnecting wiring boards |
08/31/2011 | CN101547565B Guidance tool of circuit board |
08/31/2011 | CN101288168B 印刷线路板 Printed circuit boards |
08/31/2011 | CN101262035B LED structure and its assembly method |
08/30/2011 | US8008607 Methods of forming a variable watt density layered heater |
08/30/2011 | US8008130 Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board |
08/30/2011 | US8007649 Imparting wettability to one side of polyimide film molding; spraying aqueous ethanol onto surface, drying and applying plasma treatment |
08/30/2011 | US8007627 Electronic component mounting method and apparatus |
08/30/2011 | US8006377 Method for producing a printed wiring board |
08/30/2011 | US8006376 Method for assembly of an LED light |
08/25/2011 | WO2011102800A1 Method for printing product features on a substrate sheet |
08/25/2011 | WO2011102561A1 Multilayer printed circuit board and manufacturing method therefor |
08/25/2011 | WO2011102535A1 Ceramic substrate, electrical circuit module, and method for producing each |
08/25/2011 | WO2011102238A1 Method of forming circuits upon flexible laminate substrate |
08/25/2011 | WO2011102194A1 Composite printed wiring board and wireless communication system |
08/25/2011 | WO2011102134A1 Component-embedded substrate |
08/25/2011 | WO2011102133A1 Component-embedded substrate |
08/25/2011 | WO2011102101A1 Stacked semiconductor device |
08/25/2011 | WO2011102100A1 Semiconductor device and stacked-type semiconductor device |
08/25/2011 | WO2011102040A1 Substrate for mounting element, and method for manufacturing the substrate |
08/25/2011 | WO2011101777A1 Composition for printing a seed layer and process for producing conductor tracks |
08/25/2011 | WO2010109430A3 Apparatus and method for manufacturing an integrated circuit |
08/25/2011 | US20110207266 Printed circuit board (pcb) including a wire pattern, semiconductor package including the pcb, electrical and electronic apparatus including the semiconductor package, method of fabricating the pcb, and method of fabricating the semiconductor package |
08/25/2011 | US20110206910 Wiring substrate and method for manufacturing the same, and method for disassembling wiring substrate |
08/25/2011 | US20110206888 Composite Ceramic Structure and Method of Making the Same |
08/25/2011 | US20110205715 Transmission line circuit having pairs of crossing conductive lines |
08/25/2011 | US20110204917 Configurable memory sheet and package assembly |
08/25/2011 | US20110204912 Test apparatus having a probe core with a twist lock mechanism |
08/25/2011 | US20110204910 Method and apparatus for testing electrical connections on a printed circuit board |
08/25/2011 | US20110204780 Modular LED Lamp and Manufacturing Methods |
08/25/2011 | US20110204779 Illumination Source and Manufacturing Methods |
08/25/2011 | US20110204147 Smartcard interconnect |
08/25/2011 | US20110204019 Method of making a planar electrode |
08/25/2011 | US20110203924 Assay Plates, Reader Systems and Methods for Luminescence Test Measurements |
08/25/2011 | US20110203840 Test point design for a high speed bus |
08/25/2011 | US20110203839 Wiring substrate and method for manufacturing the same |
08/25/2011 | US20110203837 Flex-rigid wiring board and method for manufacturing the same |
08/25/2011 | US20110203836 Printed wiring board and method for manufacturing same |
08/25/2011 | US20110203331 Locking device with embedded circuit board |
08/25/2011 | US20110203107 Method for integrating an electronic component into a printed circuit board |
08/25/2011 | DE102010047646A1 Harz versiegelte elektronische Steuervorrichtung und Verfahren zur Herstellung derselben A resin sealed electronic control apparatus and method for producing same |
08/25/2011 | DE102010046930A1 Activated resin composition, useful for surface mounting, comprises an epoxy resin, a carboxylic acid compound, a curing agent and a solvent |
08/25/2011 | DE102010038246A1 Oberflächenmontierbares drahtloses Package mit offenem Hohlraum für Hochleistungs-HF-Anwendungen Surface-mountable package with an open cavity for wireless high power RF applications |
08/25/2011 | DE102010008876A1 Lichtquelle mit Array-LEDs zum direkten Betrieb am Wechselspannungsnetz Light source array LEDs for direct operation on AC power |
08/25/2011 | DE102010002150A1 Lötmaske für Wellenlötverfahren und Verfahren zum Selektivlöten einzelner Bauteile einer Leiterplatte in einem Wellenlöt-Automaten Solder mask for wave soldering and method for selective soldering of individual components of a circuit board in a wave soldering machine |
08/24/2011 | EP2361005A1 Circuit module |
08/24/2011 | EP2361001A1 Soldering mask for wave soldering and method for selective soldering of individual components of a circuit board in a wave soldering machine |
08/24/2011 | EP2361000A1 Leadless chip package mounting method and carrier |
08/24/2011 | EP2360999A1 Structure of conductive holes of multilayer board and manufacturing method thereof |
08/24/2011 | EP2360661A1 Circuit substrate, display panel, and display device |
08/24/2011 | EP2360294A1 Method for metallising objects with at least two different plastics on their surface |
08/24/2011 | EP2360013A1 Protective film for electronic component, manufacturing method therefor, and use thereof |
08/24/2011 | EP2160932B1 Restraining a connecting material |
08/24/2011 | EP1592053B1 Wiring fabricating method |
08/24/2011 | EP1240668B1 Method and apparatus for encoding information in an ic package |
08/24/2011 | CN201947553U 一种pcb层间对准度检测辅助结构 An inter-layer alignment detection pcb auxiliary structure |
08/24/2011 | CN201947552U 软Pin支撑治具 Soft Pin support fixture |
08/24/2011 | CN201947551U 一种pcb板支撑垫块治具 One kind pcb board support pad fixture |
08/24/2011 | CN201947550U 一种小型pcb快速腐蚀池 A small pcb rapid corrosion of pool |